SLVSHN0A September   2024  – October 2025 TPS548B23

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  D-CAP4 Control
      2. 6.3.2  Internal VCC LDO and Using External Bias On the VCC Pin
        1. 6.3.2.1 Powering the Device From a Single Bus
        2. 6.3.2.2 Powering the Device From a Split-Rail Configuration
      3. 6.3.3  Multifunction Configuration (CFG1-5) Pins
        1. 6.3.3.1 Multifunction Configuration (CFG1-2) Pins (Internal Feedback)
        2. 6.3.3.2 Multifunction Configuration (CFG1-2) Pins (External Feedback)
        3. 6.3.3.3 Multifunction Configuration (CFG3-5) Pins
      4. 6.3.4  Enable
      5. 6.3.5  Soft Start
      6. 6.3.6  Power Good
      7. 6.3.7  Overvoltage and Undervoltage Protection
      8. 6.3.8  Output Voltage Setting (External Feedback Configuration)
      9. 6.3.9  Remote Sense
      10. 6.3.10 Low-side MOSFET Zero-Crossing
      11. 6.3.11 Current Sense and Positive Overcurrent Protection
      12. 6.3.12 Low-side MOSFET Negative Current Limit
      13. 6.3.13 Output Voltage Discharge
      14. 6.3.14 UVLO Protection
      15. 6.3.15 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Auto-Skip (PFM) Eco-mode Light Load Operation
      2. 6.4.2 Forced Continuous-Conduction Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Voltage Setting Point
        2. 7.2.2.2 Choose the Switching Frequency
        3. 7.2.2.3 Choose the Inductor
        4. 7.2.2.4 Choose the Output Capacitor
        5. 7.2.2.5 Choose the Input Capacitors (CIN)
        6. 7.2.2.6 VCC Bypass Capacitor
        7. 7.2.2.7 BOOT Capacitor
        8. 7.2.2.8 PG Pullup Resistor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS548B23 UNIT
VAN (WQFN-HR, JEDEC LAYOUT) VAN (WQFN-HR, APPLICATION LAYOUT, 6-LAYER PCB)
19 PINS 19 PINS
RθJA Junction-to-ambient thermal resistance 59 19.0(2) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36 Not applicable (3) °C/W
RθJB Junction-to-board thermal resistance 13.6 Not applicable (3) °C/W
ψJT Junction-to-top characterization parameter 1.9 Not applicable (3) °C/W
ψJB Junction-to-board characterization parameter 13.5 Not applicable (3) °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a Not applicable (3) °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Measured on TPS548B23EVM with 1.0W dissipated in the device.
(3) The thermal test or simulation setup is not applicable to an application layout.