SBASB22 December   2025 ADS9324

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. 6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs
      2. 7.3.2  Input Clamp Protection Circuit
      3. 7.3.3  Analog Input Impedance
      4. 7.3.4  Programmable Gain Amplifier (PGA)
      5. 7.3.5  ADC Transfer Function
      6. 7.3.6  Reference
      7. 7.3.7  Open Wire Safe Mode
      8. 7.3.8  System Offset Calibration
      9. 7.3.9  System Gain Calibration
      10. 7.3.10 ADC Gain and Offset Error Calibration
      11. 7.3.11 Digital Filter
        1. 7.3.11.1 System Phase Calibration
        2. 7.3.11.2 Block Average Filter
        3. 7.3.11.3 Moving Average Filter
        4. 7.3.11.4 Low-Pass FIR Filter
      12. 7.3.12 Digital Window Comparator
      13. 7.3.13 Alarm Modes
      14. 7.3.14 Data Interface
        1. 7.3.14.1 ADC Channel Modes
        2. 7.3.14.2 Daisy Chain
        3. 7.3.14.3 Diagnostic Flags
        4. 7.3.14.4 ADC Output Data Randomizer
        5. 7.3.14.5 Test Patterns for Data Interface
        6. 7.3.14.6 Digital Output Drive Strength Control
        7. 7.3.14.7 Digital Output Delay Adjustment
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
      2. 7.4.2 Normal Operation
      3. 7.4.3 Standby Mode
    5. 7.5 Programming
      1. 7.5.1 Register Write Operation
      2. 7.5.2 Register Read Operation
      3. 7.5.3 Initialization Example - Single Lane Mode on SDOUT
  9. 8 Register Maps
    1. 8.1 ADS93xx Common Registers
    2. 8.2 AIN1 - AIN8 Channel Registers
    3. 8.3 AIN9 - AIN16 Channel Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 16-Channel, Data Acquisition System (DAQ) for Power Automation
        1. 9.2.1.1 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

5.4 Thermal Information

THERMAL METRIC(1) ADS9324 UNIT
RSK (VQFN)
64 PINS
RθJA Junction-to-ambient thermal resistance 22.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 8.6 °C/W
RθJB Junction-to-board thermal resistance 6.8 °C/W
ΨJT Junction-to-top characterization parameter 0.1 °C/W
ΨJB Junction-to-board characterization parameter 6.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.