SPRSP77D March   2023  – June 2025 AM62A1-Q1 , AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        17
          2.        18
          3.        19
          4.        20
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        23
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        26
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        29
      6. 5.3.5  DSS
        1. 5.3.5.1 MAIN Domain
          1.        32
      7. 5.3.6  ECAP
        1. 5.3.6.1 MAIN Domain
          1.        35
          2.        36
          3.        37
      8. 5.3.7  Emulation and Debug
        1. 5.3.7.1 MAIN Domain
          1.        40
        2. 5.3.7.2 MCU Domain
          1.        42
      9. 5.3.8  EPWM
        1. 5.3.8.1 MAIN Domain
          1.        45
          2.        46
          3.        47
          4.        48
      10. 5.3.9  EQEP
        1. 5.3.9.1 MAIN Domain
          1.        51
          2.        52
          3.        53
      11. 5.3.10 GPIO
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
        2. 5.3.10.2 MCU Domain
          1.        59
      12. 5.3.11 GPMC
        1. 5.3.11.1 MAIN Domain
          1.        62
      13. 5.3.12 I2C
        1. 5.3.12.1 MAIN Domain
          1.        65
          2.        66
          3.        67
          4.        68
        2. 5.3.12.2 MCU Domain
          1.        70
        3. 5.3.12.3 WKUP Domain
          1.        72
      14. 5.3.13 MCAN
        1. 5.3.13.1 MAIN Domain
          1.        75
        2. 5.3.13.2 MCU Domain
          1.        77
          2.        78
      15. 5.3.14 MCASP
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
          3.        83
      16. 5.3.15 MCSPI
        1. 5.3.15.1 MAIN Domain
          1.        86
          2.        87
          3.        88
        2. 5.3.15.2 MCU Domain
          1.        90
          2.        91
      17. 5.3.16 MDIO
        1. 5.3.16.1 MAIN Domain
          1.        94
      18. 5.3.17 MMC
        1. 5.3.17.1 MAIN Domain
          1.        97
          2.        98
          3.        99
      19. 5.3.18 OSPI
        1. 5.3.18.1 MAIN Domain
          1.        102
      20. 5.3.19 Power Supply
        1.       104
      21. 5.3.20 Reserved
        1.       106
      22. 5.3.21 System and Miscellaneous
        1. 5.3.21.1 Boot Mode Configuration
          1. 5.3.21.1.1 MAIN Domain
            1.         110
        2. 5.3.21.2 Clock
          1. 5.3.21.2.1 MCU Domain
            1.         113
          2. 5.3.21.2.2 WKUP Domain
            1.         115
        3. 5.3.21.3 System
          1. 5.3.21.3.1 MAIN Domain
            1.         118
          2. 5.3.21.3.2 MCU Domain
            1.         120
          3. 5.3.21.3.3 WKUP Domain
            1.         122
        4. 5.3.21.4 VMON
          1.        124
      23. 5.3.22 TIMER
        1. 5.3.22.1 MAIN Domain
          1.        127
        2. 5.3.22.2 MCU Domain
          1.        129
        3. 5.3.22.3 WKUP Domain
          1.        131
      24. 5.3.23 UART
        1. 5.3.23.1 MAIN Domain
          1.        134
          2.        135
          3.        136
          4.        137
          5.        138
          6.        139
          7.        140
        2. 5.3.23.2 MCU Domain
          1.        142
        3. 5.3.23.3 WKUP Domain
          1.        144
      25. 5.3.24 USB
        1. 5.3.24.1 MAIN Domain
          1.        147
          2.        148
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 6.3  ESD Ratings for AEC - Q100 Qualified Devices
    4. 6.4  Power-On Hours (POH)
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Operating Performance Points
    7. 6.7  Power Consumption Summary
    8. 6.8  Electrical Characteristics
      1. 6.8.1 I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.8.2 Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.8.3 High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.8.4 Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.8.5 SDIO Electrical Characteristics
      6. 6.8.6 LVCMOS Electrical Characteristics
      7. 6.8.7 CSI-2 (D-PHY) Electrical Characteristics
      8. 6.8.8 USB2PHY Electrical Characteristics
      9. 6.8.9 DDR Electrical Characteristics
    9. 6.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.9.2 Hardware Requirements
      3. 6.9.3 Programming Sequence
      4. 6.9.4 Impact to Your Hardware Warranty
    10. 6.10 Thermal Resistance Characteristics
      1. 6.10.1 Thermal Resistance Characteristics for AMB and ANF Packages
    11. 6.11 Temperature Sensor Characteristics
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Timing Parameters and Information
      2. 6.12.2 Power Supply Requirements
        1. 6.12.2.1 Power Supply Slew Rate Requirement
        2. 6.12.2.2 Power Supply Sequencing
          1. 6.12.2.2.1 Power-Up Sequencing
          2. 6.12.2.2.2 Power-Down Sequencing
          3. 6.12.2.2.3 Partial IO Power Sequencing
