SCES983 October   2025 TXB0604

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics, VCCA = 0.9V
    6. 5.6 Switching Characteristics, VCCA = 1.2V
    7. 5.7 Switching Characteristics, VCCA = 1.5V ± 0.1V
    8. 5.8 Switching Characteristics, VCCA = 1.8V ± 0.15V
    9. 5.9 Switching Characteristics: Tsk, TMAX (-40°C to 125°C) 
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
      6. 7.3.6 Dummy Cycles
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

8.1 Application Information

The TXB0604 device can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. It can only translate push-pull CMOS logic outputs. If for open-drain signal translation, please refer to TI TXS010X products. Any external pulldown or pullup resistors are recommended larger than 20kΩ.

The device features enhanced output drive strength for use in high-speed interfaces such as QSPI, OSPI, eSPI, etc. The device is designed to support high-drive applications with either a lumped capacitive load of up to 100pF at 190Mbps or a signal trace length of up to 20 inches with a 50pF load at 142Mbps.