SBASAW5 December   2025 ADS112C14 , ADS122C14

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Requirements
    7. 5.7 I2C Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Noise Performance
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs and Multiplexer
      2. 7.3.2  Programmable Gain Amplifier (PGA)
      3. 7.3.3  Voltage Reference
        1. 7.3.3.1 Internal Reference
        2. 7.3.3.2 External Reference
        3. 7.3.3.3 Reference Buffers
      4. 7.3.4  Clock Source
      5. 7.3.5  Delta-Sigma Modulator
      6. 7.3.6  Digital Filter
        1. 7.3.6.1 Sinc4 and Sinc4 + Sinc1 Filter
        2. 7.3.6.2 FIR Filter
        3. 7.3.6.3 Digital Filter Latency
        4. 7.3.6.4 Global-Chop Mode
      7. 7.3.7  Excitation Current Sources (IDACs)
      8. 7.3.8  Burn-Out Current Sources (BOCS)
      9. 7.3.9  General Purpose IOs (GPIOs)
        1. 7.3.9.1 FAULT Output
        2. 7.3.9.2 DRDY Output
      10. 7.3.10 System Monitors
        1. 7.3.10.1 Internal Short (Offset Calibration)
        2. 7.3.10.2 Internal Temperature Sensor
        3. 7.3.10.3 External Reference Voltage Readback
        4. 7.3.10.4 Power-Supply Readback
      11. 7.3.11 Monitors and Status Flags
        1. 7.3.11.1 Reset (RESETn flag)
        2. 7.3.11.2 AVDD Undervoltage Monitor (AVDD_UVn flag)
        3. 7.3.11.3 Reference Undervoltage Monitor (REV_UVn flag)
        4. 7.3.11.4 Register Map CRC Fault (REG_MAP_CRC_FAULTn flag)
        5. 7.3.11.5 Internal Memory Fault (MEM_FAULTn flag)
        6. 7.3.11.6 Register Write Fault (REG_WRITE_FAULTn flag)
        7. 7.3.11.7 DRDY Indicator (DRDY bit)
        8. 7.3.11.8 Conversion Counter (CONV_COUNT[3:0])
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-up and Reset
        1. 7.4.1.1 Power-On Reset (POR)
        2. 7.4.1.2 Reset by Register Write
        3. 7.4.1.3 I2C General Call Reset
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Idle and Standby Mode
        2. 7.4.2.2 Power-Down Mode
        3. 7.4.2.3 Power-Scalable Conversion Modes
          1. 7.4.2.3.1 Continuous-Conversion Mode
          2. 7.4.2.3.2 Single-shot Conversion Mode
    5. 7.5 Programming
      1. 7.5.1  I2C Interface
      2. 7.5.2  I2C Address
      3. 7.5.3  Serial Clock (SCL) and Serial Data (SDA)
      4. 7.5.4  I2C Bus Speed
      5. 7.5.5  I2C Data Transfer Protocol
      6. 7.5.6  I2C General Call (Software Reset)
      7. 7.5.7  I3C Compatibility
      8. 7.5.8  Commands
        1. 7.5.8.1 RDATA (0000 0000b)
        2. 7.5.8.2 RREG (0100 rrrrb)
        3. 7.5.8.3 WREG (1000 rrrrb)
      9. 7.5.9  STATUS Header
      10. 7.5.10 I2C CRC
      11. 7.5.11 Register Map CRC
      12. 7.5.12 Data Ready (DRDY) Pin
      13. 7.5.13 Monitoring for New Conversion Data
        1. 7.5.13.1 DRDY Pin Monitoring
        2. 7.5.13.2 Reading DRDY Bit and Conversion Counter
        3. 7.5.13.3 Clock Counting
      14. 7.5.14 Conversion Data Format
  9. Registers
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Connecting Multiple Devices on the Same I2C Bus
      3. 9.1.3 Unused Inputs and Outputs
      4. 9.1.4 Device Initialization
    2. 9.2 Typical Applications
      1. 9.2.1 Software-Configurable RTD Measurement Input
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Performance Plots
        4. 9.2.1.4 Design Variant – 3-Wire RTD Measurement With Automatic Lead-Wire Compensation Using Two IDACs
      2. 9.2.2 Thermocouple Measurement With Cold-Junction Compensation Using a 2-wire RTD
      3. 9.2.3 Resistive Bridge Sensor Measurement With Temperature Compensation
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supplies
      2. 9.3.2 Power-Supply Sequencing
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Detailed Design Procedure

The circuit in Figure 9-4 employs a ratiometric measurement configuration. In other words, the sensor signal (that is, the voltage across the RTD in this case) and the reference voltage for the ADC are derived from the same excitation source. Therefore, errors resulting from temperature drift or noise of the excitation source cancel because these errors are common to both the sensor signal and the reference.

