DLPS292 July   2025 DLPC8424 , DLPC8444 , DLPC8454

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Compatability Table
  6. 5 Pin Configuration and Functions
    1.     7
    2. 5.1  Initialization, Board Level Test, and Debug
    3. 5.2  V-by-One Interface Input Data and Control
    4. 5.3  FPD-Link Port(s) Input Data and Control
    5. 5.4  DSI Input Data and Clock (Not Supported in DLPC8424, DLPC8444, and DLPC8454)
    6. 5.5  DMD SubLVDS Interface
    7. 5.6  DMD Reset and Low-Speed Interfaces
    8. 5.7  Flash Interface
    9. 5.8  Peripheral Interfaces
    10. 5.9  GPIO Peripheral Interface
    11. 5.10 Clock and PLL Support
    12. 5.11 Power and Ground
    13. 5.12 I/O Type Subscript Definition
    14. 5.13 Internal Pullup and Pulldown Characteristics
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2.     23
    3. 6.2  ESD Ratings
    4. 6.3  Recommended Operating Conditions
    5. 6.4  Thermal Information
    6. 6.5  Power Electrical Characteristics
    7. 6.6  Pin Electrical Characteristics
    8. 6.7  DMD SubLVDS Interface Electrical Characteristics
    9.     30
    10. 6.8  DMD Low-Speed Interface Electrical Characteristics
    11.     32
    12. 6.9  V-by-One Interface Electrical Characteristics
    13. 6.10 FPD Link LVDS Electrical Characteristics
    14. 6.11 USB Electrical Characteristics
    15.     36
    16. 6.12 System Oscillator Timing Requirements
    17.     38
    18. 6.13 Power Supply and Reset Timing Requirements
    19.     40
    20. 6.14 V-by-One Interface General Timing Requirements
    21.     42
    22. 6.15 FPD Link Interface General Timing Requirements
    23. 6.16 Flash Interface Timing Requirements
    24.     45
    25. 6.17 Source Frame Timing Requirements
    26.     47
    27. 6.18 Synchronous Serial Port Interface Timing Requirements
    28.     49
    29. 6.19 I2C Interface Timing Requirements
    30. 6.20 Programmable Output Clock Timing Requirements
    31. 6.21 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    32.     53
    33. 6.22 DMD Low-Speed Interface Timing Requirements
    34.     55
    35. 6.23 DMD SubLVDS Interface Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Input Sources
      2. 7.3.2 V-by-One Interface
      3. 7.3.3 FPD-Link Interface
      4. 7.3.4 DMD (SubLVDS) Interface
      5. 7.3.5 Serial Flash Interface
      6. 7.3.6 GPIO Supported Functionality
        1.       67
        2.       68
      7. 7.3.7 Debug Support
  9. 8 Power Supply Recommendations
    1. 8.1 System Power-Up and Power-Down Sequence
    2. 8.2 DMD Fast Park Control (PARKZ)
    3. 8.3 Power Supply Management
    4. 8.4 Hotplug Usage
    5. 8.5 Power Supplies for Unused Input Source Interfaces
    6. 8.6 Power Supplies
      1. 8.6.1 Power Supplies DLPA3085 or DLPA3082
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Layout Guideline for DLPC8424 or DLPC8444 or DLPC8454 Reference Clock
        1. 9.1.1.1 Recommended Crystal Oscillator Configuration
      2. 9.1.2 V-by-One Interface Layout Considerations
      3. 9.1.3 DMD Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      4. 9.1.4 Power Supply Layout Guidelines
    2. 9.2 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Device Nomenclature
      1. 10.5.1 Device Markings
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
      1. 10.8.1 Video Timing Parameter Definitions
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.1.2 V-by-One Interface Layout Considerations

The DLPC8424, DLPC8444, and DLPC8454 V-by-One SERDES differential interface waveform quality and timing are dependent on the total length of the interconnect system, the spacing between traces, the characteristic impedance, etch losses, and how well matched the lengths are across the interface. Thus, ensuring a positive timing margin requires attention to many factors.

DLPC8424, DLPC8444, and DLPC8454 I/O timing parameters, V-by-One transmitter timing parameters, as well as Thine specific timing requirements, can be found in the corresponding transmitter data sheets. PCB routing mismatch can be budgeted and met through controlled PCB routing. PCB-related requirements for V-by-One are provided in V-by-One Interface PBC Related Requirements as a starting point for the customer.

Table 9-4 V-by-One Interface PBC Related Requirements
PARAMETER(1)MINTYPMAXUNIT
Intralane cross-talk
(between VX1_DATAx_P and VX1_DATAx_N)		< 1.5mVpp
Interlane cross-talk
(between data lane pairs)		< 1.5mVpp
Cross-talk between data lanes and other signals< 1.5mVpp
Intralane skew< 40ps
Inter-lane skew< 800ps
Differential Impedance90100110Ω
(1) If using the minimum trace width and spacing to escape the controller ball field, widening these out after escape is desirable if practical to achieve the target 100Ω impedance (for example, to reduce transmission line losses).

Additional V-by-One layout guidelines:

  • Route the differential signal pairs on the top layer of the PBC to minimize the number of vias. Limit the number of necessary vias to two.
  • Route differential signal pairs over a single ground or power plane using a microstrip line configuration. Ground guard traces are also recommended.
  • Do not route the differential signal pairs over the slit of power or ground planes.
  • Minimize the trace length mismatch for each pair and between each pair to meet the skew requirements.
  • Ensure that the bend angles associated with the differential signal pairs are between 135° and 225° (see Figure 9-3).

DLPC8424 DLPC8444 DLPC8454 V-by-One Routing ExampleFigure 9-3 V-by-One Routing Example