SNIS238 July   2025 TMP9R01-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Information
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Series Resistance Cancellation
      4. 7.3.4 Differential Input Capacitance
      5. 7.3.5 Filtering
      6. 7.3.6 Sensor Fault
      7. 7.3.7 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
  9. 8 Register Map
    1. 8.1 Register Information
      1. 8.1.1  Pointer Register
      2. 8.1.2  Local and Remote Temperature Registers
      3. 8.1.3  Status Register
      4. 8.1.4  Configuration Register
      5. 8.1.5  Conversion Rate Register
      6. 8.1.6  One-Shot Start Register
      7. 8.1.7  Channel Enable Register
      8. 8.1.8  Consecutive ALERT Register
      9. 8.1.9  η-Factor Correction Register
      10. 8.1.10 Remote Temperature Offset Register
      11. 8.1.11 Manufacturer Identification Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Radiation Environments
      1. 9.3.1 Single Event Latch-Up
      2. 9.3.2 Single Event Functional Interrupt
      3. 9.3.3 Single Event Upset
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Related Documentation
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.9 Typical Characteristics

At TA = 25°C and V+ = 3.6V, unless otherwise noted.

TMP9R01-SEP Local Temperature Error vs Ambient Temperature
Typical behavior of 20 devices over temperature
Figure 6-2 Local Temperature Error vs Ambient Temperature
TMP9R01-SEP Remote Temperature Error vs Series Resistance (Diode-Connected PNP Transistor, 2N3906)Figure 6-4 Remote Temperature Error vs Series Resistance (Diode-Connected PNP Transistor, 2N3906)
TMP9R01-SEP Remote Temperature Error vs Leakage Resistance
Figure 6-6 Remote Temperature Error vs Leakage Resistance
TMP9R01-SEP Remote Temperature Error vs Differential Capacitance
No physical series resistance on D+, D– pins during measurement
Figure 6-8 Remote Temperature Error vs Differential Capacitance
TMP9R01-SEP Shutdown Current vs SCL Clock FrequencyFigure 6-10 Shutdown Current vs SCL Clock Frequency
TMP9R01-SEP Shutdown Current vs Supply Voltage (serial bus inactive)
Figure 6-12 Shutdown Current vs Supply Voltage (serial bus inactive)
TMP9R01-SEP Shutdown Current vs TemperatureFigure 6-14 Shutdown Current vs Temperature
TMP9R01-SEP Conversion Time vs Temperature (Local and Local + Remote)Figure 6-16 Conversion Time vs Temperature (Local and Local + Remote)
TMP9R01-SEP Temperature Thermal Response (Stirred Liquid)
Local: soldered devices on 62mil 2-layer FR4 PCB
Remote: characterized with 2N3906 PNP Transistor
Figure 6-18 Temperature Thermal Response (Stirred Liquid)
TMP9R01-SEP Remote Temperature Error vs Ambient Temperature
Typical behavior of 20 devices over temperature
Figure 6-3 Remote Temperature Error vs Ambient Temperature
TMP9R01-SEP Remote Temperature Error vs Series Resistance (GND Collector-Connected PNP Transistor, 2N3906)Figure 6-5 Remote Temperature Error vs Series Resistance (GND Collector-Connected PNP Transistor, 2N3906)
TMP9R01-SEP Remote Temperature Error vs Power-Supply Noise FrequencyFigure 6-7 Remote Temperature Error vs Power-Supply Noise Frequency
TMP9R01-SEP Average Current vs Conversion RateFigure 6-9 Average Current vs Conversion Rate
TMP9R01-SEP Average Current vs Supply Voltage (At Default Conversion Rate of 16Hz)
Figure 6-11 Average Current vs Supply Voltage (At Default Conversion Rate of 16Hz)
TMP9R01-SEP Standby Current vs TemperatureFigure 6-13 Standby Current vs Temperature
TMP9R01-SEP Active Current vs Temperature (Local and Remote)Figure 6-15 Active Current vs Temperature (Local and Remote)
TMP9R01-SEP Remote Temperature Noise Data Distribution (300 Samples)Figure 6-17 Remote Temperature Noise Data Distribution (300 Samples)