36-V Low Ron, 2:1, 1 channel, multiplexer with 1.8V logic control
Product details
Parameters
Package | Pins | Size
Features
- Dual Supply Range: ±4.5 V to ±18 V
- Single Supply Range: 4.5 V to 36 V
- Low On-Resistance: 2 Ω
- –40°C to +125°C Operating Temperature
- Logic Levels: 1.8 V to VDD
- Fail-Safe Logic
- Rail to Rail Operation
- Bidirectional Signal Path
- Break-Before-Make Switching
- ESD Protection HBM: 2000 V
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Description
The TMUX6219 is a complementary metal-oxide semiconductor (CMOS) switch in a single channel, 2:1 (SPDT) configuration. The device works well with dual supplies (±4.5 V to ±18 V), single supply (4.5 V to 36 V), or asymmetric supplies (such as VDD = 8 V, VSS = –12 V). The TMUX6219 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
The TMUX6219 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX6219 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX6219 36-V, Low Ron, 2:1 (SPDT) Switch with 1.8-V Logic datasheet (Rev. A) | Oct. 13, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
VSSOP (DGK) | 8 | View options |
Ordering & quality
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- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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