SBASB22 December   2025 ADS9324

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. 6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs
      2. 7.3.2  Input Clamp Protection Circuit
      3. 7.3.3  Analog Input Impedance
      4. 7.3.4  Programmable Gain Amplifier (PGA)
      5. 7.3.5  ADC Transfer Function
      6. 7.3.6  Reference
      7. 7.3.7  Open Wire Safe Mode
      8. 7.3.8  System Offset Calibration
      9. 7.3.9  System Gain Calibration
      10. 7.3.10 ADC Gain and Offset Error Calibration
      11. 7.3.11 Digital Filter
        1. 7.3.11.1 System Phase Calibration
        2. 7.3.11.2 Block Average Filter
        3. 7.3.11.3 Moving Average Filter
        4. 7.3.11.4 Low-Pass FIR Filter
      12. 7.3.12 Digital Window Comparator
      13. 7.3.13 Alarm Modes
      14. 7.3.14 Data Interface
        1. 7.3.14.1 ADC Channel Modes
        2. 7.3.14.2 Daisy Chain
        3. 7.3.14.3 Diagnostic Flags
        4. 7.3.14.4 ADC Output Data Randomizer
        5. 7.3.14.5 Test Patterns for Data Interface
        6. 7.3.14.6 Digital Output Drive Strength Control
        7. 7.3.14.7 Digital Output Delay Adjustment
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
      2. 7.4.2 Normal Operation
      3. 7.4.3 Standby Mode
    5. 7.5 Programming
      1. 7.5.1 Register Write Operation
      2. 7.5.2 Register Read Operation
      3. 7.5.3 Initialization Example - Single Lane Mode on SDOUT
  9. 8 Register Maps
    1. 8.1 ADS93xx Common Registers
    2. 8.2 AIN1 - AIN8 Channel Registers
    3. 8.3 AIN9 - AIN16 Channel Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 16-Channel, Data Acquisition System (DAQ) for Power Automation
        1. 9.2.1.1 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AVDD_5V to GND –0.3 6 V
AVDD_1V8 to GND –0.3 2.1 V
IOVDD to GND –0.3 3.6 V
AINnP and AINnM to GND –18 18 V
REFIO to GND GND – 0.3 VREF (4.096) + 0.3 V
REFM to GND GND – 0.3 GND + 0.3 V
Digital inputs to GND GND– 0.3 3.6 V
Input current to any pin except supply pins(2) –10 10 mA
Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –60 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Limit pin current to 10mA or less.