The CD4066B device is a quad bilateral switch intended for the transmission or multiplexing of analog or digital signals. It is pin-for-pin compatible with the CD4016B device, but exhibits a much lower on-state resistance. In addition, the on-state resistance is relatively constant over the full signal-input range.
The CD4066B device consists of four bilateral switches, each with independent controls. Both the p and the n devices in a given switch are biased on or off simultaneously by the control signal. As shown in Figure 17, the well of the n-channel device on each switch is tied to either the input (when the switch is on) or to VSS (when the switch is off). This configuration eliminates the variation of the switch-transistor threshold voltage with input signal and, thus, keeps the on-state resistance low over the full operating-signal range.
The advantages over single-channel switches include peak input-signal voltage swings equal to the full supply voltage and more constant on-state impedance over the input-signal range. However, for sample-and-hold applications, the CD4016B device is recommended.
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | CD4066B CMOS Quad Bilateral Switch datasheet (Rev. H) | 28 Feb 2020 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. D) | 09 Dec 2021 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | 01 Dec 2021 | |
| Selection guide | Logic Guide (Rev. AB) | 12 Jun 2017 | |
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 Dec 2015 | |
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 Jan 2007 | |
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 Jul 2004 | |
| User guide | Signal Switch Data Book (Rev. A) | 14 Nov 2003 | |
| More literature | Logic Cross-Reference (Rev. A) | 07 Oct 2003 | |
| Application note | Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics | 03 Dec 2001 |
For additional terms or required resources, click any title below to view the detail page where available.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | Download |
|---|---|---|
| PDIP (N) | 14 | View options |
| SO (NS) | 14 | View options |
| SOIC (D) | 14 | View options |
| TSSOP (PW) | 14 | View options |
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