DLPS292 July   2025 DLPC8424 , DLPC8444 , DLPC8454

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Compatability Table
  6. 5 Pin Configuration and Functions
    1.     7
    2. 5.1  Initialization, Board Level Test, and Debug
    3. 5.2  V-by-One Interface Input Data and Control
    4. 5.3  FPD-Link Port(s) Input Data and Control
    5. 5.4  DSI Input Data and Clock (Not Supported in DLPC8424, DLPC8444, and DLPC8454)
    6. 5.5  DMD SubLVDS Interface
    7. 5.6  DMD Reset and Low-Speed Interfaces
    8. 5.7  Flash Interface
    9. 5.8  Peripheral Interfaces
    10. 5.9  GPIO Peripheral Interface
    11. 5.10 Clock and PLL Support
    12. 5.11 Power and Ground
    13. 5.12 I/O Type Subscript Definition
    14. 5.13 Internal Pullup and Pulldown Characteristics
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2.     23
    3. 6.2  ESD Ratings
    4. 6.3  Recommended Operating Conditions
    5. 6.4  Thermal Information
    6. 6.5  Power Electrical Characteristics
    7. 6.6  Pin Electrical Characteristics
    8. 6.7  DMD SubLVDS Interface Electrical Characteristics
    9.     30
    10. 6.8  DMD Low-Speed Interface Electrical Characteristics
    11.     32
    12. 6.9  V-by-One Interface Electrical Characteristics
    13. 6.10 FPD Link LVDS Electrical Characteristics
    14. 6.11 USB Electrical Characteristics
    15.     36
    16. 6.12 System Oscillator Timing Requirements
    17.     38
    18. 6.13 Power Supply and Reset Timing Requirements
    19.     40
    20. 6.14 V-by-One Interface General Timing Requirements
    21.     42
    22. 6.15 FPD Link Interface General Timing Requirements
    23. 6.16 Flash Interface Timing Requirements
    24.     45
    25. 6.17 Source Frame Timing Requirements
    26.     47
    27. 6.18 Synchronous Serial Port Interface Timing Requirements
    28.     49
    29. 6.19 I2C Interface Timing Requirements
    30. 6.20 Programmable Output Clock Timing Requirements
    31. 6.21 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    32.     53
    33. 6.22 DMD Low-Speed Interface Timing Requirements
    34.     55
    35. 6.23 DMD SubLVDS Interface Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Input Sources
      2. 7.3.2 V-by-One Interface
      3. 7.3.3 FPD-Link Interface
      4. 7.3.4 DMD (SubLVDS) Interface
      5. 7.3.5 Serial Flash Interface
      6. 7.3.6 GPIO Supported Functionality
        1.       67
        2.       68
      7. 7.3.7 Debug Support
  9. 8 Power Supply Recommendations
    1. 8.1 System Power-Up and Power-Down Sequence
    2. 8.2 DMD Fast Park Control (PARKZ)
    3. 8.3 Power Supply Management
    4. 8.4 Hotplug Usage
    5. 8.5 Power Supplies for Unused Input Source Interfaces
    6. 8.6 Power Supplies
      1. 8.6.1 Power Supplies DLPA3085 or DLPA3082
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Layout Guideline for DLPC8424 or DLPC8444 or DLPC8454 Reference Clock
        1. 9.1.1.1 Recommended Crystal Oscillator Configuration
      2. 9.1.2 V-by-One Interface Layout Considerations
      3. 9.1.3 DMD Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      4. 9.1.4 Power Supply Layout Guidelines
    2. 9.2 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Device Nomenclature
      1. 10.5.1 Device Markings
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
      1. 10.8.1 Video Timing Parameter Definitions
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2 Thermal Considerations

The underlying thermal requirement for the DLPC8424 or DLPC8444 or DLPC8454 is that the maximum operating junction temperature (TJ) should not be exceeded (defined in the Recommended Operating Conditions). This temperature is dependent on the operating ambient temperature, heatsink, airflow, PCB design (including the component layout density and the amount of copper used), the power dissipation of the DLPC8424 or DLPC8444 or DLPC8454, and the power dissipation of surrounding components. The DLPC8424 or DLPC8444 or DLPC8454’s package is designed to extract heat through the package heat slug to the heatsink, through the thermal balls, and through the power and ground planes of the PCB. Thus, heatsink, copper content, and airflow over the PCB are important factors.

The recommended maximum operating ambient temperature (TA) is provided primarily as a design target and is based on the maximum DLPC8424 or DLPC8444 or DLPC8454 power dissipation and RθJA at 0m/s, 1m/s, and 2m/s of forced airflow, where RθJA is the thermal resistance of the package as measured using the test board described in Layout Guidelines. This test PCB is not necessarily representative of the customer's PCB, and thus, the reported thermal resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best information available during the design phase to estimate thermal performance. TI highly recommends that once the host PCB is designed and built, the thermal performance be measured and validated.

To do this, measure the top center case temperature under the worst-case product scenario (max power dissipation, max voltage, max ambient temperature) and validate that the maximum recommended case temperature (TC) is not exceeded. This specification is based on the measured φJT for the DLPC8424 or DLPC8444 or DLPC8454 package and provides a relatively accurate correlation to junction temperature. Take care when measuring this case temperature to prevent accidental cooling of the package surface. TI recommends a small (approximately 40-gauge) thermocouple. Ensure that the bead and thermocouple wire contact the top of the package. Cover the bead and thermocouple wire with a minimal amount of thermally conductive epoxy. Route the wires closely along the package and the board surface to avoid cooling the bead through the wires.