SBOSAJ7A October   2025  – December 2025 TMP4719

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Initialization and Default Temperature Conversion
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 ALERT and T_CRIT Output
      4. 7.3.4 1.2V Logic Compatible Inputs
      5. 7.3.5 Digital Filter
      6. 7.3.6 One-Shot Conversions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Interrupt and Comparator Mode
        1. 7.4.1.1 Interrupt Mode
        2. 7.4.1.2 Comparator Mode
        3. 7.4.1.3 T_CRIT Output
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1 Temperature Data Format
      2. 7.5.2 I2C and SMBus Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
      5. 7.5.5 SMBus Alert Mode
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1 Layout Guidelines

Remote temperature sensing on the TMP4719 device measures small voltages using very low currents; therefore, noise at the device inputs must be minimized. Most applications using the TMP4719 have high digital content, with several clocks and logic-level transitions that create a noisy environment. The layout must adhere to the following guidelines:

  1. Place the TMP4719 device as close to the remote junction sensor as possible.
  2. Route the DP and DN traces next to each other and shield them from adjacent signals through the use of ground guard traces. If a multilayer PCB is used, bury these traces between the ground or V+ planes to shield them from extrinsic noise sources. 5mil (0.127mm) PCB traces are recommended.
  3. Minimize additional thermocouple junction-induced offset voltage caused by copper-to-solder connections. If these junctions are used, make the same number and approximate locations of copper-to-solder connections in both the DP and DN connections to cancel any thermocouple effects.
  4. Use a 0.1μF local bypass capacitor directly between the VDD and GND of the TMP4719 device. For optimum measurement performance, minimize filter capacitance between DP and DN to 1.5nF or less. This capacitance includes any cable capacitance between the remote temperature sensor and the TMP4719 device. The external capacitor shall be placed as close to the DP and DN pin as possible.
  5. If the connection between the remote temperature sensor and the TMP4719 device is less than 8in (20.32cm) long, use a twisted-wire pair connection. For lengths greater than 8 inches, use a twisted, shielded pair with the shield grounded as close to the TMP4719 device as possible. Leave the remote sensor connection end of the shield wire open to avoid ground loops and 60Hz pickup.
  6. Thoroughly clean and remove all flux residue in and around the pins of the TMP4719 device to avoid any leakage-induced temperature measurement error.
  7. If series resistors are added, equal value shall be used for the DP and DN connections, and the total value shall not be greater than 1kΩ. Place the resistors as close to the DP and DN pins as possible.