Product details


Arm CPU 1 Arm Cortex-A8 Arm MHz (Max.) 800, 1000 Co-processor(s) GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 165-MHz HD video display outputs Protocols Ethernet Ethernet MAC 0 Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (C) -40 to 105, -40 to 90, 0 to 90 open-in-new Find other Arm-based processors

Package | Pins | Size

FC/CSP (CUS) 423 256 mm² 16 x 16 POP-FCBGA (CBC) 515 196 mm² 14 x 14 POP-FCBGA (CBP) 515 144 mm² 12 x 12 open-in-new Find other Arm-based processors


  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

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The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging
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Limited design support from TI available

This product has limited design support from TI for existing projects. If available, you will find relevant collateral, software and tools in the product folder. For existing designs using this product, you can request support in the TI E2ETM support forums, but limited support is available for this product.

Technical documentation

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Type Title Date
* Data sheet DM3730, DM3725 Digital Media Processors datasheet (Rev. D) Apr. 11, 2011
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) Feb. 13, 2014
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) Sep. 24, 2012
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles Mar. 20, 2019
Technical article Bringing the next evolution of machine learning to the edge Nov. 27, 2018
Technical article Industry 4.0 spelled backward makes no sense – and neither does the fact that you haven’t heard of TI’s newest processor yet Oct. 30, 2018
Technical article How quality assurance on the Processor SDK can improve software scalability Aug. 22, 2018
More literature Ethernet Connectivity via GPMC Jul. 06, 2018
More literature AM37x/DM37x Schematic Checklist Jul. 06, 2018
More literature AM37x EVM Software Developer's Guide Jul. 06, 2018
Technical article Clove: Low-Power video solutions based on Sitara™ AM57x processors Jul. 21, 2016
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) Aug. 13, 2015
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) Nov. 01, 2013
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) Sep. 10, 2012
More literature DM37x Design Network Partners Jun. 05, 2012
Application note TI OMAP4430 POP SMT Design Guideline (Rev. C) Nov. 03, 2011
Application note Introduction to TMS320C6000 DSP Optimization Oct. 06, 2011
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs Jun. 15, 2011
More literature DM3730 Product Bulletin Sep. 07, 2010
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II Jun. 23, 2010
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I Jun. 23, 2010
Application note AM/DM37x Power Estimation Spreadsheet Jun. 07, 2010
Application note AM/DM37x Overview Jun. 03, 2010
Application note AM3715/03 Memory Subsystem Jun. 03, 2010
Application note AM37x CUS Routing Guidelines Jun. 03, 2010
Application note Setting up AM37x SDRC Registers Jun. 03, 2010
User guide Flip Chip Ball Grid Array Package Reference Guide (Rev. A) May 23, 2005
Application note AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) May 01, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Software development

Android Development Kit for DM37x DaVinci Video Processors
ANDROIDSDK-DM37X Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

The Android Development Kit from TI is a complete software offering to allow DM37x developers the ability to easily and quickly evaluate the Android OS. The kit provides a stable and fully tested software foundation that can be utilized on DM37x hardware including Evaluation Modules and Beagleboard (...)

Linux Digital Video Software Development Kit (DVSDK) for DM3730/3725 Digital Media Processors
LINUXDVSDK-DM37X The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)

The Linux SDK for DM3730 and DM3725 includes the following components:

  • Linux kernel 2.6.37
  • Bootloaders
  • File System
  • Qt/Webkit application framework
  • Matrix Application Launcher
  • 3D Graphics support
  • WLAN & Bluetooth support
  • Example applications
  • Host tools including Flash Tool and Pin Mux Utility
  • Documentation
  • (...)
Telecom and Media Libraries - FAXLIB, VoLIB and AEC/AER for TMS320C64x+ and TMS320C55x Processors
TELECOMLIB Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be acquired (...)


  • Telogy Software Line Echo Canceller (ECU)
  • Tone Detection Unit (TDU)
  • Caller ID Detection/Generation (CID)
  • Tone Generation Unit (TGU)
  • Voice Activity Detection Unit (VAU)
  • Noise Matching Functions
  • Packet Loss Concealment (PLC)
  • Voice Enhancement Unit (VEU)  


  • Fax Interface Unit (FIU)
  • Fax Modem (FM)
  • (...)
FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices
FLASHTOOL — Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.

Additional Information:

TI GForge - Welcome to

TI E2E Community

Design tools & simulation

SPRM506.ZIP (9 KB) - BSDL Model
SPRM507B.ZIP (8 KB) - BSDL Model
SPRM508.ZIP (10 KB) - BSDL Model
SPRM509.ZIP (4408 KB) - IBIS Model
SPRM510.ZIP (4410 KB) - IBIS Model
SPRM511.ZIP (4255 KB) - IBIS Model
Pin mux tool
PINMUXTOOL The PinMux Utility is a software tool which provides a Graphical User Interface for configuring pin multiplexing settings, resolving conflicts and specifying I/O cell characteristics for TI MPUs. Results are output as C header/code files that can be imported into software development kits (SDKs) or (...)
Arm-based MPU, arm-based MCU and DSP third-party search tool
PROCESSORS-3P-SEARCH TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
  • Supports many TI processors including Sitara and Jacinto processors and DSPs
  • Search by type of product, TI devices supported, or country
  • Links and contacts for quick engagement
  • Third-party companies located around the world

Reference designs

Haptic Feedback Capacitive Touch Display Reference Design for Bldg Automation & Medical Applications
TIDA-00408 The TIDA-00408 Touch Display with Haptic Feedback reference design showcases haptics for thermostats, building automation, factory automation, point of sale, and automotive applications.  The touch screen provides touch feedback when the user interacts with the on-screen user interface.  (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
FCBGA (CUS) 423 View options
POP-FCBGA (CBC) 515 View options
POP-FCBGA (CBP) 515 View options

Ordering & quality

Information included:
  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​