SPRACZ7 January   2022 TMS320F28075 , TMS320F28075-Q1 , TMS320F28076 , TMS320F28232 , TMS320F28232-Q1 , TMS320F28234 , TMS320F28234-Q1 , TMS320F28235 , TMS320F28235-Q1 , TMS320F28332 , TMS320F28333 , TMS320F28334 , TMS320F28335 , TMS320F28335-Q1 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1 , TMS320F28379S

 

  1.   Trademarks
  2. 1 Introduction
    1. 1.1 Abbreviations
  3. 2 Central Processing Unit (CPU)
  4. 3 Development Tools
    1. 3.1 Driver Library (Driverlib)
    2. 3.2 Embedded Application Binary Interface (EABI) Support
  5. 4 Package and Pinout
  6. 5 Operating Frequency and Power Management
  7. 6 Power Sequencing
  8. 7 Input Clock Options
  9. 8 Memory Map
  10. 9 Flash and OTP
    1. 9.1 Size and Number of Sectors
    2. 9.2 Flash Parameters
    3. 9.3 Flash Programming
    4. 9.4 Entry Point into Flash
    5. 9.5 Dual Code Security Module (DCSM) and Password Locations
    6. 9.6 OTP
  11. 10Boot ROM
    1. 10.1 Boot ROM Reserved RAM
    2. 10.2 Boot Mode Selection
    3. 10.3 Bootloaders
  12. 11Architectural Enhancements
    1. 11.1 Clock Sources and Domains
    2. 11.2 Watchdog Timer
    3. 11.3 Peripheral Interrupt Expansion (PIE)
    4. 11.4 Lock Protection Registers
    5. 11.5 General-Purpose Input/Output (GPIO)
    6. 11.6 External Interrupts
    7. 11.7 Crossbar (X-BAR)
  13. 12Peripherals
    1. 12.1 New Peripherals
      1. 12.1.1 Analog Subsystem Interconnect
      2. 12.1.2 Comparator Subsystem (CMPSS)
      3. 12.1.3 Control Law Accelerator (CLA)
    2. 12.2 Control Peripherals
      1. 12.2.1 Enhanced Pulse Width Modulator (ePWM)
      2. 12.2.2 Enhanced Capture Module (eCAP)
      3. 12.2.3 Enhanced Quadrature Encode Pulse Module (eQEP)
      4. 12.2.4 Sigma-Delta Filter Module (SDFM)
    3. 12.3 Analog Peripherals
      1. 12.3.1 Analog-to-Digital Converter (ADC)
    4. 12.4 Communication Peripherals
      1. 12.4.1 SPI
      2. 12.4.2 SCI
      3. 12.4.3 USB
      4. 12.4.4 I2C
      5. 12.4.5 CAN
  14. 13Configurable Logic Block (CLB)
  15. 14Device Comparison Summary
  16. 15References

1 Introduction

The TMS320F2833x/2823x and TMS320F2837xD/2837xS/2807x are device members of the C2000 MCU product family. These devices are most commonly used in embedded control applications. The TMS320F2837xD/2837xS/2807x devices feature an updated version of the enhanced control peripherals found on the TMS320F2833x/2823x, which allows for greater flexibility and improved application performance. In addition, the TMS320F2837xD/2837xS/2807x devices feature a boot mode flow which enables expanded booting options that provide the ability to use alternate boot mode selection pins. Enhancements to the CPU include the addition of a trigonometric math unit (TMU) and a Viterbi/Complex Math Unit (VCU-II). Other device enhancements include eight cross-bars (XBARs) for providing a flexible means for interconnecting multiple inputs, outputs, and internal resources.

For the purposes of migration, these devices will be referenced in two groups:

  • TMS320F2833x and TMS3202823x - these devices will be referenced as the F2833x and F2823x, respectively. When referenced as both the F2833x and F2823x, this combined group of devices may be referenced as F2833x/23x . If a feature is unique to a specific device type, it will be referenced as F2833x or F2823x.
  • TMS320F2837xD, TMS320F2837xS and TMS320F2807x - these devices will be referenced as the F2837xD, F2837xS and F2807x respectively. The combined group of devices may be referenced as F2837xD/S/07x . If a feature is unique to a specific device type, it will be referenced as F2837xD, F2837xS or F2807x.

For a full list of devices currently available within the F2833x/23x and F2837xD/S/07x families, see the TI website at http://www.ti.com/c2000.

As the focus of this document is to describe the differences between the two device groups, the descriptions are explained only to the extent of highlighting areas that require attention when moving an application from one device to the other. For a detailed description of features specific to each device, see the device-specific technical reference manuals available on the TI website. This application report does not cover the silicon exceptions or advisories that may be present on each device.

Consult the following silicon errata for specific advisories and workarounds:

Note: For information regarding any electrical specifications, see the device-specific data sheet.