SLVSGS5A December   2023  – June 2024 DRV3946-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Recommended External Components
      2. 6.3.2  Power Supplies and Monitors
        1. 6.3.2.1 PVDD and VDD Power Supplies
        2. 6.3.2.2 PVDD Monitor
        3. 6.3.2.3 VDD Monitor
        4. 6.3.2.4 RESET (nPOR)
        5. 6.3.2.5 Device Safety Layer
      3. 6.3.3  Output Driver
        1. 6.3.3.1 Retry Wait
        2. 6.3.3.2 Over Current Protection
        3. 6.3.3.3 Thermal Protection
      4. 6.3.4  Start-up Sequencing
      5. 6.3.5  Current Control
        1. 6.3.5.1 Internal Regulation Mode
          1. 6.3.5.1.1 Current Thresholds
          2. 6.3.5.1.2 PWM Cycle Control
        2. 6.3.5.2 Fixed Frequency, Variable Duty Cycle Mode
        3. 6.3.5.3 Fixed Duty Cycle, Variable Frequency Mode
        4. 6.3.5.4 Quick Turn Off
        5. 6.3.5.5 PWM Frequency
        6. 6.3.5.6 Minimum and Maximum Duty Cycle
      6. 6.3.6  EN/EN1 and DIS/EN2 pins
      7. 6.3.7  Diagnostics Features
        1. 6.3.7.1 On State Diagnostics
          1. 6.3.7.1.1 PWM Cycle Warnings
          2. 6.3.7.1.2 Timer Based Warnings
        2. 6.3.7.2 Off-state Diagnostics
      8. 6.3.8  nFAULT/NAD Pin
      9. 6.3.9  Fault Table
      10. 6.3.10 Programming
        1. 6.3.10.1 SPI Interface
        2. 6.3.10.2 Addressable SPI
        3. 6.3.10.3 SPI Error Indicators
        4. 6.3.10.4 SPI Format
        5. 6.3.10.5 SPI Watchdog Monitor
  8. 7 Register Maps
    1. 7.1 STATUS Registers
      1. 7.1.1 STATUS0 Register (Address = 1h) [Reset = 2500h]
      2. 7.1.2 STATUS1 Register (Address = 2h) [Reset = 0803h]
      3. 7.1.3 STATUS2 Register (Address = 3h) [Reset = 0000h]
      4. 7.1.4 STATUS3 Register (Address = 4h) [Reset = 0000h]
      5. 7.1.5 STATUS4 Register (Address = Ah) [Reset = 0000h]
      6. 7.1.6 STATUS5 Register (Address = Bh) [Reset = 0000h]
    2. 7.2 MEAS Registers
      1. 7.2.1 MEAS0 Register (Address = 5h) [Reset = 0000h]
      2. 7.2.2 MEAS1 Register (Address = 6h) [Reset = 0000h]
      3. 7.2.3 MEAS2 Register (Address = 7h) [Reset = 0000h]
      4. 7.2.4 MEAS3 Register (Address = 8h) [Reset = 0000h]
      5. 7.2.5 MEAS4 Register (Address = 9h) [Reset = 0000h]
      6. 7.2.6 MEAS5 Register (Address = Ch) [Reset = 0000h]
      7. 7.2.7 MEAS6 Register (Address = Dh) [Reset = 0000h]
    3. 7.3 CONFIG A Registers
      1. 7.3.1 CONFIG_A0 Register (Address = 10h) [Reset = C040h]
      2. 7.3.2 CONFIG_A1 Register (Address = 11h) [Reset = C040h]
      3. 7.3.3 CONFIG_A2 Register (Address = 12h) [Reset = 2424h]
      4. 7.3.4 CONFIG_A3 Register (Address = 13h) [Reset = 0088h]
      5. 7.3.5 CONFIG_A4 Register (Address = 14h) [Reset = 130Ch]
      6. 7.3.6 CONFIG_A5 Register (Address = 15h) [Reset = 8000h]
      7. 7.3.7 CONFIG_A6 Register (Address = 16h) [Reset = 0000h]
    4. 7.4 CONFIG B Registers
      1. 7.4.1 CONFIG_B0 Register (Address = 17h) [Reset = 2623h]
      2. 7.4.2 CONFIG_B1 Register (Address = 18h) [Reset = 0040h]
      3. 7.4.3 CONFIG_B2 Register (Address = 19h) [Reset = 0B0Bh]
      4. 7.4.4 CONFIG_B3 Register (Address = 1Ah) [Reset = 8000h]
      5. 7.4.5 CONFIG_B4 Register (Address = 1Bh) [Reset = 0000h]
    5. 7.5 CMD Registers
      1. 7.5.1 CMD0 Register (Address = 1Ch) [Reset = 8000h]
      2. 7.5.2 CMD1 Register (Address = 1Dh) [Reset = 0000h]
      3. 7.5.3 CMD2 Register (Address = 1Eh) [Reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Transient Thermal Impedance and Current Capability
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 PVDD Capacitance Value Estimation
    3. 8.3 Initialization Setup
      1. 8.3.1 Device Initialization – NAD
      2. 8.3.2 Device Initialization – Configuration
      3. 8.3.3 System Initialization
        1. 8.3.3.1 EN/EN1 and DIS/EN2 Function Check
        2. 8.3.3.2 nFAULT Signalling Check
        3. 8.3.3.3 Device Timing Check
        4. 8.3.3.4 Secondary Logic Check
      4. 8.3.4 Turn On Relay
      5. 8.3.5 Turn Off Relay
        1. 8.3.5.1 Using Target Device Command
        2. 8.3.5.2 Using Broadcast Command
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 PVDD Supply Requirements
      2. 8.4.2 PVDD Undervoltage Transients - Contactor Chatter or Weld Prevention
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

6.3.10.3 SPI Error Indicators

The SPI protocol provides a function to indicate certain SPI errors directly in the SDO response. Four different types of errors are provided and described below.

  • VDD_ERR: The leading bit of the SDO response is used to signal VDD_ERR. The error could occur due to a VDD undervoltage (loss of VDD) or VDD overvoltage on any of the devices on the SPI bus. During power-up initialization (INIT1, INIT2), this field also indicates PVDD under voltage or PVDD over voltage.

  • NAD_ERR: Failure to identify the node address (resistor out of range or device bias issues during initialization) or data conflict during SDO transmission results in a NAD_ERR condition. The second leading bit of the SDO response is used to signal NAD_ERR and for the remainder of the response SDO is disabled (Hi-Z). The error could occur due to NAD_ERR sensed by any of the devices on the SPI bus. Controller can resolve the NAD_ERR condition using the broadcast commands RE_INIT_NAD, NAD_OVERRIDE, or ASSIGNED_NAD. After power up, the NAD address is latched and does not change (unless commanded by the user).

  • SPI_ERR: The device signals the rejection of an SPI frame by asserting the SPI_ERR bit (third leading bit on SDO response) high in the next SPI frame. This is also referred to as out-of-frame signaling. The remainder of the SDO response proceeds as normal. SPI_ERR could occur due to an incorrect number of SCLK edges when nSCS is low (device expects exactly 24) or a Command CRC mismatch.

  • DEV_ERR: In the event of an error detected through the various device self-test (BIST) and power-up monitors the device signals a device error in the SDO response by keeping the SDI pin Hi-Z.