SLUS812E February   2008  – September 2025 TPS51200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Sink and Source Regulator (VO Pin)
      2. 6.3.2  Reference Input (REFIN Pin)
      3. 6.3.3  Reference Output (REFOUT Pin)
      4. 6.3.4  Soft-Start Sequencing
      5. 6.3.5  Enable Control (EN Pin)
      6. 6.3.6  Powergood Function (PGOOD Pin)
      7. 6.3.7  Current Protection (VO Pin)
      8. 6.3.8  UVLO Protection (VIN Pin)
      9. 6.3.9  Thermal Shutdown
      10. 6.3.10 Tracking Start-up and Shutdown
      11. 6.3.11 Output Tolerance Consideration for VTT DIMM Applications
      12. 6.3.12 REFOUT (VREF) Consideration for DDR2 Applications
    4. 6.4 Device Functional Modes
      1. 6.4.1 Low Input Voltage Applications
      2. 6.4.2 S3 and Pseudo-S5 Support
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Voltage Capacitor
        2. 7.2.2.2 VLDO Input Capacitor
        3. 7.2.2.3 Output Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 3.3VIN, DDR2 Configuration
      2. 7.3.2 2.5VIN, DDR3 Configuration
      3. 7.3.3 3.3VIN, LP DDR3 or DDR4 Configuration
      4. 7.3.4 3.3VIN, DDR3 Tracking Configuration
      5. 7.3.5 3.3VIN, LDO Configuration
      6. 7.3.6 3.3VIN, DDR3 Configuration with LFP
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
      3. 7.5.3 Thermal Design Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Modules
        2. 8.1.1.2 Spice Models
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision D (February 2020) to Revision E (September 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated RθJA metric from 55.6°C/W to 84.6°C/WGo
  • Updated RθJC(top) metric from 84.6°C/W to 55.6°C/WGo

Changes from Revision C (November 2016) to Revision D (February 2020)

  • Added "keep total REFOUT capacitance below 0.47μF" in Pin Functions tableGo

Changes from Revision B (September 2016) to Revision C (November 2016)

  • Added references to DDR3L DRAM technology throughoutGo
  • Added DDR3L test conditions to Output DC voltage, VO and REFOUT specificationGo
  • Added Figure 5-4 Go
  • Added Figure 5-9 Go
  • Updated Figure 5-16 to include DDR3L dataGo

Changes from Revision A (September 2015) to Revision B (May 2016)

  • Changed " –10mA < IREFOUT < 10mA" to "–1mA < IREFOUT < 1mA" in all test conditions for the REFOUT voltage tolerance to VREFIN specificationGo
  • Changed all MIN and MAX values from "15" to "12" for all test conditions for the REFOUT voltage tolerance to VREFIN specificationGo
  • Updated Figure 6-1 Go
  • Added Section 6.3.12 sectionGo
  • Updated Figure 7-5 and Table 7-2 Go
  • Added clarity to Section 7.5.1 section.Go

Changes from Revision * (February 2008) to Revision A (September 2015)

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Changed “PowerPAD” references to “thermal pad” throughout Go
  • Deleted Dissipation Ratings table Go