Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop
Product details
Parameters
Package | Pins | Size
Features
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
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- Servers
- LED Displays
- Network Switches
- Telecom Infrastructure
- Motor Drivers
- I/O Expanders
Description
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in ).
Technical documentation
= Top documentation for this product selected by TI
Type | Title | Date | |
---|---|---|---|
* | Datasheet | SN74AUP1G74 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset datasheet (Rev. D) | Dec. 29, 2015 |
Selection guide | Little Logic Guide 2018 (Rev. G) | Jul. 06, 2018 | |
Selection guide | Logic Guide (Rev. AB) | Jun. 12, 2017 | |
Application note | How to Select Little Logic (Rev. A) | Jul. 26, 2016 | |
Technical articles | A race against the clock: how to determine the power-up states of clocked devices | Mar. 06, 2015 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. A) | Feb. 06, 2015 | |
Application note | Understanding Schmitt Triggers | Sep. 21, 2011 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Reference designs
TIDM-SERVODRIVE — The DesignDRIVE Development Kit is a reference design for a complete industrial drive directly connecting to a three phase ACI or PMSM motor. Many drive topologies can be created from the combined control, power and communications technologies included on this single platform. Includes (...)
TIDA-00377 — The self-powered AC solid state relay with MOSFETs reference design is a single relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays in thermostat applications. This SSR reference design is self-powered through the 24V AC power (...)
Design files
-
download TIDA-00377 BOM.pdf (72KB) -
download TIDA-00377 Assembly Drawing.pdf (188KB) -
download TIDA-00377 PCB.pdf (1381KB) -
download TIDA-00377 CAD Files.zip (15480KB) -
download TIDA-00377 Gerber.zip (642KB)
TIDA-00751 — The solid state relay 24V AC Switch reference design is a single relay replacement that enables efficient power management for a low power alternative to standard electromechanical relays. The OFF-mode provides energy to the system controller and the ON mode can switch fast enough to allow (...)
Design files
-
download TIDA-00751 BOM.pdf (108KB) -
download TIDA-00751 Assembly Drawing.pdf (139KB) -
download TIDA-00751 PCB.pdf (994KB) -
download TIDA-00751 CAD Files.zip (791KB) -
download TIDA-00751 Gerber.zip (600KB)
TIDA-01064 — The low BOM cost ac solid state relay with MOSFETs reference design is a single relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays in thermostat applications. This SSR reference design is the base model of the self-powered solid (...)
Design files
-
download TIDA-01064 BOM.pdf (71KB) -
download TIDA-01064 Assembly Drawing.pdf (164KB) -
download TIDA-01064 PCB.pdf (995KB) -
download TIDA-01064 CAD Files.zip (36283KB) -
download TIDA-01064 Gerber.zip (1062KB)
TIDA-00616 — The Energy Harvesting LaunchPad for Brushed DC Motor Control is designed for charging a Li-ion or Li-polymer battery with solar energy, and subsequently using a voltage regulator to provide secondary system power to a TI LaunchPad and any peripherals connected the LaunchPad. The BoosterPack is (...)
Design files
-
download TIDA-00616 BOM.pdf (218KB) -
download TIDA-00616 Assembly Drawing.pdf (219KB) -
download TIDA-00616 PCB.pdf (84KB) -
download TIDA-00616 CAD Files.zip (1333KB) -
download TIDA-00616 Gerber.zip (345KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YFP) | 8 | View options |
DSBGA (YZP) | 8 | View options |
UQFN (RSE) | 8 | View options |
VSSOP (DCU) | 8 | View options |
X2SON (DQE) | 8 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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