SNIS238 July   2025 TMP9R01-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Information
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Series Resistance Cancellation
      4. 7.3.4 Differential Input Capacitance
      5. 7.3.5 Filtering
      6. 7.3.6 Sensor Fault
      7. 7.3.7 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
  9. 8 Register Map
    1. 8.1 Register Information
      1. 8.1.1  Pointer Register
      2. 8.1.2  Local and Remote Temperature Registers
      3. 8.1.3  Status Register
      4. 8.1.4  Configuration Register
      5. 8.1.5  Conversion Rate Register
      6. 8.1.6  One-Shot Start Register
      7. 8.1.7  Channel Enable Register
      8. 8.1.8  Consecutive ALERT Register
      9. 8.1.9  η-Factor Correction Register
      10. 8.1.10 Remote Temperature Offset Register
      11. 8.1.11 Manufacturer Identification Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Radiation Environments
      1. 9.3.1 Single Event Latch-Up
      2. 9.3.2 Single Event Functional Interrupt
      3. 9.3.3 Single Event Upset
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Related Documentation
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.1 Overview

The TMP9R01-SEP device is a digital temperature sensor that combines a local temperature measurement channel and a remote-junction temperature measurement channel in a single VSSOP DGS-10 package. The device is two-wire- and SMBus-interface-compatible with nine pin-programmable bus address options, and is specified over a temperature range of –55°C to 125°C. The TMP9R01-SEP device also contains multiple registers for programming and holding configuration settings, temperature limits, and temperature measurement results.

The TMP9R01-SEP requires only a transistor connected between D+ and D– for proper remote temperature sensing operation. The SCL and SDA interface pins require pullup resistors as part of the communication bus, while ALERT and THERM pins are open-drain outputs that require pullup resistors. ALERT and THERM pins can be shared with other devices for a wired-OR implementation, if desired. TI recommends using a 0.1µF power-supply bypass capacitor for good local bypassing. Figure 7-1 shows a typical configuration for the TMP9R01-SEP.

TMP9R01-SEP Basic ConnectionsFigure 7-1 Basic Connections

A. Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance cancellation. NPN transistors must be diode-connected. PNP transistors can either be transistor or diode-connected. For more information on NPN/PNP transistors see Remote Temperature Sensor Transistor Selection Guide application note.
B. Rs (optional) must be < 1kΩ in most applications. Selections of Rs depends on specific applications; see the Section 7.3.5
C. CDIFF (optional) must be < 1000pF in most applications. Selection of CDIFF depends on specific application; see the Section 7.3.5 and Figure 6-8.