SWCS134A October   2017  – February 2025 TPS6508700

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Total Current Consumption
    6. 5.6  Electrical Characteristics: Reference and Monitoring System
    7. 5.7  Electrical Characteristics: Buck Controllers
    8. 5.8  Electrical Characteristics: Synchronous Buck Converters
    9. 5.9  Electrical Characteristics: LDOs
    10. 5.10 Electrical Characteristics: Load Switches
    11. 5.11 Digital Signals: I2C Interface
    12. 5.12 Digital Input Signals (CTLx)
    13. 5.13 Digital Output Signals (IRQB, GPOx)
    14. 5.14 Timing Requirements
    15. 5.15 Switching Characteristics
    16. 5.16 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 SMPS Voltage Regulators
      1. 6.3.1 Controller Overview
      2. 6.3.2 Converter Overview
      3. 6.3.3 Dynamic Voltage Scaling
      4. 6.3.4 Current Limit
    4. 6.4 LDO Regulators and Load Switches
      1. 6.4.1 VTT LDO
      2. 6.4.2 LDOA1–LDOA3
      3. 6.4.3 Load Switches
    5. 6.5 Power Good Information (PGOOD or PG) and GPO Pins
    6. 6.6 Power Sequencing and Voltage-Rail Control
      1. 6.6.1 Power-Up and Power-Down Sequencing
      2. 6.6.2 Emergency Shutdown
    7. 6.7 Device Functional Modes
      1. 6.7.1 Off Mode
      2. 6.7.2 Standby Mode
      3. 6.7.3 Active Mode
    8. 6.8 I2C Interface
      1. 6.8.1 F/S-Mode Protocol
    9. 6.9 Register Maps
      1. 6.9.1  Register Map Summary
      2. 6.9.2  DEVICEID: PMIC Device and Revision ID Register (offset = 1h) [reset = 10h]
      3. 6.9.3  IRQ: PMIC Interrupt Register (offset = 2h) [reset = 0h]
      4. 6.9.4  IRQ_MASK: PMIC Interrupt Mask Register (offset = 3h) [reset = FFh]
      5. 6.9.5  PMICSTAT: PMIC Status Register (offset = 4h) [reset = 0h]
      6. 6.9.6  SHUTDNSRC: PMIC Shut-Down Event Register (offset = 5h) [reset = 0h]
      7. 6.9.7  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = 50h]
      8. 6.9.8  BUCK3DECAY: BUCK3 Decay Control Register (offset = 22h) [reset = 70h]
      9. 6.9.9  BUCK3VID: BUCK3 VID Register (offset = 23h) [reset = 70h]
      10. 6.9.10 BUCK3SLPCTRL: BUCK3 Sleep Control VID Register (offset = 24h) [reset = 70h]
      11. 6.9.11 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = Dh]
      12. 6.9.12 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = Dh]
      13. 6.9.13 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = Dh]
      14. 6.9.14 LDOA2CTRL: LDOA2 Control Register (offset = 28h) [reset = Ch]
      15. 6.9.15 LDOA3CTRL: LDOA3 Control Register (offset = 29h) [reset = 3Ch]
      16. 6.9.16 DISCHCTRL1: Discharge Control1 Register (offset = 40h) [reset = 55h]
      17. 6.9.17 DISCHCTRL2: Discharge Control2 Register (offset = 41h) [reset = 55h]
      18. 6.9.18 DISCHCTRL3: Discharge Control3 Register (offset = 42h) [reset = 15h]
      19. 6.9.19 PG_DELAY1: Power Good Delay1 Register (offset = 43h) [reset = 0h]
      20. 6.9.20 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0h]
      21. 6.9.21 BUCK2SLPCTRL: BUCK2 Sleep Control Register (offset = 93h) [reset = 50h]
      22. 6.9.22 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = 20h]
      23. 6.9.23 BUCK4SLPVID: BUCK4 Sleep VID Register (offset = 95h) [reset = 20h]
      24. 6.9.24 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = 70h]
      25. 6.9.25 BUCK5SLPVID: BUCK5 Sleep VID Register (offset = 97h) [reset = E8h]
      26. 6.9.26 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = E8h]
      27. 6.9.27 BUCK6SLPVID: BUCK6 Sleep VID Register (offset = 99h) [reset = E8h]
      28. 6.9.28 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = FFh]
      29. 6.9.29 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = AAh]
      30. 6.9.30 BUCK123CTRL: BUCK1-3 Control Register (offset = 9Ch) [reset = 7h]
      31. 6.9.31 PG_DELAY2: Power Good Delay2 Register (offset = 9Dh) [reset = 21h]
      32. 6.9.32 SWVTT_DIS: SWVTT Disable Register (offset = 9Fh) [reset = E0h]
      33. 6.9.33 I2C_RAIL_EN1: VR Pin Enable Override1 Register (offset = A0h) [reset = 80h]
      34. 6.9.34 I2C_RAIL_EN2/GPOCTRL: VR Pin Enable Override2/GPO Control Register (offset = A1h) [reset = 89h]
