To increase the reliability and feasibility of the design, recommendations are to adhere to the following guidelines for PCB layout. The guidelines are general recommendations which can be followed for any power supply design and are generally not topology-specific. The main theme in power supply layouts is to keep high current loops as small as possible to avoid coupling and any additional losses or false switching due to inaccurate sensing caused by board parasitics.

1. Minimize the high current loops to reduce parasitic capacitances and inductances. For UCG2882x, high current loops are the primary side power loop, secondary side power loop and the leakage snubber loop.
2. Separate the device signal ground from the high current ground to isolate the switching noise away from the low voltage signals. For UCG2882x, the components on pins 4-11 are referenced to GND pins 3 and 10 which then connect to the device thermal pad and GND power plane and follows this recommendation.
3. Place the bypass capacitor on VCC pin as close as possible to the VCC and GND pins of the device.
4. Route the trace from HV pin through the two diodes to X-capacitor orthogonal and away from the SW pin or trace to minimize switching noise coupling to the flyback converter input and avoid bypassing the EMI filter components.

Use the UCG28826 Evaluation Module User's Guide as a reference when designing the circuit board.