SN74AUP1G74

ACTIVE

Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

Product details

Number of channels 1 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 160 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 1 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 160 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFP) 8 1.8 mm² 1 x 1.8 DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 UQFN (RSE) 8 2.25 mm² 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm² 2 x 3.1 X2SON (DQE) 8 1.4 mm² 1.4 x 1
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption: ICC = 0.9 μA Maximum
  • Low Dynamic-Power Consumption: Cpd = 5.5 pF Typical at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typical
  • Low Noise – Overshoot and Undershoot < 10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • NanoStar Is a trademark of Texas Instruments. All other trademarks are the property of their respective owners

  • APPLICATIONS
    • Servers
    • LED Displays
    • Network Switches
    • Telecom Infrastructure
    • Motor Drivers
    • I/O Expanders
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption: ICC = 0.9 μA Maximum
  • Low Dynamic-Power Consumption: Cpd = 5.5 pF Typical at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typical
  • Low Noise – Overshoot and Undershoot < 10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • NanoStar Is a trademark of Texas Instruments. All other trademarks are the property of their respective owners

  • APPLICATIONS
    • Servers
    • LED Displays
    • Network Switches
    • Telecom Infrastructure
    • Motor Drivers
    • I/O Expanders
  • The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in ).

    The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in ).

    Download View video with transcript Video

    Similar products you might be interested in

    open-in-new Compare alternates
    Drop-in replacement with upgraded functionality to the compared device
    SN74LVC1G74 ACTIVE Single Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset Larger voltage range (1.65V to 5.5V), higher drive average drive strength (24mA)

    Technical documentation

    star =Top documentation for this product selected by TI
    No results found. Please clear your search and try again.
    View all 7
    Type Title Date
    * Data sheet SN74AUP1G74 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset datasheet (Rev. D) PDF | HTML 29 Dec 2015
    Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dec 2022
    Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 May 2019
    Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
    Selection guide Logic Guide (Rev. AB) 12 Jun 2017
    Application note How to Select Little Logic (Rev. A) 26 Jul 2016
    Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

    Design & development

    For additional terms or required resources, click any title below to view the detail page where available.

    Evaluation board

    5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

    Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
    User guide: PDF
    Not available on TI.com
    Reference designs

    TIDM-SERVODRIVE — Industrial Servo Drive and AC Inverter Drive Reference Design

    The DesignDRIVE Development Kit is a reference design for a complete industrial drive directly connecting to a three phase ACI or PMSM motor. Many drive topologies can be created from the combined control, power and communications technologies included on this single platform.  Includes (...)
    Design guide: PDF
    Schematic: PDF
    Reference designs

    TIDA-00751 — Solid State Relay 24V AC Switch with Galvanic Isolation Reference Design

    The solid state relay 24V AC Switch reference design is a single relay replacement that enables efficient power management for a low power alternative to standard electromechanical relays.  The OFF-mode provides energy to the system controller and the ON mode can switch fast enough to allow (...)
    Design guide: PDF
    Schematic: PDF
    Reference designs

    TIDA-00377 — Self-Powered AC Solid State Relay with MOSFETs Reference Design

    The self-powered AC solid state relay with MOSFETs reference design is a single relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays in thermostat applications. This SSR reference design is self-powered through the 24V AC power (...)
    Design guide: PDF
    Schematic: PDF
    Reference designs

    TIDA-01064 — Low BOM Cost AC Solid State Relay with MOSFETs Reference Design

    The low BOM cost ac solid state relay with MOSFETs reference design is a single relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays in thermostat applications. This SSR reference design is the base model of the self-powered (...)
    Design guide: PDF
    Schematic: PDF
    Reference designs

    TIDA-00616 — Energy Harvesting LaunchPad BoosterPack for Brushed DC Motor Control Reference Design

    The Energy Harvesting LaunchPad for Brushed DC Motor Control is designed for charging a Li-ion or Li-polymer battery with solar energy, and subsequently using a voltage regulator to provide secondary system power to a TI LaunchPad and any peripherals connected the LaunchPad. The BoosterPack is (...)
    Design guide: PDF
    Schematic: PDF
    Package Pins Download
    DSBGA (YFP) 8 View options
    DSBGA (YZP) 8 View options
    UQFN (RSE) 8 View options
    VSSOP (DCU) 8 View options
    X2SON (DQE) 8 View options

    Ordering & quality

    Information included:
    • RoHS
    • REACH
    • Device marking
    • Lead finish/Ball material
    • MSL rating/Peak reflow
    • MTBF/FIT estimates
    • Material content
    • Qualification summary
    • Ongoing reliability monitoring
    Information included:
    • Fab location
    • Assembly location

    Support & training

    TI E2E™ forums with technical support from TI engineers

    Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

    If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

    Videos