      3. 6.12.3 System Timing
        1. 6.12.3.1 Reset Timing
        2. 6.12.3.2 Error Signal Timing
        3. 6.12.3.3 Clock Timing
      4. 6.12.4 Clock Specifications
        1. 6.12.4.1 Input Clocks / Oscillators
          1. 6.12.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.12.4.1.1.1 Load Capacitance
            2. 6.12.4.1.1.2 Shunt Capacitance
          2. 6.12.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.12.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.12.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.12.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.12.4.2 Output Clocks
        3. 6.12.4.3 PLLs
        4. 6.12.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.12.5 Peripherals
        1. 6.12.5.1  CPSW3G
          1. 6.12.5.1.1 CPSW3G MDIO Timing
          2. 6.12.5.1.2 CPSW3G RMII Timing
          3. 6.12.5.1.3 CPSW3G RGMII Timing
        2. 6.12.5.2  CPTS
        3. 6.12.5.3  CSI-2
        4. 6.12.5.4  DDRSS
        5. 6.12.5.5  DSS
        6. 6.12.5.6  ECAP
        7. 6.12.5.7  Emulation and Debug
          1. 6.12.5.7.1 Trace
          2. 6.12.5.7.2 JTAG
        8. 6.12.5.8  EPWM
        9. 6.12.5.9  EQEP
        10. 6.12.5.10 GPIO
        11. 6.12.5.11 GPMC
          1. 6.12.5.11.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.12.5.11.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.12.5.11.3 GPMC and NAND Flash — Asynchronous Mode
        12. 6.12.5.12 I2C
        13. 6.12.5.13 MCAN
        14. 6.12.5.14 MCASP
        15. 6.12.5.15 MCSPI
          1. 6.12.5.15.1 MCSPI — Controller Mode
          2. 6.12.5.15.2 MCSPI — Peripheral Mode
        16. 6.12.5.16 MMCSD
          1. 6.12.5.16.1 MMC0 - eMMC/SD/SDIO Interface
            1. 6.12.5.16.1.1  Legacy SDR Mode
            2. 6.12.5.16.1.2  High Speed SDR Mode
            3. 6.12.5.16.1.3  High Speed DDR Mode
            4. 6.12.5.16.1.4  HS200 Mode
            5. 6.12.5.16.1.5  Default Speed Mode
            6. 6.12.5.16.1.6  High Speed Mode
            7. 6.12.5.16.1.7  UHS–I SDR12 Mode
            8. 6.12.5.16.1.8  UHS–I SDR25 Mode
            9. 6.12.5.16.1.9  UHS–I SDR50 Mode
            10. 6.12.5.16.1.10 UHS–I DDR50 Mode
            11. 6.12.5.16.1.11 UHS–I SDR104 Mode
          2. 6.12.5.16.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.12.5.16.2.1 Default Speed Mode
            2. 6.12.5.16.2.2 High Speed Mode
            3. 6.12.5.16.2.3 UHS–I SDR12 Mode
            4. 6.12.5.16.2.4 UHS–I SDR25 Mode
            5. 6.12.5.16.2.5 UHS–I SDR50 Mode
            6. 6.12.5.16.2.6 UHS–I DDR50 Mode
            7. 6.12.5.16.2.7 UHS–I SDR104 Mode
        17. 6.12.5.17 OSPI
          1. 6.12.5.17.1 OSPI0 PHY Mode
            1. 6.12.5.17.1.1 OSPI0 With PHY Data Training
            2. 6.12.5.17.1.2 OSPI0 Without Data Training
              1. 6.12.5.17.1.2.1 OSPI0 PHY SDR Timing
              2. 6.12.5.17.1.2.2 OSPI0 PHY DDR Timing
          2. 6.12.5.17.2 OSPI0 Tap Mode
            1. 6.12.5.17.2.1 OSPI0 Tap SDR Timing
            2. 6.12.5.17.2.2 OSPI0 Tap DDR Timing
        18. 6.12.5.18 Timers
        19. 6.12.5.19 UART
        20. 6.12.5.20 USB
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53 Subsystem
      2. 7.2.2 Device/Power Manager
      3. 7.2.3 MCU Arm Cortex-R5F Subsystem
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 C7xV-256 Deep Learning Accelerator
      2. 7.3.2 Vision Pre-processing Accelerator
      3. 7.3.3 JPEG Encoder
      4. 7.3.4 Video Accelerator
    4. 7.4 Other Subsystems
      1. 7.4.1 Dual Clock Comparator (DCC)
      2. 7.4.2 Data Movement Subsystem (DMSS)
      3. 7.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 7.4.4 Peripheral DMA Controller (PDMA)
      5. 7.4.5 Real-Time Clock (RTC)
    5. 7.5 Peripherals
      1. 7.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 7.5.2  Camera Serial Interface Receiver (CSI_RX_IF)
      3. 7.5.3  Display Subsystem (DSS)
      4. 7.5.4  Enhanced Capture (ECAP)
      5. 7.5.5  Error Location Module (ELM)
      6. 7.5.6  Enhanced Pulse Width Modulation (EPWM)
      7. 7.5.7  Error Signaling Module (ESM)
      8. 7.5.8  Enhanced Quadrature Encoder Pulse (EQEP)
      9. 7.5.9  General-Purpose Interface (GPIO)
      10. 7.5.10 General-Purpose Memory Controller (GPMC)
      11. 7.5.11 Global Timebase Counter (GTC)
      12. 7.5.12 Inter-Integrated Circuit (I2C)
      13. 7.5.13 Modular Controller Area Network (MCAN)
      14. 7.5.14 Multichannel Audio Serial Port (MCASP)
      15. 7.5.15 Multichannel Serial Peripheral Interface (MCSPI)
      16. 7.5.16 Multi-Media Card Secure Digital (MMCSD)
      17. 7.5.17 Octal Serial Peripheral Interface (OSPI)
      18. 7.5.18 Timers
      19. 7.5.19 Universal Asynchronous Receiver/Transmitter (UART)
      20. 7.5.20 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

4 Device Comparison

Table 4-1 shows a comparison between devices, highlighting the differences.