To implement a ratiometric RTD measurement using the device, route IDAC1 to either AIN7 (for a 4-wire RTD connection) or to AIN6 (for 2- and 3-wire RTD connections) using the I1MUX[2:0] bits. Select the excitation current source value using the I1MAG[3:0] bits. The excitation current flows through the RTD and a precision, low-drift reference resistor, RREF to ground. The voltage, VREF, generated across the reference resistor (as shown in Equation 13) is used as the ADC reference voltage. For that purpose, select the external voltage reference between pins AIN4/REFP and AIN5/REFN using the REF_SEL[1:0]

Equation 13. VREF = IIDAC1 × RREF

To simplify the following discussion, the individual lead resistance values of the RTDs (RLEADx) are set to zero. As Equation 14 shows, IDAC1 excites the RTD to produce a voltage (VRTD) proportional to the temperature-dependent RTD value and the IDAC1 value.

Equation 14. VRTD = RRTD × IIDAC1

Select the analog inputs using the AINP[3:0] and AINN[3:0] bits to measure VRTD based on the RTD type:

  • For a 2-wire RTD, measure between AINP = AIN0 and AINN = AIN2.
  • For a 3- or 4-wire RTD, measure between AINP = AIN0 and AINN = AIN1.

The device internally amplifies the voltage across the RTD using the PGA and compares the resulting voltage against the reference voltage to produce a digital output code according to Equation 15.

Equation 15. Code / 2n = VRTD × Gain / VREF = (RRTD × IIDAC1 × Gain) / (IIDAC1 × RREF)
Equation 16. Code / 2n = (RRTD × Gain) / RREF

Where n depends on the selected coding scheme and the ADC resolution:

  • n = 15 (16bit ADC, binary two's complement format)
  • n = 16 (16bit ADC, unipolar straight binary format)
  • n = 23 (24bit ADC, binary two's complement format)
  • n = 24 (24bit ADC, unipolar straight binary format)

As shown in Equation 16, the output code only depends on the value of the RTD, the PGA gain, and the reference resistor (RREF), but not on the IDAC1 value. The absolute accuracy and temperature drift of the excitation current therefore does not matter. However, because the value of the reference resistor directly affects the measurement result, choosing a reference resistor with good initial accuracy and very low temperature coefficient is important to limit measurement errors introduced by RREF.

The reference resistor RREF not only serves to generate the reference voltage for the device, but also sets the voltages at the leads of the RTD to within the specified absolute input voltage range of the PGA. This is important in case PGA gains greater than 10 are used, because the PGA needs headroom from GND to operate when using gains greater than 10.

When designing the circuit, care must also be taken to meet the compliance voltage requirement of the IDAC. The IDAC requires that the maximum voltage drop developed across the current path to GND be equal to or less than the specified compliance voltage to operate accurately.

As stated in the Design Requirements, this design example discusses the circuit implementation for a Pt100 element measuring temperatures ranging from –200°C to +850°C. The excitation current for the Pt100 is chosen as IIDAC1 = 400µA to meet the required power budget of this example. As mentioned previously, besides creating the reference voltage for the ADC, the voltage across RREF also sets the absolute input voltages for the RTD measurement. In general, select the largest reference voltage possible that maintains the compliance voltage of the IDAC and meets the absolute input voltage requirement of the PGA. Setting the common-mode voltage at or below half the analog supply is a good starting point for a design. 1.6V is used as the target common-mode voltage in this example. Consequently, use Equation 17 to calculate the value for RREF:

Equation 17. RREF = VREF / IIDAC1 = 1.6V / 400μA = 4kΩ

The stability of RREF is critical to achieve good measurement accuracy over temperature and time. Choosing a reference resistor with a temperature coefficient of ±10ppm/°C or better is advisable.

As a last step, select the PGA gain to match the maximum input signal to the FSR of the ADC. The resistance of a Pt100 increases with temperature. Therefore, the maximum voltage to be measured (VINMAX) occurs at the positive temperature extreme. At 850°C, a Pt100 has an equivalent resistance of approximately 391Ω as per the NIST tables. The voltage across the Pt100 equates to Equation 18:

Equation 18. VINMAX = VRTD (at 850°C) = RRTD (at 850°C) × IIDAC1 = 391Ω × 400µA = 156.4mV

The maximum gain that can be applied when using a 1.6V reference is then calculated as (1.6V / 156.4mV) = 10.23. The next smaller PGA gain setting available in the ADS1x2C14 is 10. At a gain of 10, the device offers an FSR value as described in Equation 19:

Equation 19. FSR = ±VREF / Gain = ±1.6V / 10 = ±160mV

This range allows for margin with respect to initial accuracy and drift of the IDACs and reference resistor.