      35. 6.9.35 PWR_FAULT_MASK1: VR Power Fault Mask1 Register (offset = A2h) [reset = C0h]
      36. 6.9.36 PWR_FAULT_MASK2: VR Power Fault Mask2 Register (offset = A3h) [reset = 3Fh]
      37. 6.9.37 GPO1PG_CTRL1: GPO1 PG Control1 Register (offset = A4h) [reset = C2h]
      38. 6.9.38 GPO1PG_CTRL2: GPO1 PG Control2 Register (offset = A5h) [reset = AFh]
      39. 6.9.39 GPO4PG_CTRL1: GPO4 PG Control1 Register (offset = A6h) [reset = 0h]
      40. 6.9.40 GPO4PG_CTRL2: GPO4 PG Control2 Register (offset = A7h) [reset = 0h]
      41. 6.9.41 GPO2PG_CTRL1: GPO2 PG Control1 Register (offset = A8h) [reset = C0h]
      42. 6.9.42 GPO2PG_CTRL2: GPO2 PG Control2 Register (offset = A9h) [reset = 2Fh]
      43. 6.9.43 GPO3PG_CTRL1: GPO3 PG Control1 Register (offset = AAh) [reset = 0h]
      44. 6.9.44 GPO3PG_CTRL2: GPO3 PG Control2 Register (offset = ABh) [reset = 0h]
      45. 6.9.45 MISCSYSPG Register (offset = ACh) [reset = FFh]
      46. 6.9.46 LDOA1CTRL: LDOA1 Control Register (offset = AEh) [reset = 7Dh]
      47. 6.9.47 PG_STATUS1: Power Good Status1 Register (offset = B0h) [reset = 0h]
      48. 6.9.48 PG_STATUS2: Power Good Status2 Register (offset = B1h) [reset = 0h]
      49. 6.9.49 PWR_FAULT_STATUS1: Power Fault Status1 Register (offset = B2h) [reset = 0h]
      50. 6.9.50 PWR_FAULT_STATUS2: Power Fault Status2 Register (offset = B3h) [reset = 0h]
      51. 6.9.51 TEMPCRIT: Temperature Fault Status Register (offset = B4h) [reset = 0h]
      52. 6.9.52 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0h]
      53. 6.9.53 OC_STATUS: Overcurrent Fault Status Register (offset = B6h) [reset = 0h]
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Controller Design Procedure
          1. 7.2.2.1.1 Controller With External Feedback Resistor
          2. 7.2.2.1.2 Selecting the Inductor
          3. 7.2.2.1.3 Selecting the Output Capacitors
          4. 7.2.2.1.4 Selecting the FETs
          5. 7.2.2.1.5 Bootstrap Capacitor
          6. 7.2.2.1.6 Setting the Current Limit
          7. 7.2.2.1.7 Selecting the Input Capacitors
        2. 7.2.2.2 Converter Design Procedure
          1. 7.2.2.2.1 Selecting the Inductor
          2. 7.2.2.2.2 Selecting the Output Capacitors
          3. 7.2.2.2.3 Selecting the Input Capacitors
        3. 7.2.2.3 LDO Design Procedure
      3. 7.2.3 Application Curves
      4. 7.2.4 Layout
        1. 7.2.4.1 Layout Guidelines
        2. 7.2.4.2 Layout Example
    3. 7.3 Power Supply Coupling and Bulk Capacitors
    4. 7.4 Dos and Don'ts
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.2.4.1 Layout Guidelines

For all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator can have stability problems and EMI issues. Therefore, use wide and short traces for the main current path and for the power ground (PGND) tracks. The input capacitors, output capacitors, and inductors must be placed as close as possible to the device. Use a common-ground node for the power ground and use a different, isolated node for the control ground to minimize the effects of ground noise. Connect these ground nodes close to the AGND pin by one or two vias. Use of the design guide is highly recommended in addition to following these other basic requirements:

  • Do not allow the AGND, PGNDSNSx, or FBGND2 pin to connect to the thermal pad on the top layer.
  • To ensure proper sensing based on the FET RDSON, the PGNDSNSx pin must not connect to the board ground or to the PGND pin of the FET.
  • All inductors, input and output capacitors, and FETs for the converters and controller must be on the same board layer as the device.
  • To achieve the best regulation performance, place feedback connection points near the output capacitors and minimize the control feedback loop as much as possible.
  • Bootstrap capacitors must be placed close to the device.
  • The internal reference regulators must have their input and output capacitors placed close to the device pins.
  • Route the DRVHx and SWx pins as a differential pair. Ensure that a power-ground path is routed in parallel with the DRVLx pin, which provides optimal driver loops.