SLUSFF2C September   2023  – December 2025 UCG28824 , UCG28826 , UCG28828

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Detailed Pin Descriptions
      1. 7.3.1  HV - High Voltage Input
      2. 7.3.2  SW - Switch Node
      3. 7.3.3  GND – Ground Return
      4. 7.3.4  FLT - External Overtemperature Fault
      5. 7.3.5  FB ­­– Feedback
      6. 7.3.6  TR - Turns Ratio
      7. 7.3.7  IPK - Peak Current and Dithering
      8. 7.3.8  FCL - Frequency Clamp and Fault Response
      9. 7.3.9  CDX - CCM, Drive Strength, and X-cap Discharge
      10. 7.3.10 VCC - Input Bias
    4. 7.4 Feature Description
      1. 7.4.1  Self Bias and Auxless Sensing
      2. 7.4.2  Control Law
        1. 7.4.2.1 Valley Switching
        2. 7.4.2.2 Frequency Foldback
        3. 7.4.2.3 Burst Mode
        4. 7.4.2.4 Continuous Conduction Mode (CCM)
      3. 7.4.3  GaN HEMT Switching Capability
      4. 7.4.4  Soft Start
      5. 7.4.5  Frequency Clamp
      6. 7.4.6  Frequency Dithering
      7. 7.4.7  Slew Rate Control
      8. 7.4.8  Transient Peak Power Capability
      9. 7.4.9  X-Cap Discharge
      10. 7.4.10 Fault Protections
        1. 7.4.10.1 Brownout Protection
        2. 7.4.10.2 Short-Circuit Protection
        3. 7.4.10.3 Output Overvoltage Protection
        4. 7.4.10.4 Overpower Protection (OPP, LPS)
        5. 7.4.10.5 Overtemperature Protection
        6. 7.4.10.6 Open FB Protection
        7. 7.4.10.7 Error Codes for Protections
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Bulk Capacitor
        2. 8.2.2.2 Transformer Primary Inductance and Turns Ratio
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Selection Resistors
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) UCG28826 UNIT
REZ (QFN)
12 PINS
RθJA Junction-to-ambient thermal resistance 28.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28 °C/W
RθJB Junction-to-board thermal resistance 5.7 °C/W
ΨJT Junction-to-top characterization parameter 2 °C/W
ΨJB Junction-to-board characterization parameter 5.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.