TIDUE74F April   2018  – March 2026

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 C2000™ Real-Time MCU LaunchPad™ Development Kit
      2. 2.2.2 SN65HVD78
      3. 2.2.3 TLV702
      4. 2.2.4 TPS22918-Q1
    3. 2.3 Design Considerations
      1. 2.3.1 Tamagawa T-Format Protocol
      2. 2.3.2 C2000 T-Format Encoder Interface Overview
      3. 2.3.3 TIDM-1011 Board Implementation
      4. 2.3.4 MCU Resource Requirements
      5. 2.3.5 Device-Specific Resource Usage
        1. 2.3.5.1 CRC Calculations
        2. 2.3.5.2 Input, Output Signals, and CLB Tiles
      6. 2.3.6 CLB T-Format Implementation Details
        1. 2.3.6.1 Transaction Waveforms
          1. 2.3.6.1.1 IDLE State
          2. 2.3.6.1.2 TRANSMIT_DATA State
          3. 2.3.6.1.3 WAIT_FOR_START State
          4. 2.3.6.1.4 RECEIVE_DATA State
        2. 2.3.6.2 Communication Tile Design
        3. 2.3.6.3 Logic View
      7. 2.3.7 CLB Receive Data CRC Implementation
      8. 2.3.8 PM T-Format Encoder Interface Library
        1. 2.3.8.1 PM T-Format Reference Implementation Commands
        2. 2.3.8.2 Functions Supported in PM T-Format Reference Implementation
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware
      1. 3.1.1 TIDM-1011 Jumper Configuration
    2. 3.2 Software
      1. 3.2.1 C2000 Driver Library (DriverLib)
      2. 3.2.2 C2000 SysConfig
      3. 3.2.3 C2000 Configurable Logic Block Tool
      4. 3.2.4 Installing Code Composer Studio™ and C2000WARE-MOTORCONTROL-SDK
      5. 3.2.5 Locating the Reference Software
    3. 3.3 Testing and Results
      1. 3.3.1 Hardware Configuration
      2. 3.3.2 Building and Loading Project
      3. 3.3.3 Running Code
      4. 3.3.4 Cable Length Validation
      5. 3.3.5 Benchmarks
      6. 3.3.6 Troubleshooting
  10. 4Design Files
  11. 5Related Documentation
    1. 5.1 Trademarks
  12. 6Terminology
  13. 7About the Authors
  14. 8Revision History

2.3.4 MCU Resource Requirements

Table 2-9 lists the C2000 Real-Time MCU resources used by the TIDM-1011 reference design. Specifics for each device are described in Section 2.3.5.

Table 2-9 TIDM-1011 Resource Usage
RESOURCE NAME and Quantity TYPE PURPOSE
CLB x 2 1 Tile Provides the SPI clock, delay compensation, and TxEn control. If the tile is changed, then routing in/out of the CLB must also be updated.
1 Tile (Optional) Calculate the response CRC as the message is received. This option is only available on devices with CLB Type 2 or later.
GPIO x 2 I/O
  • CLB output, RS-485 direction control (TxEN)
  • CPU encoder power control (PwrCtl)
GPIO x 1 I/O (F2837xD only)
  • CLB output of CLB_SPI_CLK
  • CLB Type 1: route this pin externally to the SPICLK input.
  • CLB Type 2, or later: clock the SPI module directly from the CLB. An external connection is not required, but can be useful for test and debug.
INPUTXBAR or CLB_INPUTXBAR x 1 Module, I/O Connect the SPI SIMO pin to the CLB.
OUTPUTXBAR or CLB_OUTPUTXBAR x 1 Module, I/O Connects the CLB to TxEN (direction control).
SPI x 1 Module and I/Os One SPI instance to transmit and receive on the RS-485 physical layer. The SPI clock is controlled by the CLB.
CPU and Memory Module CPU and memory use for various functions.