Packaging information
| Package | Pins DSBGA (YBH) | 30 |
| Operating temperature range (°C) -40 to 85 |
| Package qty | Carrier 3,000 | LARGE T&R |
Features for the TAS2764
- Key Features
- Y-Bridge Power Architecture
- Edge and Spread Spectrum Control
- Full Scale Ultrasonic Output up to 40 kHz
- Output Power (1 % THD+N)
- 13 W (4 Ω, 12 V)
- 8 W (8 Ω, 12 V)
- Power Consumption (1 % THD+N, 4 Ω, 12 V)
- 81% Efficient at 1W
- 85% Efficient at 13W
- 3mA in Noise Gate Mode
- <1uA in Hardware Shutdown Mode
- Power Supplies and Management
- PVDD: 2.3 V to 16 V
- VBAT1S: 2.3 V to 5.5 V
- AVDD: 1.8 V
- IOVDD: 1.2 V/ 1.8 V
- Brownout Protection
- PVDD Tracking Peak Voltage Limiter
- Interfaces and Control
- SDOUT and I2S Feedback for Echo Cancellation
- I2S/TDM: 8 Channels of 32-bit up to 96 kHz
- I2C: 8 addresses with Fast Mode Plus Support
- 44.1 kHz to 96 kHz Sample Rates
- Inter Chip Communication Bus
- Integrated Speaker Management and Protection
- Speaker Voltage and Current Sense
- Short and Open Detection
- Thermal and Over Current Protection
- Over Power Protection
Description for the TAS2764
The TAS2764 is a mono digital input Class-D audio amplifier optimized for efficiently driving high peak power into small loudspeakers. The Class-D amplifier is capable of delivering 13 W of continuous power into a 4 Ω load with less than 1 % THD+N at a supply voltage of 12 V.
Y-Brige architecture improves overall efficiency at low level of output power and in idle mode.
Integrated speaker voltage and current sense provides for real time monitoring of loudspeaker behavior. A supply tracking peak voltage limiter optimizes amplifier headroom. Brownout prevention scheme with multiple thresholds allows reducing the gain in signal path when the supply drops.
TAS2764 ultrasonic output support allows device to be used for advance ultrasonic applications like motion and proximity detection, gesture recognition, etc.
Up to eight TAS2764 devices can share a common bus via I2S/TDM and I2C interfaces.
The device is available in a 30-ball, 0.4 mm pitch CSP for a compact PCB footprint.