SPRSP89C December   2023  – October 2025 AM62P , AM62P-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
    1. 3.1 Functional Block Diagram
  5. Device Comparison
    1. 4.1 Related Products
  6. Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        17
          2.        18
          3.        19
          4.        20
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        23
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        26
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        29
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        32
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        35
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        38
          2.        39
          3.        40
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        43
        2. 5.3.8.2 MCU Domain
          1.        45
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        48
          2.        49
          3.        50
          4.        51
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        54
          2.        55
          3.        56
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        59
          2.        60
        2. 5.3.11.2 MCU Domain
          1.        62
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        65
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        68
          2.        69
          3.        70
          4.        71
        2. 5.3.13.2 MCU Domain
          1.        73
        3. 5.3.13.3 WKUP Domain
          1.        75
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        78
          2.        79
        2. 5.3.14.2 MCU Domain
          1.        81
          2.        82
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        85
          2.        86
          3.        87
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        90
          2.        91
          3.        92
        2. 5.3.16.2 MCU Domain
          1.        94
          2.        95
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        98
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        101
          2.        102
          3.        103
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        106
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        109
      22. 5.3.21 Power Supply
        1.       111
      23. 5.3.22 Reserved
        1.       113
      24. 5.3.23 System and Miscellaneous
        1. 5.3.23.1 Boot Mode Configuration
          1. 5.3.23.1.1 MAIN Domain
            1.         117
        2. 5.3.23.2 Clock
          1. 5.3.23.2.1 MCU Domain
            1.         120
          2. 5.3.23.2.2 WKUP Domain
            1.         122
        3. 5.3.23.3 System
          1. 5.3.23.3.1 MAIN Domain
            1.         125
          2. 5.3.23.3.2 MCU Domain
            1.         127
          3. 5.3.23.3.3 WKUP Domain
            1.         129
        4. 5.3.23.4 VMON
          1.        131
      25. 5.3.24 TIMER
        1. 5.3.24.1 MAIN Domain
          1.        134
        2. 5.3.24.2 MCU Domain
          1.        136
        3. 5.3.24.3 WKUP Domain
          1.        138
      26. 5.3.25 UART
        1. 5.3.25.1 MAIN Domain
          1.        141
          2.        142
          3.        143
          4.        144
          5.        145
          6.        146
          7.        147
        2. 5.3.25.2 MCU Domain
          1.        149
        3. 5.3.25.3 WKUP Domain
          1.        151
      27. 5.3.26 USB
        1. 5.3.26.1 MAIN Domain
          1.        154
          2.        155
    4. 5.4 Pin Connectivity Requirements
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 6.3  ESD Ratings for AEC - Q100 Qualified Devices
    4. 6.4  Power-On Hours (POH)
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Operating Performance Points
    7. 6.7  Power Consumption Summary
    8. 6.8  Electrical Characteristics
      1. 6.8.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.8.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.8.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.8.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.8.5  eMMCPHY Electrical Characteristics
      6. 6.8.6  SDIO Electrical Characteristics
      7. 6.8.7  LVCMOS Electrical Characteristics
      8. 6.8.8  OLDI LVDS (OLDI) Electrical Characteristics
      9. 6.8.9  CSI-2 (D-PHY) Electrical Characteristics
      10. 6.8.10 DSI (D-PHY) Electrical Characteristics
      11. 6.8.11 USB2PHY Electrical Characteristics
      12. 6.8.12 DDR Electrical Characteristics
    9. 6.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.9.2 Hardware Requirements
      3. 6.9.3 Programming Sequence
      4. 6.9.4 Impact to Your Hardware Warranty
    10. 6.10 Thermal Resistance Characteristics
      1. 6.10.1 Thermal Resistance Characteristics for AMH Package
    11. 6.11 Temperature Sensor Characteristics
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Timing Parameters and Information
      2. 6.12.2 Power Supply Requirements
        1. 6.12.2.1 Power Supply Slew Rate Requirement
        2. 6.12.2.2 Power Supply Sequencing
          1. 6.12.2.2.1 Power-Up Sequencing
          2. 6.12.2.2.2 Power-Down Sequencing
