SPRADA9C
August 2024 – October 2025
AM62P
,
AM62P-Q1
1
ABSTRACT
Trademarks
1
Introduction
1.1
Before Getting Started With the Custom Board Design
1.2
Processor-Specific SDK
1.3
Peripheral Circuit Implementation - Compatibility Between Processor Families
1.4
Selection of Required Processor OPN (Orderable Part Number)
1.4.1
Processor Support for Secure Boot and Functional Safety
1.5
Technical Documentation
1.5.1
Updated SK Schematic With Design, Review and Cad Notes Added
1.5.2
Collaterals on TI.com, Processor Product Page
1.5.3
Schematic Design Guidelines and Schematic Review Checklist - Processor Family Specific User's Guide
1.5.4
Updates to Hardware Design Considerations User's Guide
1.5.5
Processor and Peripherals Related FAQs to Support Custom Board Designs
1.6
Custom Board Design Documentation
1.7
Processor and Processor Peripherals Design Related Queries During Custom Board Design
2
Custom Board Design Block Diagram
2.1
Developing the Custom Board Design Block Diagram
2.2
Configuring the Boot Mode
2.3
Configuring the Processor Pins Functionality (PinMux Configuration)
3
Power Supply
3.1
Power Supply Architecture
3.1.1
Integrated Power Architecture
3.1.2
Discrete Power Architecture
3.2
Processor Supply (Power) Rails (Operating Voltage)
3.2.1
Supported Low-Power Modes
3.2.1.1
Partial IO Support for CAN/GPIO/UART Wakeup
3.2.2
Core Power Supply
3.2.3
Peripherals Power Supply
3.2.4
Dual-Voltage IO Supply for IO Group (Processor) Power Supply
3.2.5
Dynamic Voltage Switching Dual-Voltage Power Supply
3.2.6
VPP (eFuse ROM Programming) Power Supply
3.2.7
Internal LDOs for IO Supply for IO Groups (Processor)
3.3
Power Supply Filtering
3.4
Power Supply Decoupling and Bulk Capacitors
3.4.1
Note on PDN Target Impedance
3.5
Power Supply Sequencing
3.6
Power Supply Diagnostics (Using Processor Supported External Input Voltage Monitors)
3.7
Power Supply Diagnostics (Monitoring Using External Monitoring Circuit (Devices))
3.8
Custom Board Current Requirements Estimation and Supply Sizing
4
Processor Clock (Input and Output)
4.1
Processor Clocking (External Crystal or External Oscillator)
4.1.1
WKUP_LFOSC0 Connection When Unused
4.1.2
MCU_OSC0 and WKUP_LFOSC0, Crystal Selection
4.1.3
LVCMOS Compatible Digital Clock Input Source
4.2
Processor Clock Outputs
4.2.1
Observation Clock Outputs
4.3
Clock Tree Tool
5
JTAG (Joint Test Action Group)
5.1
JTAG / Emulation
5.1.1
Configuration of JTAG / Emulation
5.1.1.1
BSDL File
5.1.2
Implementation of JTAG / Emulation
5.1.3
Connection Recommendations for JTAG Interface Signals
5.1.4
Debug Boot Modes and Boundary Scan Compliance
6
Configuration (Processor) and Initialization (Processor and Device)
6.1
Processor Reset
6.2
Latching of Processor Boot Mode Configuration Inputs
6.3
Resetting of the Attached Device
6.4
Watchdog Timer
7
Processor - Peripherals Connection
7.1
Supported Processor Cores and MCU Cores
7.2
Selecting Peripherals Across Domains
7.3
Memory Controller (DDRSS)
7.3.1
Processor DDR Subsystem and Device Register Configuration
7.3.2
Calibration Resistor Connection for DDRSS
7.3.3
Attached Memory Device ZQ and Reset_N (Memory Device Reset) Connection
7.4
Media and Data Storage Interfaces (MMC0, MMC1, MMC2, OSPI0/QSPI0 and GPMC0)
7.5
Ethernet Interface
7.5.1
Common Platform Ethernet Switch 3-port Gigabit (CPSW3G0)
7.6
Programmable Real-Time Unit Subsystem (PRUSS)
7.7
Universal Serial Bus (USB) Subsystem
7.8
General Connectivity Peripherals
7.8.1
Inter-Integrated Circuit (I2C) Interface
7.9
Display Subsystem (DSS)
7.10
CSI-Rx (Camera Serial interface)
7.11
Real-Time Clock (RTC) Module
7.12
Connection of Processor Power Supply Pins, IOs and Peripherals When not Used
