TIDUF18A October   2022  – February 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1 CLLLC System Description
    1. 1.1 Key System Specifications
  8. 2 CLLLC System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations and System Design Theory
      1. 2.2.1 Tank Design
        1. 2.2.1.1 Voltage Gain
        2. 2.2.1.2 Transformer Gain Ratio Design (NCLLLC)
        3. 2.2.1.3 Magnetizing Inductance Selection (Lm)
        4. 2.2.1.4 Resonant Inductor and Capacitor Selection (Lrp and Crp)
      2. 2.2.2 Current and Voltage Sensing
        1. 2.2.2.1 VPRIM Voltage Sensing
        2. 2.2.2.2 VSEC Voltage Sensing
        3. 2.2.2.3 ISEC Current Sensing
        4. 2.2.2.4 ISEC TANK and IPRIM TANK
        5. 2.2.2.5 IPRIM Current Sensing
        6. 2.2.2.6 Protection (CMPSS and X-Bar)
      3. 2.2.3 PWM Modulation
  9. 3 Totem Pole PFC System Description
    1. 3.1 Benefits of Totem-Pole Bridgeless PFC
    2. 3.2 Totem-Pole Bridgeless PFC Operation
    3. 3.3 Key System Specifications
    4. 3.4 System Overview
      1. 3.4.1 Block Diagram
    5. 3.5 System Design Theory
      1. 3.5.1 PWM
      2. 3.5.2 Current Loop Model
      3. 3.5.3 DC Bus Regulation Loop
      4. 3.5.4 Soft Start Around Zero-Crossing for Eliminating or Reducing Current Spike
      5. 3.5.5 Current Calculation
      6. 3.5.6 Inductor Calculation
      7. 3.5.7 Output Capacitor Calculation
      8. 3.5.8 Current and Voltage Sense
  10. 4 Highlighted Products
    1. 4.1 C2000 MCU TMS320F28003x
    2. 4.2 LMG352xR30-Q1
    3. 4.3 UCC21222-Q1
    4. 4.4 AMC3330-Q1
    5. 4.5 AMC3302-Q1
  11. 5 Hardware, Software, Testing Requirements, and Test Results
    1. 5.1 Required Hardware and Software
      1. 5.1.1 Hardware Settings
        1. 5.1.1.1 Control Card Settings
      2. 5.1.2 Software
        1. 5.1.2.1 Opening the Project Inside Code Composer Studio
        2. 5.1.2.2 Project Structure
    2. 5.2 Testing and Results
      1. 5.2.1 Test Setup (Initial)
      2. 5.2.2 CLLLC Test Procedure
        1. 5.2.2.1 Lab 1. Primary to Secondary Power Flow, Open Loop Check PWM Driver
        2. 5.2.2.2 Lab 2. Primary to Secondary Power Flow, Open Loop CheckPWM Driver and ADC with Protection, Resistive Load Connected on Secondary
          1. 5.2.2.2.1 Setting Software Options for Lab 2
          2. 5.2.2.2.2 Building and Loading the Project and Setting up Debug Environment
          3. 5.2.2.2.3 Using Real-time Emulation
          4. 5.2.2.2.4 Running the Code
          5. 5.2.2.2.5 Measure SFRA Plant for Voltage Loop
          6. 5.2.2.2.6 Verify Active Synchronous Rectification
          7. 5.2.2.2.7 Measure SFRA Plant for Current Loop
        3. 5.2.2.3 Lab 3. Primary to Secondary Power Flow, Closed Voltage Loop Check, With Resistive Load Connected on Secondary
          1. 5.2.2.3.1 Setting Software Options for Lab 3
          2. 5.2.2.3.2 Building and Loading the Project and Setting up Debug Environment
          3. 5.2.2.3.3 Running the Code
          4. 5.2.2.3.4 Measure SFRA for Closed Voltage Loop
        4. 5.2.2.4 Lab 4. Primary to Secondary Power Flow, Closed Current Loop Check, With Resistive Load Connected on Secondary
          1. 5.2.2.4.1 Setting Software Options for Lab 4
          2. 5.2.2.4.2 Building and Loading the Project and Setting up Debug
          3. 5.2.2.4.3 Running the Code
          4. 5.2.2.4.4 Measure SFRA for Closed Current Loop
        5. 5.2.2.5 Lab 5. Primary to Secondary Power Flow, Closed Current Loop Check, With Resistive Load Connected on Secondary in Parallel to a Voltage Source to Emulate a Battery Connection on Secondary Side
          1. 5.2.2.5.1 Setting Software Options for Lab 5
          2. 5.2.2.5.2 Designing Current Loop Compensator
          3. 5.2.2.5.3 Building and Loading the Project and Setting up Debug
          4. 5.2.2.5.4 Running the Code
          5. 5.2.2.5.5 Measure SFRA for Closed Current Loop in Battery Emulated Mode
      3. 5.2.3 TTPLPFC Test procedure
        1. 5.2.3.1 Lab 1: Open Loop, DC
          1. 5.2.3.1.1 Setting Software Options for BUILD 1
          2. 5.2.3.1.2 Building and Loading Project
          3. 5.2.3.1.3 Setup Debug Environment Windows
          4. 5.2.3.1.4 Using Real-Time Emulation
          5. 5.2.3.1.5 Running Code
        2. 5.2.3.2 Lab 2: Closed Current Loop DC
          1. 5.2.3.2.1 Setting Software Options for BUILD 2
          2. 5.2.3.2.2 Designing Current Loop Compensator
          3. 5.2.3.2.3 Building and Loading Project and Setting Up Debug
          4. 5.2.3.2.4 Running Code
        3. 5.2.3.3 Lab 3: Closed Current Loop, AC
          1. 5.2.3.3.1 Setting Software Options for Lab 3
          2. 5.2.3.3.2 Building and Loading Project and Setting Up Debug
          3. 5.2.3.3.3 Running Code
        4. 5.2.3.4 Lab 4: Closed Voltage and Current Loop
          1. 5.2.3.4.1 Setting Software Options for BUILD 4
          2. 5.2.3.4.2 Building and Loading Project and Setting up Debug
          3. 5.2.3.4.3 Running Code
      4. 5.2.4 Test Results
        1. 5.2.4.1 Efficiency
        2. 5.2.4.2 System Performance
        3. 5.2.4.3 Bode Plots
        4. 5.2.4.4 Efficiency and Regulation Data
        5. 5.2.4.5 Thermal Data
        6. 5.2.4.6 PFC Waveforms
        7. 5.2.4.7 CLLLC Waveforms
  12. 6 Design Files
    1. 6.1 Schematics
    2. 6.2 Bill of Materials
    3. 6.3 Altium Project
    4. 6.4 Gerber Files
  13. 7 Software Files
  14. 8 Related Documentation
    1. 8.1 Trademarks
  15. 9 Terminology
  16. 10About the Author
  17. 11Revision History

4.2 LMG352xR30-Q1

The LMG352xR030-Q1 is an automotive qualified 650-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting. The integrated driver enables switching speed up to 150 V/ns. TI’s integrated precision gate bias results in higher switching SOA compared to discrete external gate drivers. This integration, combined with a low-inductance package, delivers clean switching and minimal ringing in hard-switching power supply topologies. Other features, including adjustable gate drive strength for EMI control, overtemperature, and robust overcurrent protection with fault indication, provide optimized BOM cost, board size, and footprint. Advanced power management features include digital temperature reporting; the temperature of the GaN FET is reported through a variable duty cycle PWM output, which enables the system to optimally manage loading.