          3. 6.12.2.2.3 Partial IO Power Sequencing
      3. 6.12.3 System Timing
        1. 6.12.3.1 Reset Timing
        2. 6.12.3.2 Error Signal Timing
        3. 6.12.3.3 Clock Timing
      4. 6.12.4 Clock Specifications
        1. 6.12.4.1 Input Clocks / Oscillators
          1. 6.12.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.12.4.1.1.1 Load Capacitance
            2. 6.12.4.1.1.2 Shunt Capacitance
          2. 6.12.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.12.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.12.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.12.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.12.4.2 Output Clocks
        3. 6.12.4.3 PLLs
        4. 6.12.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.12.5 Peripherals
        1. 6.12.5.1  CPSW3G
          1. 6.12.5.1.1 CPSW3G MDIO Timing
          2. 6.12.5.1.2 CPSW3G RMII Timing
          3. 6.12.5.1.3 CPSW3G RGMII Timing
        2. 6.12.5.2  CPTS
        3. 6.12.5.3  CSI-2
        4. 6.12.5.4  DDRSS
        5. 6.12.5.5  DSI
        6. 6.12.5.6  DSS
        7. 6.12.5.7  ECAP
        8. 6.12.5.8  Emulation and Debug
          1. 6.12.5.8.1 Trace
          2. 6.12.5.8.2 JTAG
        9. 6.12.5.9  EPWM
        10. 6.12.5.10 EQEP
        11. 6.12.5.11 GPIO
        12. 6.12.5.12 GPMC
          1. 6.12.5.12.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.12.5.12.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.12.5.12.3 GPMC and NAND Flash — Asynchronous Mode
        13. 6.12.5.13 I2C
        14. 6.12.5.14 MCAN
        15. 6.12.5.15 MCASP
        16. 6.12.5.16 MCSPI
          1. 6.12.5.16.1 MCSPI — Controller Mode
          2. 6.12.5.16.2 MCSPI — Peripheral Mode
        17. 6.12.5.17 MMCSD
          1. 6.12.5.17.1 MMC0 - eMMC Interface
            1. 6.12.5.17.1.1 Legacy SDR Mode
            2. 6.12.5.17.1.2 High Speed SDR Mode
            3. 6.12.5.17.1.3 High Speed DDR Mode
            4. 6.12.5.17.1.4 HS200 Mode
            5. 6.12.5.17.1.5 HS400 Mode
          2. 6.12.5.17.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.12.5.17.2.1 Default Speed Mode
            2. 6.12.5.17.2.2 High Speed Mode
            3. 6.12.5.17.2.3 UHS–I SDR12 Mode
            4. 6.12.5.17.2.4 UHS–I SDR25 Mode
            5. 6.12.5.17.2.5 UHS–I SDR50 Mode
            6. 6.12.5.17.2.6 UHS–I DDR50 Mode
            7. 6.12.5.17.2.7 UHS–I SDR104 Mode
        18. 6.12.5.18 OLDI
          1. 6.12.5.18.1 OLDI0 Switching Characteristics
        19. 6.12.5.19 OSPI
          1. 6.12.5.19.1 OSPI0 PHY Mode
            1. 6.12.5.19.1.1 OSPI0 With PHY Data Training
            2. 6.12.5.19.1.2 OSPI0 Without Data Training
              1. 6.12.5.19.1.2.1 OSPI0 PHY SDR Timing
              2. 6.12.5.19.1.2.2 OSPI0 PHY DDR Timing
          2. 6.12.5.19.2 OSPI0 Tap Mode
            1. 6.12.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.12.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.12.5.20 Timers
        21. 6.12.5.21 UART
        22. 6.12.5.22 USB
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53 Subsystem (A53SS)
      2. 7.2.2 Device/Power Manager
      3. 7.2.3 MCU Arm Cortex-R5F Subsystem
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 Graphics Processing Unit (GPU)
      2. 7.3.2 Video Accelerator
    4. 7.4 Other Subsystems
      1. 7.4.1 Dual Clock Comparator (DCC)
      2. 7.4.2 Data Movement Subsystem (DMSS)
      3. 7.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 7.4.4 Peripheral DMA Controller (PDMA)
      5. 7.4.5 Real-Time Clock (RTC)
    5. 7.5 Peripherals
      1. 7.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 7.5.2  Camera Serial Interface Receiver (CSI_RX_IF)
      3. 7.5.3  Display Subsystem (DSS)
      4. 7.5.4  Enhanced Capture (ECAP)
      5. 7.5.5  Error Location Module (ELM)
      6. 7.5.6  Enhanced Pulse Width Modulation (EPWM)
      7. 7.5.7  Error Signaling Module (ESM)
      8. 7.5.8  Enhanced Quadrature Encoder Pulse (EQEP)
      9. 7.5.9  General-Purpose Interface (GPIO)
      10. 7.5.10 General-Purpose Memory Controller (GPMC)
      11. 7.5.11 Global Timebase Counter (GTC)
      12. 7.5.12 Inter-Integrated Circuit (I2C)
      13. 7.5.13 Modular Controller Area Network (MCAN)
      14. 7.5.14 Multichannel Audio Serial Port (MCASP)
      15. 7.5.15 Multichannel Serial Peripheral Interface (MCSPI)
      16. 7.5.16 Multi-Media Card Secure Digital (MMCSD)
      17. 7.5.17 Octal Serial Peripheral Interface (OSPI)
      18. 7.5.18 Timers
      19. 7.5.19 Universal Asynchronous Receiver/Transmitter (UART)
      20. 7.5.20 Universal Serial Bus Subsystem (USBSS)
  9. Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 eMMC HS400 Board Design and Simulation Guidelines
      3. 8.2.3 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.3.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.3.2 External Board Loopback
        3. 8.2.3.3 DQS (only available in Octal SPI devices)
      4. 8.2.4 USB VBUS Design Guidelines
      5. 8.2.5 System Power Supply Monitor Design Guidelines
      6. 8.2.6 High Speed Differential Signal Routing Guidance
      7. 8.2.7 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

HS400 Mode

Table 6-91, Figure 6-75, Table 6-92, and Figure 6-76 present timing requirements and switching characteristics for MMC0 – HS400 Mode.