7.12.1
External Interrupt (EXTINTn)
7.12.2
RSVD Reserved Pins (Signals)
7.13
SK Specific Circuit Implementation (Reuse)
8
Interfacing of Processor IOs (LVCMOS or SDIO or Open-Drain, Fail-Safe Type IO Buffers) and Performing Simulations
8.1
IBIS Model
8.2
IBIS-AMI Model
9
Processor Current Draw and Thermal Analysis
9.1
Power Estimation
9.2
Maximum Current Rating for Different Supply Rails
9.3
Supported Power Modes
9.4
Thermal Design Guidelines
9.4.1
Thermal Model
9.4.2
Voltage Thermal Management Module (VTM)
10
Schematic:- Capture, Entry and Review
10.1
Custom Board Design Passive Components and Values Selection
10.2
Custom Board Design Electronic Computer Aided Design (ECAD) Tools Considerations
10.3
Custom Board Design Schematic Capture
10.4
Custom Board Design Schematic Review
11
Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
11.1
Escape Routing for PCB Design
11.2
LPDDR4 Design and Layout Guidelines
11.3
High-Speed Differential Signal Routing Guidelines
11.4
Processor-Specific SK Board Layout
11.5
Custom Board Layer Count and Layer Stack-up
11.5.1
Simulation Recommendations
11.6
DDR-MARGIN-FW
11.7
Reference for Steps to be Followed for Running Board Simulation
11.8
Software Development Training (Academy) for Processors
12
Custom Board Assembly and Testing
12.1
Custom Board Bring-up Tips and Debug Guidelines
13
Processor (Device) Handling and Assembly
13.1
Processor (Device) Soldering Recommendations
13.1.1
Additional References
14
Terminology
15
References
15.1
Processor-Specific (AM62P, AM62P-Q1)
15.2
Common
16
Revision History
14
Terminology
BSDL
Boundary-Scan Description Language
CAN-FD
Controller Area Network Flexible Data-Rate
CPPI
Communications Port Programming Interface
CPSW3G
Common Platform Ethernet Switch 3-port Gigabit
CSIRX
Camera Streaming Interface Receiver
DPI
Display Parallel Interface
DRD
Dual-Role Device
DSI
Display Serial Interface
DSITX
Display Serial Interface transmitter
E2E
Engineer to Engineer
ECAD
Electronic Computer Aided Design
ECAP
Enhanced Capture
ECC
Error-Correcting Code
eMMC
embedded Multi-Media Card
EMU
Emulation Control
EPWM
Enhanced Pulse-Width Modulator
EQEP
Enhanced Quadrature Encoder Pulse
FAQ
Frequently Asked Question
GEMAC
Gigabit Ethernet Media Access Controller
GPIO
General Purpose Input/Output
GPMC
General-Purpose Memory Controller
HS-RTDX
High-Speed Real Time Data eXchange
I2C
Inter-Integrated Circuit
IBIS
Input/Output Buffer Information Specification
JTAG
Joint Test Action Group
LDO
Low-Dropout
LVCMOS
Low Voltage Complementary Metal Oxide Semiconductor
LVDS
Low Voltage Differential Signaling
MAC
Media Access Controller
MCAN
Modular Controller Area Network
MCASP
Multichannel Audio Serial Ports
MCSPI
Multichannel Serial Peripheral Interfaces
MCU
Micro Controller Unit
MMC
Multi-Media Card
MSL
Moisture Sensitivity Level
OLDI-SL
Open LVDS Display Interface - Single Link
OLDI-DL
Open LVDS Display Interface - Dual Link
OPP
Operating Performance Point
OSPI
Octal Serial Peripheral Interface
OTP
One-Time Programmable
PCB
Printed Circuit Board
PDN
Power Distribution Network
PMIC
Power Management Integrated Circuit
POR
Power-on Reset
QSPI
Quad Serial Peripheral Interface
RGMII
Reduced Gigabit Media Independent Interface
RMII
Reduced Media Independent Interface
SD
Secure Digital
SDIO
Secure Digital Input Output
SDK
Software Development Kit
SPI
Serial Peripheral Interface
TCK
Test Clock Input
TDI
Test Data Input
TDO
Test Data Output
TMS
Test Mode Select Input
TRM
Technical Reference Manual
TRSTn
Test Reset
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
VCA
Via Channel Array
WKUP
Wakeup
XDS
eXtended Development System