SNOSDL9B December   2024  – May 2026 LMG5126

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Configuration
      2. 6.3.2  Device Enable/Disable (UVLO/EN)
      3. 6.3.3  Multi-Device Operation
      4. 6.3.4  Switching Frequency and Synchronization (SYNCIN)
      5. 6.3.5  Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Operation Modes (BYPASS, DEM, FPWM)
      7. 6.3.7  VCC Regulator, BIAS (BIAS-pin, VCC-pin)
      8. 6.3.8  Soft Start (SS-pin)
      9. 6.3.9  VOUT Programming (VOUT, ATRK, DTRK)
      10. 6.3.10 Protections
        1. 6.3.10.1 VOUT Overvoltage Protection (OVP)
        2. 6.3.10.2 Thermal Shutdown (TSD)
      11. 6.3.11 Power-Good Indicator (PGOOD-pin)
      12. 6.3.12 Slope Compensation (CSA, CSB)
      13. 6.3.13 Current Sense Setting and Switch Peak Current Limit (CSA, CSB)
      14. 6.3.14 Input Current Limit and Monitoring (ILIM, IMON, DLY)
      15. 6.3.15 Maximum Duty Cycle and Minimum Controllable On-time Limits
      16. 6.3.16 GAN Drivers, Integrated Boot Capacitor and Diode, and Hiccup Mode Fault Protection
      17. 6.3.17 Signal Deglitch Overview
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Feedback Compensation
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1  Custom Design With WEBENCH® Tools
        2. 7.2.3.2  Determine the Total Phase Number
        3. 7.2.3.3  Determining the Duty Cycle
        4. 7.2.3.4  Timing Resistor RT
        5. 7.2.3.5  Inductor Selection Lm
        6. 7.2.3.6  Current Sense Resisitor Rcs
        7. 7.2.3.7  Current Sense Filter RCSFA, RCSFB, CCS
        8. 7.2.3.8  Snubber Components
        9. 7.2.3.9  Vout Programming
        10. 7.2.3.10 Input Current Limit (ILIM/IMON)
        11. 7.2.3.11 Minimum Load Resistor
        12. 7.2.3.12 UVLO Divider
        13. 7.2.3.13 Soft Start
        14. 7.2.3.14 Output Capacitor Cout
        15. 7.2.3.15 Input Capacitor Cin
        16. 7.2.3.16 VCC Capacitor CVCC
        17. 7.2.3.17 BIAS Capacitor
        18. 7.2.3.18 VOUT Capacitor
        19. 7.2.3.19 Loop Compensation
      4. 7.2.4 Application Curves
        1. 7.2.4.1 Efficiency
        2. 7.2.4.2 Steady State Waveforms
        3. 7.2.4.3 Step Load Response
        4. 7.2.4.4 Thermal Performance
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

VOUT Programming (VOUT, ATRK, DTRK)

The output voltage VOUT is sensed at the VOUT-pin. Program VOUT between 6V and 60V by connecting a 10kΩ to 100kΩ resistor at the ATRK/DTRK-pin, applying a voltage between 0.2V and 2V or a digital signal between 8% and 80% duty cycle. At startup during the STANDBY state (see Functional State Diagram) the ATRK/DTRK-pin programming method analog signal or digital signal is detected. At the transition to the START state the ATRK/DTRK-pin programming method is latched and cannot be changed during operation. Allow a DTRK signal to be present for at least three cycles so that the DTRK signal is detected before the programming method latches. ATRK supports up to 10kHz signals, however, change the ATRK-pin voltage or the DTRK duty cycle slow enough that VOUT is able to follow. In case the ATRK/DTRK-pin set reference voltage is changed faster than the converters bandwidth, the inductor current exceeds peak current limit until the slope compensation settles. The device tries to regulate VOUT as well for ATRK < 0.2V or > 2V, but performance is not endured. Enable the 20μA current by SYNCOUT setting for VOUT programming by resistor. The 20μA current is sourced through the ATRK-pin and generates the required ATRK voltage for the target VOUT voltage via the external resistor. For analog tracking (ATRK) or digital tracking (DTRK), TI recommends to disable the 20uA current.

Equation for programming VOUT by resistor:

Equation 11. RATRK= VOUT6V×10

Equation for programming VOUT by voltage (ATRK):

Equation 12. VOUT= VATRK×30

Equation for programming VOUT by digital signal (DTRK):

Equation 13. VOUT= 0.75 V%×Duty Cycle
LMG5126 VOUT Programming by ResistorFigure 6-15 VOUT Programming by Resistor
LMG5126 VOUT Tracking by Digital SignalFigure 6-17 VOUT Tracking by Digital Signal
LMG5126 VOUT Tracking by Analog VoltageFigure 6-16 VOUT Tracking by Analog Voltage