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TMUX6219

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36-V Low Ron, 2:1, 1 channel, multiplexer with 1.8V logic control

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 12, 16, 20, 36, 5 Ron (Typ) (Ohms) 2 ON-state leakage current (Max) (µA) 0.07 Bandwidth (MHz) 43 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (Max) (mA) 330 Rating Catalog CON (Typ) (pF) 150 Supply current (Typ) (uA) 35 open-in-new Find other Analog switches & muxes

Package | Pins | Size

VSSOP (DGK) 8 15 mm² 3 x 4.9 open-in-new Find other Analog switches & muxes

Features

  • Dual Supply Range: ±4.5 V to ±18 V
  • Single Supply Range: 4.5 V to 36 V
  • Low On-Resistance: 2.1 Ω
  • Low Charge Injection: -10 pC
  • High Current Support: 330 mA (Maximum)
  • –40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Fail-Safe Logic
  • Rail to Rail Operation
  • Bidirectional Signal Path
  • Break-Before-Make Switching

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Description

The TMUX6219 is a complementary metal-oxide semiconductor (CMOS) switch in a single channel, 2:1 (SPDT) configuration. The device works with single supply (4.5 V to 36 V), dual supplies (±4.5 V to ±18 V), or asymmetric supplies (such as VDD = 8 V, VSS = –12 V). The TMUX6219 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX6219 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX6219 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications.

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Technical documentation

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Type Title Date
* Data sheet TMUX6219 36-V, Low Ron, 2:1 (SPDT) Switch with 1.8-V Logic datasheet (Rev. B) Jan. 19, 2021
Technical article Protecting your power amplifier stage with analog switches Feb. 19, 2020

Design & development

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Hardware development

INTERFACE ADAPTER Download
document-generic User guide
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Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODEL Download
SCDM254.ZIP (193 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
VSSOP (DGK) 8 View options

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