Note: Availability of features listed in this table are a function of shared IO pins, where IO signals associated with many of the features are multiplexed to a limited number of pins. The SysConfig tool should be used to assign signal functions to pins. This will provide a better understanding of limitations associated with pin multiplexing.
Note: To understand what device features are currently supported by TI Software Development Kits (SDKs), search for the AM62Ax Software Build Sheet located in the Downloads tab option provided at Processor-SDK-AM62Ax.
Table 4-1 Device Comparison
FEATURES REFERENCE
NAME		 AM62A7, AM62A7-Q1 AM62A3, AM62A3-Q1 AM62A1-Q1
AM62A74 AM62A72 AM62A34 AM62A32 AM62A31 AM62A14 AM62A12
WKUP_CTRL_MMR_CFG0_JTAG_USER_ID[31:13] (1)
Register bit values by device "Features" code (See Nomenclature Description table for more information on device features)
L: – 0x253AC 0x251EC 0x251AC 0x2518C – –
M: 0x253ED 0x253AD 0x251ED 0x251AD – 0x250ED 0x250AD
PROCESSORS AND ACCELERATORS
Speed Grades See Table 6-1, Device Speed Grades
Arm Cortex-A53
Microprocessor Subsystem		 Arm A53 Quad Core Dual Core Quad Core Dual Core Single Core Quad Core Dual Core
Arm Cortex-R5F in MCU domain MCU_R5F Single Core
Functional Safety Optional(4)
C7xV-256 Deep Learning Accelerator C7x MMA Up to 2 TOPS Up to 1 TOPS No
(0 TOPS)
Vision Processing Accelerators VPAC Up to 5MP @ 60 fps
Video Encoder / Decoder VENC/VDEC Yes
Motion JPEG Encoder MJPEG Yes
Device Management Subsystem WKUP_R5F Single Core
Hardware Security Module HSM Yes
Crypto Accelerators Security Yes
PROGRAM AND DATA STORAGE
On-Chip Shared Memory (RAM) in MAIN Domain OCSRAM 64KB
On-Chip Shared Memory (RAM) in MCU Domain MCU_MSRAM 512KB
LPDDR4 DDR Subsystem DDRSS 32-bit data with inline ECC up to 8GB
General-Purpose Memory Controller GPMC Up to 128MB with ECC
PERIPHERALS
Display Subsystem(2) DSS 1x DPI (Optional)
Modular Controller Area Network Interface MCAN 3
Full CAN-FD Support CAN-FD Yes
General-Purpose I/O GPIO Up to 168
Inter-Integrated Circuit Interface I2C 6
Multichannel Audio Serial Port MCASP 3
Multichannel Serial Peripheral Interface MCSPI 5
Multi-Media Card/ Secure Digital Interface MM/CSD 1x eMMC (8-bits)
2x SD/SDIO (4-bits)
OSPI/QSPI/SPI(3) Flash Subsystem OSPI Yes
Gigabit Ethernet Interface CPSW3G Yes
General-Purpose Timers TIMER 12 (4 in MCU Channel)
Enhanced Pulse-Width Modulator Module EPWM 3
Enhanced Capture Module ECAP 3
Enhanced Quadrature Encoder Pulse Module EQEP 3
Universal Asynchronous Receiver and Transmitter UART 9
CSI2-RX Controller with DPHY CSI-RX 1
USB2.0 Controller with PHY USB 2.0 2
(1) For more details about the CTRLMMR_WKUP_JTAG_DEVICE_ID register and DEVICE_ID bit field, see the device TRM.
(2) Display Subsystem is available when selecting an orderable part number that includes a feature code of M. Refer to Device Naming Convention for definition of feature codes.
(3) A single instance of an OSPI flash host configured to operate with OSPI/QSPI/SPI devices.
(4) Functional Safety is available when selecting an orderable part number that includes a feature code of S to Z. Refer to Device Naming Convention for definition of feature codes.