SPRUJ10E May   2022  – May 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Preface: Read This First
    1. 2.1 Sitara MCU+ Academy
    2. 2.2 If You Need Assistance
    3. 2.3 Important Usage Notes
  6. 2Kit Overview
    1. 3.1 Introduction
    2. 3.2 Kit Contents
    3. 3.3 Specification
      1. 3.3.1 Key Features
      2. 3.3.2 Component Identification
      3. 3.3.3 Functional Block Diagram
    4. 3.4 Device Information
    5. 3.5 BoosterPacks
    6. 3.6 Compliance
    7. 3.7 Security
  7. 3Board Setup
    1. 4.1 Power Requirements
      1. 4.1.1 Power Input Using USB Type-C Connector
      2. 4.1.2 Power Status LEDs
      3. 4.1.3 Power Tree
    2. 4.2 Push Buttons
    3. 4.3 Boot Mode Selection
  8. 4Hardware Description
    1. 5.1  Functional Block Diagram
    2. 5.2  GPIO Mapping
    3. 5.3  Reset
    4. 5.4  Clock
    5. 5.5  Memory Interface
      1. 5.5.1 QSPI
      2. 5.5.2 Board ID EEPROM
    6. 5.6  Ethernet Interface
      1. 5.6.1 Ethernet PHY #1 - CPSW RGMII/ICSSM
      2. 5.6.2 Ethernet PHY #2: CPSW RGMII/ICSSM
      3. 5.6.3 LED Indication in RJ45 Connector
    7. 5.7  I2C
    8. 5.8  Industrial Application LEDs
    9. 5.9  SPI
    10. 5.10 UART
    11. 5.11 MCAN
    12. 5.12 FSI
    13. 5.13 JTAG
    14. 5.14 Test Automation Header
    15. 5.15 LIN
    16. 5.16 MMC
    17. 5.17 ADC and DAC
    18. 5.18 EQEP and SDFM
    19. 5.19 EPWM
    20. 5.20 BoosterPack Headers
    21. 5.21 Pinmux Mapping
  9. 5EVM Revision Design Changes
    1. 6.1 Rev A Design Changes
  10. 6Hardware Design Files
  11. 7References
    1. 8.1 Reference Documents
    2. 8.2 Other TI Components Used in This Design
  12.   Trademarks
  13. 8Revision History

Key Features

The AM263x LaunchPad has the following features:

  • PCB dimensions:
  • Powered through 5V, 3A USB Type-C input
  • Two RJ45 Ethernet ports capable of 1Gb or 100Mb speeds
  • On-board XDS110 debug probe
  • Three push buttons:
    • PORz
    • User interrupt
    • RESETz
  • LEDs for:
    • Power status
    • User testing
    • Ethernet connection
    • I2C driven array
  • CAN connectivity with on-board CAN transceiver
  • Dedicated FSI connector
  • TI Test Automation Header
  • MMC interface to micro SD card connector
  • Two independent Enhanced Quadrature Encoder Pulse (EQEP) based encoder connectors
  • Two independent BoosterPack XL (40 pin) standard connectors featuring stackable headers to maximize expansion through the BoosterPack ecosystem
  • On-Board memory:
    • 128Mbyte QSPI Flash
    • 1Mbyte I2C Board ID EEPROM