To keep the ADC power consumption at a minimum, speed mode 0 (fMOD = 32kHz) is selected using the SPEED_MODE[1:0] bits. And to meet the line-cycle rejection requirement at 50Hz and 60Hz, the 20SPS output data rate is chosen using the FLTR_OSR[2:0] bits. The measurement resolution (determined by the ADC noise) increases at the expense of higher power consumption, when choosing a faster speed mode with the same 20SPS output data rate setting. However the measurement accuracy (determined by the ADC DC errors, such as gain and offset error) is largely unaffected by the speed mode setting.

The primary purpose of the series resistors at the analog and positive reference inputs is to protect the device inputs from any overvoltage conditions. In case overvoltage conditions at the RTD terminals can occur in the application, select the series resistor value such that the currents into the analog and positive reference inputs get limited to less than 10mA. Series resistor values of 2.2kΩ are chosen in this example to limit the input currents to less than 5mA when overvoltages up to ±10V are present at the RTD terminals. Consider the interaction of the series resistors with the input currents into the analog and reference inputs when selecting the resistor values. The voltage drop created across the series resistors causes a potential offset error. In addition, the series resistors together with the input capacitors form first order RC antialiasing filters. The exact corner frequency of the RC filters is not very critical with this delta-sigma ADC. A general recommendation is to select a corner frequency which is at least 10 times lower than the modulator frequency of the ADC.

After selecting the values for the IDAC, RREF, PGA gain, and the series resistors, make sure to double check that the settings meet the absolute input voltage requirements of the PGA and the compliance voltage of the IDAC. Include the voltage drop created by IDAC1 across the RTD lead resistances and the series resistor at the IDAC1 output pin in the calculations.

Lead-wire compensation for 3-wire RTDs in this example is achieved by implementing a two-step measurement approach.

  1. In step one, measure the voltage (V1) between AIN0 and AIN1.
  2. In a second measurement step, measure the voltage (V2) between AIN0 and AIN2.

Equation 20 and Equation 21 represent the two measurements.

Equation 20. V1 = IIDAC1 (RLEAD1 + RRTD)
Equation 21. V2 = IIDAC1 (RLEAD1 + RRTD + RLEAD3)

To assume that all three lead resistances have the same value, RLEAD, is reasonable. Consequently, use Equation 22 to calculate the lead-wire compensated RTD voltage.

Equation 22. VRTD = 2 × V1 – V2 = 2 × [IIDAC1 (RLEAD + RRTD)] – IIDAC1 (2 × RLEAD + RRTD) = IIDAC1 × RRTD

RTD Measurement Register Bit Settings shows the critical register bit settings for the various measurements in this design example.

Table 9-2 RTD Measurement Register Bit Settings
REGISTER BITS 2-WIRE RTD 3-WIRE RTD 4-WIRE RTD
V1 V2
SPEED_MODE[1:0] 00b (Speed Mode 0)
FLTR_OSR[2:0] 111b (fDATA = 20SPS)
GAIN[3:0] 0110b (Gain = 10)
REFP_BUF_EN 1b (REFP buffer enabled)
REFN_BUF_EN 0b (REFN buffer disabled)
REF_SEL[1:0] 01b (External reference)
IUNIT 1b (IUNIT = 10μA)
I2MAG[3:0] 0000b (IDAC2 disabled)
I2MUX[2:0] Don't care
I1MAG[3:0] 0101b (IIDAC1 = 40 × IUNIT)
I1MUX[2:0] 110b (AIN6) 110b (AIN6) 110b (AIN6) 111b (AIN7)
AINP[3:0] 0000b (AIN0) 0000b (AIN0) 0000b (AIN0) 0000b (AIN0)
AINN[3:0] 0010b (AIN2) 0001b (AIN1) 0010b (AIN2) 0001b (AIN1)

For more information about RTD measurement circuits and the implementation using TI ADCs see the A Basic Guide to RTD Measurements application note. Various strategies for sensor fault detection using features similar to the ones integrated in ADS1x2C14 are discussed in the RTD Wire-Break Detection Using Precision Delta-Sigma ADCs application note. A software library using C code showing how to implement the RTD linearization algorithm in the host controller is available here.