Product details

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 3.3, 5, 12, 16, 20 Ron (Typ) (Ohms) 180 Bandwidth (MHz) 40 Operating temperature range (C) -55 to 125 Features Break-before-make Input/output continuous current (Max) (mA) 10 Rating Catalog CON (Typ) (pF) 4 Supply current (Typ) (uA) 0.01
Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 3.3, 5, 12, 16, 20 Ron (Typ) (Ohms) 180 Bandwidth (MHz) 40 Operating temperature range (C) -55 to 125 Features Break-before-make Input/output continuous current (Max) (mA) 10 Rating Catalog CON (Typ) (pF) 4 Supply current (Typ) (uA) 0.01
PDIP (N) 14 181 mm² 19.3 x 9.4 SOIC (D) 14 52 mm² 8.65 x 6 SOP (NS) 14 80 mm² 10.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4
  • 20-V digital or ± 10-V peak-to-peak switching
  • 280- typical on-state resistance for 15-V operation
  • Switch on-state resistance matched to within 10 typ. over 15-V signal-input range
  • High on/off output-voltage ratio:
       65 dB typ. @ fis = 10 kHz, RL = 10 k
  • High degree of linearity:
       <0.5% distortion typ. @ fis = 1 kHz, Vis = 5 Vp-p, VDD–VSS
  • Extremely low off-state switch leakage resulting in very low offset current and high effective off-state resistance:
       100pA typ. @ VDD–VSS = 18 V, TA = 25°C
  • Extremely high control input impedance (control circuit isolated form signal circuit:
       1012typ.
  • Low crosstalk between switches:
       –50 dB typ. @ fis= 0.9 MHz, RL = 1 k
  • Matched control-input to signal-output capacitance:
       Reduces output signal transients
  • Frequency response, switch on = 40MHz (typ.)
  • 100% tested for quiescent current at 20 V
  • Maximum control input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Applications:
    • Analog signal switching/multiplexing
      • Signal gating
      • Squelch control
      • Chopper
      • Modulator
      • Demodulator
      • Commutating switch
    • Digital signal switching/multiplexing
    • CMOS logic implementation
    • Analog-to-digital & digital-to-analog conversion
    • Digital control of frequency, impedance, phase, and analog-signal gain

Data sheet acquired from Harris Semiconductor

  • 20-V digital or ± 10-V peak-to-peak switching
  • 280- typical on-state resistance for 15-V operation
  • Switch on-state resistance matched to within 10 typ. over 15-V signal-input range
  • High on/off output-voltage ratio:
       65 dB typ. @ fis = 10 kHz, RL = 10 k
  • High degree of linearity:
       <0.5% distortion typ. @ fis = 1 kHz, Vis = 5 Vp-p, VDD–VSS
  • Extremely low off-state switch leakage resulting in very low offset current and high effective off-state resistance:
       100pA typ. @ VDD–VSS = 18 V, TA = 25°C
  • Extremely high control input impedance (control circuit isolated form signal circuit:
       1012typ.
  • Low crosstalk between switches:
       –50 dB typ. @ fis= 0.9 MHz, RL = 1 k
  • Matched control-input to signal-output capacitance:
       Reduces output signal transients
  • Frequency response, switch on = 40MHz (typ.)
  • 100% tested for quiescent current at 20 V
  • Maximum control input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Applications:
    • Analog signal switching/multiplexing
      • Signal gating
      • Squelch control
      • Chopper
      • Modulator
      • Demodulator
      • Commutating switch
    • Digital signal switching/multiplexing
    • CMOS logic implementation
    • Analog-to-digital & digital-to-analog conversion
    • Digital control of frequency, impedance, phase, and analog-signal gain

Data sheet acquired from Harris Semiconductor

CD4016B Series types are quad bilateral switches intended for the transmission or multiplexing of analog or digital signals. Each of the four independent bilateral switches has a single control signal input which simultaneously biases both the p and n device in a given switch on or off.

The CD4016 "B" Series types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4016B Series types are quad bilateral switches intended for the transmission or multiplexing of analog or digital signals. Each of the four independent bilateral switches has a single control signal input which simultaneously biases both the p and n device in a given switch on or off.

The CD4016 "B" Series types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Type Title Date
* Data sheet CD4016B TYPES datasheet (Rev. C) 21 Aug 2003
Application note Selecting the Right Texas Instruments Signal Switch (Rev. C) 06 Aug 2021
Application note Multiplexers and Signal Switches Glossary (Rev. A) 09 Jun 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 Dec 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

In stock
Limit: 3
Package Pins Download
PDIP (N) 14 View options
SO (NS) 14 View options
SOIC (D) 14 View options
TSSOP (PW) 14 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos