SLAAED9 November   2023 TAA5412-Q1 , TAC5311-Q1 , TAC5312-Q1 , TAC5411-Q1 , TAC5412-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Diagnostic Monitoring Architecture
  6. 3 Monitored Faults
    1. 3.1 Microphone Faults
      1. 3.1.1 Inputs Shorted to Ground
      2. 3.1.2 Inputs Shorted to MICBIAS
      3. 3.1.3 Input Open Circuit
      4. 3.1.4 Input Pins Shorted Together
      5. 3.1.5 Input Overvoltage Detection
      6. 3.1.6 Inputs Shorted to VBAT
    2. 3.2 Line Out Faults
      1. 3.2.1 Output Overcurrent
      2. 3.2.2 Virtual Ground
    3. 3.3 Other Faults
      1. 3.3.1 MICBIAS Overvoltage
        1. 3.3.1.1 DIAG_CFG11 Register (page = 0x01, address = 0x51) [Reset = 0x40]
      2. 3.3.2 MICBIAS Overcurrent
      3. 3.3.3 MICBIAS Load Current
        1. 3.3.3.1 DIAG_CFG6 Register (page = 0x01, address = 0x4C) [Reset = 0xA2]
        2. 3.3.3.2 DIAG_CFG7 Register
      4. 3.3.4 Overtemperature Fault
      5. 3.3.5 Supply Back Pumping
  7. 4 Enabling Diagnostics and Programming Thresholds
    1. 4.1 DIAG_CFG0 Register (page = 0x01, Address = 0x46) [Reset = 0x00]
    2. 4.2 DIAG_CFG1 Register (page = 0x01, Address = 0x47) [Reset = 0x37]
    3. 4.3 DIAG_CFG2 Register (page = 0x01, Address = 0x48) [Reset = 0x87]
  8. 5 Fault Diagnostic Setup Procedure
  9. 6 Fault Reporting
    1. 6.1 Live Registers
      1. 6.1.1 CHx_LIVE Register (page = 0x01, address = 0x3D) [Reset = 0b]
      2. 6.1.2 CH1_LIVE Register (page = 0x01, address = 0x3E) [Reset = 0h]
      3. 6.1.3 INT_LIVE0 Register (page = 0x01, address = 0x3C) [Reset = 00]
      4. 6.1.4 INT_LIVE1 Register (page = 0x00, address = 0x42) [reset = 0x00]
      5. 6.1.5 INT_LIVE2 Register (page = 0x00, address = 0x43) [reset = 0x00]
    2. 6.2 Latched Registers
      1. 6.2.1 Clearing Latched Registers
    3. 6.3 Fault Filtering and Response Time
      1. 6.3.1 Debounce
      2. 6.3.2 Scan Rate
        1. 6.3.2.1 DIAG_CFG4 Register (page = 0x01, address = 0x4A) [reset = 0xB8]
      3. 6.3.3 Moving Average
        1. 6.3.3.1 DIAG_CFG5 Register (page = 0x01, address = 0x4B) [reset = 0h]
  10. 7 Responding to a Fault
    1. 7.1 INT_CFG Register (page = 0x00, address = 0x42) [reset = 0b]
      1. 7.1.1 DIAG_CFG10 Register (page = 0x01, address = 0x50) [Reset = 0x88]
    2. 7.2 Manual Recovery Sequence
    3. 7.3 Recommended Fault Register Read Sequence
  11. 8 Using PurePath Console
    1. 8.1 Advanced Tab
    2. 8.2 Diagnostics Walk-through
      1. 8.2.1 Diagnostics Configuration
      2. 8.2.2 Debounce Configuration
      3. 8.2.3 Latched Fault Status
  12. 9 Diagnostic Monitoring Registers
    1. 9.1 Voltage Measurements
    2. 9.2 MICBIAS Load Current
    3. 9.3 Internal Die Temperature
  13. 10Summary
  14. 11References

9.3 Internal Die Temperature

An internal diode provides a rough measure of the device die temperature. This temperature monitor is not the same as that used by the over-temperature fault detect circuitry. The supported monitoring range is from –40°C to 150°C and the temperature can be calculated using the following equation.

Equation 4. T e m p e r a t u r e ° C = 0.1141   × 3565 - R E A D _ D A T A - 40

The die temperature measurement is not trimmed for gain and offset error and is intended only as an auxiliary feature for applications that want a rough estimate of the die temperature. The accuracy of the die temperature sensor is not specified and varies depending on board layout. However, a rough characterization of the sensor typically shows accuracy around ±5°C. If precision temperature readings are required, using an external sensor is recommended.