Table 6-91 MMC0 Timing Requirements – HS400 Mode see Figure 6-75
NO. MIN MAX UNIT
HS4000 tDSMPW Pulse width, MMC0_DS 1.95 ns
HS4001 tRQ_DAT Input skew, MMC0_DS to MMC0_DAT valid 475 ps
HS4002 tRQH_DAT Input skew hold, MMC0_DAT invalid to MMC0_DS 475 ps
HS4003 tRQ_CMD Input skew, MMC0_DS to MMC0_CMD valid NA(1) ps
HS4004 tRQH_CMD Input skew hold, MMC0_CMD invalid to MMC0_DS NA(1) ps
This parameter is only applicable when operating in Enhanced Strobe mode, which is not supported on this device. The CMD input is captured using an internally delayed version of CLK when not operating in Enhanced Strobe mode, and the delay is selected by a tuning algorithm that optimizes CMD input timing. Therefore, it is not possible to define a specific timing requirement for CMD.
AM62P AM62P-Q1 MMC0 –
                    HS400 – Receive Mode Figure 6-75 MMC0 – HS400 – Receive Mode
Table 6-92 MMC0 Switching Characteristics – HS400 Mode see Figure 6-76
NO. PARAMETER DESCRIPTION MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 200 MHz
HS4005 tc(clkH) Cycle time, MMC0_CLK 5.0 ns
HS4006 tw(clkH) Pulse duration, MMC0_CLK high 2.30 ns
HS4007 tw(clkL) Pulse duration, MMC0_CLK low 2.30 ns
HS4008 tosu(cmdV-clkH) Output setup time, MMC0_CMD valid to MMC0_CLK rising edge(1) 2.86 ns
HS4009 tosu(dV-clk) Output setup time, MMC0_DAT[7:0] valid to MMC0_CLK rising or falling edge(1) 0.700 ns
HS40010 toh(clkH-cmdIV) Output hold time, MMC0_CLK rising edge to MMC0_CMD invalid(2) 1.16 ns
HS40011 toh(clk-dIV) Output hold time, MMC0_CLK rising or falling edge to MMC0_DAT[7:0] invalid(2) 0.760 ns
This parameter defines the output setup time provided to the attached device. This time is relative to the next capture clock edge and already includes the maximum propagation delay mismatch value defined in the MMC0 Timing Conditions table. The timing references for this parameter are from mid-supply of the DAT or CMD signal transition to mid-supply of the CLK signal transition. The eMMC standard defines the setup timing references from VIL or VIH of the DAT or CMD signal transition to mid-supply of the CLK signal transition. Therefore, the system designer must consider the impact of the DAT signal slew rate when designing the PCB, and ensure the time it takes for the DAT signal to slew from mid-supply to VIL or VIH does not erode the setup time margin.
This parameter defines the output hold time provided to the attached device. This time is relative to the previous launch clock edge and already includes the maximum propagation delay mismatch value defined in the MMC0 Timing Conditions table. The timing references for this parameter are from mid-supply of the CLK signal transition to mid-supply of the DAT or CMD signal transition. The eMMC standard defines the hold timing references from mid-supply of the CLK signal transition to VIL or VIH of the DAT or CMD signal transition. Therefore, the system designer must consider the impact of the DAT signal slew rate when designing the PCB, and ensure the time it takes for the DAT signal to slew from VIL or VIH to mid-supply does not erode the hold time margin.
AM62P AM62P-Q1 eMMC in –
                    HS400 Mode – Transmitter Mode Figure 6-76 eMMC in – HS400 Mode – Transmitter Mode