SNAS880A
December 2024 – October 2025
LMK3C0105
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
I2C Interface Specification
6
Parameter Measurement Information
6.1
Output Format Configurations
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Device Block-Level Description
7.3.2
Device Configuration Control
7.3.3
OTP Mode
7.3.4
I2C Mode
7.4
Device Functional Modes
7.4.1
Fail-Safe Inputs
7.4.2
Fractional Output Dividers
7.4.2.1
FOD Operation
7.4.2.2
Digital State Machine
7.4.2.3
Spread-Spectrum Clocking
7.4.2.4
Integer Boundary Spurs
7.4.3
Output Behavior
7.4.3.1
Output Format Selection
7.4.3.2
REF_CTRL Operation
7.4.4
Output Enable
7.4.4.1
Output Enable Control
7.4.4.2
Output Enable Polarity
7.4.4.3
Separate Output Enable
7.4.4.4
Output Disable Behavior
7.4.5
Device Default Settings
7.5
Programming
7.5.1
I2C Serial Interface
7.5.2
One-Time Programming Sequence
8
Device Registers
8.1
Register Maps
8.1.1
R0 Register (Address = 0x0) [reset = 0x0861/0x0863]
8.1.2
R1 Register (Address = 0x1) [reset = 0x5599]
8.1.3
R2 Register (Address = 0x2) [reset = 0xC28F]
8.1.4
R3 Register (Address = 0x3) [reset = 0x1804]
8.1.5
R4 Register (Address = 0x4) [reset = 0x0000]
8.1.6
R5 Register (Address = 0x5) [reset = 0x0000]
8.1.7
R6 Register (Address = 0x6) [reset = 0x0AA7]
8.1.8
R7 Register (Address = 0x7) [reset = 0x5D1F]
8.1.9
R8 Register (Address = 0x8) [reset = 0xC28F]
8.1.10
R9 Register (Address = 0x9) [reset = 0x3000/0x1000]
8.1.11
R10 Register (Address = 0xA) [reset = 0x0010]
8.1.12
R11 Register (Address = 0xB) [reset = 0x0000]
8.1.13
R12 Register (Address = 0xC) [reset = 0xE800]
8.1.14
R238 Register (Address = 0xEE) [reset = 0x0000]
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Application Block Diagram Examples
9.2.2
Design Requirements
9.2.3
Detailed Design Procedure
9.2.4
Example: Changing Output Frequency
9.2.5
Crosstalk
9.3
Power Supply Recommendations
9.3.1
Power-Up Sequencing
9.3.2
Decoupling Power Supply Inputs
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
1
Features
Ambient Temperature:
–40°C to 85°C
Integrated BAW resonator, no need for external reference
Flexible frequency generation:
1.8V/2.5V/3.3V LVCMOS outputs supported up to 200MHz
Dual Fractional Output Dividers (FODs)
Up to three unique output frequencies from 2.5MHz to 200MHz
Example: OUTA/B/C/D/E = 25MHz
Example: OUTA/B = 100MHz, OUTC/D = 50MHz, OUTE = 25MHz
Generation of up to 5 LVCMOS clocks on OUTA through OUTE pins
Total output frequency stability: ±25ppm
2 functional modes:
I2C
or preprogrammed
OTP
Mixed SSC and non-SSC output support
Programmable SSC modulation depth
Preprogrammed: –0.1%, –0.25%, –0.3%,
and –0.5% down spread
Register programmable: –0.1% to –3% down spread or ±0.05% to ±1.5% center spread
1.8V to 3.3V supply voltage
Start-up time: <5ms
Output skew: <50ps (outputs from the same FOD)
Fail-safe
input and VDD pins