SLVSGS5A December   2023  – June 2024 DRV3946-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Recommended External Components
      2. 6.3.2  Power Supplies and Monitors
        1. 6.3.2.1 PVDD and VDD Power Supplies
        2. 6.3.2.2 PVDD Monitor
        3. 6.3.2.3 VDD Monitor
        4. 6.3.2.4 RESET (nPOR)
        5. 6.3.2.5 Device Safety Layer
      3. 6.3.3  Output Driver
        1. 6.3.3.1 Retry Wait
        2. 6.3.3.2 Over Current Protection
        3. 6.3.3.3 Thermal Protection
      4. 6.3.4  Start-up Sequencing
      5. 6.3.5  Current Control
        1. 6.3.5.1 Internal Regulation Mode
          1. 6.3.5.1.1 Current Thresholds
          2. 6.3.5.1.2 PWM Cycle Control
        2. 6.3.5.2 Fixed Frequency, Variable Duty Cycle Mode
        3. 6.3.5.3 Fixed Duty Cycle, Variable Frequency Mode
        4. 6.3.5.4 Quick Turn Off
        5. 6.3.5.5 PWM Frequency
        6. 6.3.5.6 Minimum and Maximum Duty Cycle
      6. 6.3.6  EN/EN1 and DIS/EN2 pins
      7. 6.3.7  Diagnostics Features
        1. 6.3.7.1 On State Diagnostics
          1. 6.3.7.1.1 PWM Cycle Warnings
          2. 6.3.7.1.2 Timer Based Warnings
        2. 6.3.7.2 Off-state Diagnostics
      8. 6.3.8  nFAULT/NAD Pin
      9. 6.3.9  Fault Table
      10. 6.3.10 Programming
        1. 6.3.10.1 SPI Interface
        2. 6.3.10.2 Addressable SPI
        3. 6.3.10.3 SPI Error Indicators
        4. 6.3.10.4 SPI Format
        5. 6.3.10.5 SPI Watchdog Monitor
  8. 7 Register Maps
    1. 7.1 STATUS Registers
      1. 7.1.1 STATUS0 Register (Address = 1h) [Reset = 2500h]
      2. 7.1.2 STATUS1 Register (Address = 2h) [Reset = 0803h]
      3. 7.1.3 STATUS2 Register (Address = 3h) [Reset = 0000h]
      4. 7.1.4 STATUS3 Register (Address = 4h) [Reset = 0000h]
      5. 7.1.5 STATUS4 Register (Address = Ah) [Reset = 0000h]
      6. 7.1.6 STATUS5 Register (Address = Bh) [Reset = 0000h]
    2. 7.2 MEAS Registers
      1. 7.2.1 MEAS0 Register (Address = 5h) [Reset = 0000h]
      2. 7.2.2 MEAS1 Register (Address = 6h) [Reset = 0000h]
      3. 7.2.3 MEAS2 Register (Address = 7h) [Reset = 0000h]
      4. 7.2.4 MEAS3 Register (Address = 8h) [Reset = 0000h]
      5. 7.2.5 MEAS4 Register (Address = 9h) [Reset = 0000h]
      6. 7.2.6 MEAS5 Register (Address = Ch) [Reset = 0000h]
      7. 7.2.7 MEAS6 Register (Address = Dh) [Reset = 0000h]
    3. 7.3 CONFIG A Registers
      1. 7.3.1 CONFIG_A0 Register (Address = 10h) [Reset = C040h]
      2. 7.3.2 CONFIG_A1 Register (Address = 11h) [Reset = C040h]
      3. 7.3.3 CONFIG_A2 Register (Address = 12h) [Reset = 2424h]
      4. 7.3.4 CONFIG_A3 Register (Address = 13h) [Reset = 0088h]
      5. 7.3.5 CONFIG_A4 Register (Address = 14h) [Reset = 130Ch]
      6. 7.3.6 CONFIG_A5 Register (Address = 15h) [Reset = 8000h]
      7. 7.3.7 CONFIG_A6 Register (Address = 16h) [Reset = 0000h]
    4. 7.4 CONFIG B Registers
      1. 7.4.1 CONFIG_B0 Register (Address = 17h) [Reset = 2623h]
      2. 7.4.2 CONFIG_B1 Register (Address = 18h) [Reset = 0040h]
      3. 7.4.3 CONFIG_B2 Register (Address = 19h) [Reset = 0B0Bh]
      4. 7.4.4 CONFIG_B3 Register (Address = 1Ah) [Reset = 8000h]
      5. 7.4.5 CONFIG_B4 Register (Address = 1Bh) [Reset = 0000h]
    5. 7.5 CMD Registers
      1. 7.5.1 CMD0 Register (Address = 1Ch) [Reset = 8000h]
      2. 7.5.2 CMD1 Register (Address = 1Dh) [Reset = 0000h]
      3. 7.5.3 CMD2 Register (Address = 1Eh) [Reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Transient Thermal Impedance and Current Capability
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 PVDD Capacitance Value Estimation
    3. 8.3 Initialization Setup
      1. 8.3.1 Device Initialization – NAD
      2. 8.3.2 Device Initialization – Configuration
      3. 8.3.3 System Initialization
        1. 8.3.3.1 EN/EN1 and DIS/EN2 Function Check
        2. 8.3.3.2 nFAULT Signalling Check
        3. 8.3.3.3 Device Timing Check
        4. 8.3.3.4 Secondary Logic Check
      4. 8.3.4 Turn On Relay
      5. 8.3.5 Turn Off Relay
        1. 8.3.5.1 Using Target Device Command
        2. 8.3.5.2 Using Broadcast Command
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 PVDD Supply Requirements
      2. 8.4.2 PVDD Undervoltage Transients - Contactor Chatter or Weld Prevention
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Device Initialization – NAD

