SPRUJ07 august   2023 TMS320F28075 , TMS320F28075-Q1 , TMS320F28076 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1 , TMS320F28379S , TMS320F28P650DH , TMS320F28P650DK , TMS320F28P650SH , TMS320F28P650SK , TMS320F28P659DH-Q1 , TMS320F28P659DK-Q1 , TMS320F28P659SH-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Feature Differences Between F2837x and F28P65x
    1. 1.1 F2837x and F28P65x Feature Comparison
  5. 2PCB Hardware Changes
    1. 2.1 PCB Hardware Changes for the 176-Pin PTP and 100-Pin PZP Package
    2. 2.2 Use of Existing 176-Pin F2837x PCB Design
      1.      9
      2. 2.2.1 JTAG TRSTn No-Connect
      3. 2.2.2 GPIO Input Buffer Control Register
      4. 2.2.3 176-Pin GPIO Pin/Multiplex and ADCD Considerations
        1. 2.2.3.1 176-Pin PTP Pins with Different GPIO Assignment
        2. 2.2.3.2 ADCD Channel Migration
    3. 2.3 176-Pin PTP New PCB Design
    4. 2.4 100-Pin PZP New PCB Design
    5. 2.5 337-BGA ZWT Application to 256-BGA ZEJ or 169-BGA NMR
  6. 3Feature Differences for System Consideration
    1. 3.1 New Features in F28P65x
      1. 3.1.1 Lock-step Compare Module (LCM)
      2. 3.1.2 Expanded Analog Channels
      3. 3.1.3 Firmware Update (FWU)
      4. 3.1.4 Flexible GPIO and Digital Input Pins
      5. 3.1.5 ADC Hardware Redundancy Safety Checker
      6. 3.1.6 Flexible Memory Sharing between CPU Subsystems
      7. 3.1.7 Increased RAM Program Memory on CLA
    2. 3.2 Communication Module Changes
    3. 3.3 Control Module Changes
    4. 3.4 Analog Module Differences
    5. 3.5 Other Device Changes
      1. 3.5.1 PIE Channel Mapping
        1. 3.5.1.1 F2837x vs F28P65x PIE Channel Mapping Comparison
      2. 3.5.2 Bootrom
      3. 3.5.3 AGPIO Filter
    6. 3.6 Power Management
      1. 3.6.1 VREGENZ
      2. 3.6.2 POR/BOR
      3. 3.6.3 Power Consumption
    7. 3.7 Memory Module Changes
    8. 3.8 GPIO Multiplexing Changes
      1. 3.8.1 F2837x vs F28P65x GPIO Mux Comparison
    9. 3.9 Analog Multiplexing Changes
      1. 3.9.1 F2837x_176PTP vs F28P65x_176PTP Analog Connections Comparison
  7. 4Application Code Migration From F2837x to F28P65x
    1. 4.1 C2000Ware Header Files
    2. 4.2 Linker Command Files
    3. 4.3 C2000Ware Examples
  8. 5EABI Support
    1. 5.1 NoINIT Struct Fix (Linker Command)
    2. 5.2 Pre-Compiled Libraries
  9.   References

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 

Copyright © 2023, Texas Instruments Incorporated