SDAA132 December   2025 MSPM33C321A

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 MSPM33C Hardware Design Check List
  5. 2 Power Supplies in MSPM33C Devices
    1. 2.1 Digital Power Supply
    2. 2.2 Analog Power Supply
    3. 2.3 Built-in Power Supply and Voltage Reference
    4. 2.4 Recommended Decoupling Circuit for Power Supply
    5. 2.5 Recommended Decoupling Circuit for VBAT
  6. 3 Reset and Power Supply Supervisor
    1. 3.1 Digital Power Supply
    2. 3.2 Power Supply Supervisor
  7. 4 Clock System
    1. 4.1 Internal Oscillators
    2. 4.2 External Oscillators
    3. 4.3 External Clock Output (CLK_OUT)
    4. 4.4 Frequency Clock Counter (FCC)
  8. 5 Debugger
    1. 5.1 Debug Port Pins and Pinout
    2. 5.2 Debug Port Connection With Standard JTAG Connector
  9. 6 Key Analog Peripherals
    1. 6.1 ADC Design Considerations
    2. 6.2 COMP Design Considerations
  10. 7 Key Digital Peripherals
    1. 7.1 Timer Resources and Design Considerations
    2. 7.2 UART and LIN Resources and Design Considerations
    3. 7.3 MCAN Design Considerations
    4. 7.4 I2C and SPI Design Considerations
    5. 7.5 I2S/TDM Design Considerations
    6. 7.6 QSPI Design Considerations
  11. 8 GPIOs
    1. 8.1 GPIO Output Switching Speed and Load Capacitance
    2. 8.2 GPIO Current Sink and Source
    3. 8.3 High-Speed GPIOs (HSIO)
    4. 8.4 High-Drive GPIOs (HDIO)
    5. 8.5 Communicate With a 1.8V Device Without a Level Shifter
    6. 8.6 Unused Pins Connection
  12. 9 Layout Guides
    1. 9.1 Power Supply Layout
    2. 9.2 Considerations for Ground Layout
    3. 9.3 Traces, Vias, and Other PCB Components
    4. 9.4 How to Select Board Layers and Recommended Stack-up
  13. 10Bootloader
    1. 10.1 Bootloader Introduction
    2. 10.2 Bootloader Hardware Design Considerations
      1. 10.2.1 Physical Communication interfaces
      2. 10.2.2 Hardware Invocation
  14. 11Summary
  15. 12References

5.2 Debug Port Connection With Standard JTAG Connector

Figure 5-2 shows the connection between MSPM33C family MCU SWD debug port with the standard JTAG connector.

JTAG and MSPM33C Connection Figure 5-2 JTAG and MSPM33C Connection

For MSPM33C device, users can use XDS110 to implement debug or download function. This lists the contents of the XDS110 and provides instruction on installing the hardware.

Standard XDS110

Users can purchase a standard XDS110 on ti.com. Figure 5-3 shows a high-level diagram of the major functional areas and interfaces of the XDS110 probe.

XDS110 Probe High-Level Block DiagramFigure 5-3 XDS110 Probe High-Level Block Diagram

For more XDS110 information, refer to the XDS110 Debug Probe User’s Guide.

Lite XDS110 (MSPM33C LaunchPad Development Kit)

The MSPM33C LaunchPad kit includes a XDS110-ET (Lite) circuit. Users can use this debugger to download the firmware into MSPM33C device. Figure 5-4 shows XDS110-ET circuit.

There are two probes in XDS110-ET:

2.54mm probe: This port supports the SWD protocol and includes a 5V or 3.3V power supply. Users can connect SWDIO SWCLK 3V3 GND to the board and download firmware into an MSPM33C device.

This probe also supports EnergyTrace technology to measure power consumption precisely in real time.

For more information for EnergyTrace technology, refer to the EnergyTrace Technology tool page.

XDS110-ET Circuit Figure 5-4 XDS110-ET Circuit

10-pin probe: This port supports the JTAG and SWD protocols and includes a 3.3V power supply. Users can use a 10-pin cable to connect the board and XDS110-ET and download firmware into an MSPM33C device. Figure 5-5 shows the 10-pin cable.

Arm Standard 10-Pin CableFigure 5-5 Arm Standard 10-Pin Cable
Note:
  • Standard XDS110 support level shift for debug ports, XDS110-ET just support 3.3v probe level.
  • TI does not recommend using the XDS110 to power other devices except the MSPM33C MCU because the XDS110 integrates an LDO with limited current drive capability.
  • XDS110-ET 2.54mm probe does not support JTAG protocol.
  • XDS110-ET 10-pin probe does not support EnergyTrace technology.