  1. WAIT - After PVDD and VDD ramp up, wait tREADY time

  2. STATUS0_READ - Read STATUS0 of each one of the devices on the addressed SPI bus. A normal response would include

    1. Correct address and NAD values

    2. POR bit set

    3. WARNINGS bit set (due to CONFIG_CRC_W)

    4. Status of the EN/EN1 and DIS/EN2 pins = 0x0 (No data yet)

  3. VDD_ERR - If the response indicates VDD_ERR, this indicates a power supply issue with any of the devices on the addressed SPI bus. Check the condition of VDD and PVDD supplies and repeat STATUS0_READ. The power-up initialization of the device is gated till supply monitor flags, PVDD_UV, VDD_OV and VDD_UV, are clear.

  4. NAD_ERR - If the response indicates NAD_ERR, this indicates a NAD address determination issue with any of the devices on the addressed SPI bus. Check the pull-up resistor on nFAULT/NAD pin to VDD, followed by:

    1. Issue a broadcast command with INITIALIZE bit set

    2. Wait tREADY time

    3. Follow up with a broadcast command with INITIALIZE bit cleared. Response will include NAD_ERR and previous command content (command confirmation). If response still indicates a NAD_ERR, then refer to NAD_RECOVERY.

    4. Cycle back to SATUS0_READ

  5. NO_RESPONSE – This would indicate one of the following:

    1. Device Error – nFAULT pin will be asserted low. A power cycle is needed to proceed.

    2. No device found on the addressed NAD. This indicates the NAD determination on this specific NAD is incorrectly mapped to the different NAD. In this case, refer to SDO_CONFLICT_CREATION below.

  6. NAD_RECOVERY – Issue the following commands to force the NAD address

    1. Issue a broadcast command with FORCE_NAD bit set with intended NAD address. The device with NAD_ERR picks up this command and assigns itself the commanded NAD address.

    2. Follow up with a broadcast command with FORCE_NAD bit cleared. Response will include NAD_ERR and previous command content (command confirmation). NAD_ERR should be cleared.

    3. Cycle back to STATUS0_READ.

  7. SDO_CONFLICT_CREATION – This procedure assumes that the hardware has the ability to assert EN/EN1 pin high or low individually to each device on the addressed SPI -

    1. Assert EN/EN1 pin high on device which is not responding, while asserting EN/EN1 pin low on all other devices on the addressed SPI.

    2. Read STATUS1 of the devices on the addressed SPI bus one by one.

    3. Since STATUS1 reads EN/EN1_PIN_STAT, the device with EN/EN1 high will detect an SDO conflict with the other device and back off transmitting on SDO with a NAD_ERR.

    4. Follow the NAD_RECOVERY steps to correct the NAD_ERR of the device which is not responding.