SBOSAJ7A October   2025  – December 2025 TMP4719

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Initialization and Default Temperature Conversion
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 ALERT and T_CRIT Output
      4. 7.3.4 1.2V Logic Compatible Inputs
      5. 7.3.5 Digital Filter
      6. 7.3.6 One-Shot Conversions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Interrupt and Comparator Mode
        1. 7.4.1.1 Interrupt Mode
        2. 7.4.1.2 Comparator Mode
        3. 7.4.1.3 T_CRIT Output
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1 Temperature Data Format
      2. 7.5.2 I2C and SMBus Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
      5. 7.5.5 SMBus Alert Mode
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.8 Typical Characteristics

at TA = 25°C and VDD = 3.3V (unless otherwise noted)

TMP4719 Local Temperature Error vs Temperature
VDD = 1.62V to 5.5V
Figure 6-2 Local Temperature Error vs Temperature
TMP4719 Remote Temperature Error vs Series Resistance
Characterized with MMBT3904 NPN Transistor; 7 units averaged
Figure 6-4 Remote Temperature Error vs Series Resistance
TMP4719 Remote Temperature Error vs Differential Capacitance
Characterized with MMBT3904 NPN Transistor
Figure 6-6 Remote Temperature Error vs Differential Capacitance
TMP4719 Standby and Shutdown Current vs Temperature
Serial Bus Inactive
Figure 6-8 Standby and Shutdown Current vs Temperature
TMP4719 Active Current vs Temperature
Figure 6-10 Active Current vs Temperature
TMP4719 Conversion Time vs Temperature
Figure 6-12 Conversion Time vs Temperature
TMP4719 Remote Temperature Error vs Temperature
Characterized with MMBT3904 NPN Transistor; TA = 25°C; 30 units
Figure 6-3 Remote Temperature Error vs Temperature
TMP4719 Remote Temperature Error vs Diode Parallel Leakage ResistanceFigure 6-5 Remote Temperature Error vs Diode Parallel Leakage Resistance
TMP4719 Response Time (Stirred Liquid)
Local: soldered devices on 62mil 2-layer FR4 PCB
Remote: characterized with MMBT3904 NPN Transistor
Temperature Step: TA jumps from 25°C to 75°C
Figure 6-7 Response Time (Stirred Liquid)
TMP4719 Standby and Shutdown Current vs Supply Voltage
Serial Bus Inactive, VDD = 1.62V to 5.5V
Figure 6-9 Standby and Shutdown Current vs Supply Voltage
TMP4719 Active Current vs Supply Voltage
VDD = 1.62V to 5.5V
Figure 6-11 Active Current vs Supply Voltage
TMP4719 Remote Temperature Noise Data Distribution (300 Samples)
Characterized with MMBT3904 NPN Transistor
Figure 6-13 Remote Temperature Noise Data Distribution (300 Samples)