8-bit bidirectional voltage-level shifter for open-drain and push-pull application
Product details
Parameters
Package | Pins | Size
Features
- No direction-control signal needed
- Maximum data rates
- 110 Mbps (push pull)
- 1.2 Mbps (open drain)
- 1.4 V to 3.6 V on A port and 1.65 V to 5.5 V on B port (VCCA ≤ VCCB)
- No power-supply sequencing required – either VCCA or VCCB can be ramped first
- Latch-up performance exceeds 100 mA per
JESD 78, Class II - ESD protection exceeds JESD 22 (A Port)
- 2000-V human body model (A114-B)
- 150-V machine model (A115-A)
- 1000-V charged-device model (C101)
- IEC 61000-4-2 ESD (B port)
- ±8 kV contact discharge
- ±6 kV Air-gap discharge
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Description
This device is an 8-bit non-inverting level translator that uses two separate configurable power-supply rails. The A port tracks the VCCA pin supply voltage. The VCCA pin accepts any supply voltage between 1.4 V and 3.6 V. The B port tracks the VCCB pin supply voltage. The VCCB pin accepts any supply voltage between 1.65 V and 5.5 V. Two input supply pins allows for low Voltage bidirectional translation between any of the 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance (Hi-Z) state.
To ensure the Hi-Z state during power-up or power-down periods, tie OE to GND through a pull-down resistor. The minimum value of the resistor is determined by the current-sourcing capability of the driver.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TXS0108E 8-Bit Bi-directional, Level-Shifting, Voltage Translator for Open-Drain and Push-Pull Applications datasheet (Rev. H) | May 21, 2020 |
User guide | TXS-EVM Evaluation module Users guide (Rev. A) | Nov. 27, 2019 | |
User guide | TXS-EVM Evaluation module Users guide | Oct. 08, 2019 | |
Selection guide | Voltage translation buying guide | Jun. 13, 2019 | |
Application note | Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) | Mar. 28, 2018 | |
Application note | A Guide to Voltage Translation With TXS-Type Translators | Jun. 29, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic and translation devices with included dual supply support
- Board has 9 sections that can be broken apart for a smaller form factor
Description
The TXS-EVM is designed to support single, dual, quad and octal channel TXS devices. The TXS devices belong to the auto bidirectional voltage level translation family with an operating voltage between 1.2V and 5.5 V designed to support various generic voltage level translation applications across (...)
Features
- Supports the TXS0101, TXS0102, TXS0104e, TXS0108e
- Supports DCK, DQE, PW and RGY families of TI
- Option of individual external loading per channel
- Additional package options supported on the footprint
Design tools & simulation
Reference designs
Design files
-
download TIDA-00352 BOM (Daughter Card).pdf (236KB) -
download TIDA-00352 BOM (Motherboard).pdf (283KB) -
download TIDA-00352 PCB (Daughter Card).pdf (1522KB) -
download TIDA-00352 PCB (Motherboard).pdf (6984KB) -
download TIDA-00352 CAD Files (Daughter Card).zip (1148KB) -
download TIDA-00352 CAD Files (Motherboard).zip (2759KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
BGA MICROSTAR JUNIOR (ZXY) | 20 | View options |
NFBGA (NME) | 20 | View options |
TSSOP (PW) | 20 | View options |
VQFN (RGY) | 20 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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