SNVSAU8A June   2017  – February 2024 TPS549B22

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 25-A FET
      2. 6.3.2 On-Resistance
      3. 6.3.3 Package Size, Efficiency and Thermal Performance
      4. 6.3.4 Soft-Start Operation
      5. 6.3.5 VDD Supply Undervoltage Lockout (UVLO) Protection
      6. 6.3.6 EN_UVLO Pin Functionality
      7. 6.3.7 Fault Protections
        1. 6.3.7.1 Current Limit (ILIM) Functionality
        2. 6.3.7.2 VDD Undervoltage Lockout (UVLO)
        3. 6.3.7.3 Overvoltage Protection (OVP) and Undervoltage Protection (UVP)
        4. 6.3.7.4 Out-of-Bounds Operation
        5. 6.3.7.5 Overtemperature Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 D-CAP3™ Control Mode Topology
      2. 6.4.2 DCAP Control Topology
    5. 6.5 Programming
      1. 6.5.1 Programmable Pin-Strap Settings
        1. 6.5.1.1 Address Selection (ADDR) Pin
        2. 6.5.1.2 VSEL Pin
        3. 6.5.1.3 D-CAP3™ Control Mode Selection
        4. 6.5.1.4 Application Workaround to Support 4-ms and 8-ms SS Settings
      2. 6.5.2 Programmable Analog Configurations
        1. 6.5.2.1 RSP/RSN Remote Sensing Functionality
          1. 6.5.2.1.1 Output Differential Remote Sensing Amplifier
        2. 6.5.2.2 Power Good (PGOOD Pin) Functionality
      3. 6.5.3 PMBus Programming
        1. 6.5.3.1 TPS549B22 Limitations to the PMBUS Specifications
        2. 6.5.3.2 Target Address Assignment
        3. 6.5.3.3 PMBUS Address Selection
        4. 6.5.3.4 Supported Formats
          1. 6.5.3.4.1 Direct Format — Write
          2. 6.5.3.4.2 Combined Format — Read
        5. 6.5.3.5 Stop Separated Reads
        6. 6.5.3.6 Supported PMBUS Commands and Registers
  8. 7 Register Maps
    1. 7.1  OPERATION Register (address = 1h)
    2. 7.2  ON_OFF_CONFIG Register (address = 2h)
    3. 7.3  CLEAR FAULTS (address = 3h)
    4. 7.4  WRITE PROTECT (address = 10h)
    5. 7.5  STORE_DEFAULT_ALL (address = 11h)
    6. 7.6  RESTORE_DEFAULT_ALL (address = 12h)
    7. 7.7  CAPABILITY (address = 19h)
    8. 7.8  VOUT_MODE (address = 20h)
    9. 7.9  VOUT_COMMAND (address = 21h)
    10. 7.10 VOUT_MARGIN_HIGH (address = 25h) ®
    11. 7.11 VOUT_MARGIN_LOW (address = 26h)
    12. 7.12 STATUS_BYTE (address = 78h)
    13. 7.13 STATUS_WORD (High Byte) (address = 79h)
    14. 7.14 STATUS_VOUT (address = 7Ah)
    15. 7.15 STATUS_IOUT (address = 7Bh)
    16. 7.16 STATUS_CML (address = 7Eh)
    17. 7.17 MFR_SPECIFIC_00 (address = D0h)
    18. 7.18 MFR_SPECIFIC_01 (address = D1h)
    19. 7.19 MFR_SPECIFIC_02 (address = D2h)
    20. 7.20 MFR_SPECIFIC_03 (address = D3h)
    21. 7.21 MFR_SPECIFIC_04 (address = D4h)
    22. 7.22 MFR_SPECIFIC_06 (address = D6h)
    23. 7.23 MFR_SPECIFIC_07 (address = D7h)
    24. 7.24 MFR_SPECIFIC_44 (address = FCh)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS549B22 1.5-V to 18-V Input, 1-V Output, 25-A Converter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1  Custom Design With WEBENCH® Tools
        2. 8.2.3.2  Switching Frequency Selection
        3. 8.2.3.3  Inductor Selection
        4. 8.2.3.4  Output Capacitor Selection
          1. 8.2.3.4.1 Minimum Output Capacitance to Make Sure of Stability
          2. 8.2.3.4.2 Response to a Load Transient
          3. 8.2.3.4.3 Output Voltage Ripple
        5. 8.2.3.5  Input Capacitor Selection
        6. 8.2.3.6  Bootstrap Capacitor Selection
        7. 8.2.3.7  BP Pin
        8. 8.2.3.8  R-C Snubber and VIN Pin High-Frequency Bypass
        9. 8.2.3.9  Optimize Reference Voltage (VSEL)
        10. 8.2.3.10 MODE Pin Selection
        11. 8.2.3.11 ADDR Pin Selection
        12. 8.2.3.12 Overcurrent Limit Design
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
      3. 8.4.3 Mounting and Thermal Profile Recommendation
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RVF|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.3 Mounting and Thermal Profile Recommendation

Proper mounting technique adequately covers the exposed thermal tab with solder. Excessive heat during the reflow process can affect electrical performance. Figure 8-16 shows the recommended reflow oven thermal profile. Proper post-assembly cleaning is also critical to device performance. See

QFN/SON PCB Attachment for more information.

GUID-1D7B04FE-28A2-410A-A925-ADF1374FB256-low.gifFigure 8-16 Recommended Reflow Oven Thermal Profile
Table 8-4 Recommended Thermal Profile Parameters
PARAMETERMINTYPMAXUNIT
RAMP UP AND RAMP DOWN
rRAMP(up)Average ramp-up rate, TS(max) to TP3°C/s
rRAMP(down)Average ramp-down rate, TP to TS(max)6°C/s
PRE-HEAT
TSPre-heat temperature150200°C
tSPre-heat time, TS(min) to TS(max)60180s
REFLOW
TLLiquids temperature217°C
TPPeak temperature260°C
tLTime maintained above liquidus temperature, TL60150s
tPTime maintained within 5°C of peak temperature, TP2040s
t25PTotal time from 25°C to peak temperature, TP480s