Produktdetails

Vin (max) (V) 7 Absolute max Vin (max) (V) 20 Vin (min) (V) 4 Rating Automotive Operating temperature range (°C) -40 to 125
Vin (max) (V) 7 Absolute max Vin (max) (V) 20 Vin (min) (V) 4 Rating Automotive Operating temperature range (°C) -40 to 125
VQFN (RHL) 20 15.75 mm² 4.5 x 3.5
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Integrated wireless power supply receiver solution
    • 93% overall peak AC-DC efficiency
    • Full synchronous rectifier
    • WPC v1.2 compliant communication control
    • Output voltage conditioning
    • Only IC required between Rx coil and output
  • Wireless power consortium (WPC) v1.2 compliant (FOD enabled) highly accurate current sense
  • Dynamic rectifier control for improved load transient response
  • Dynamic efficiency scaling for optimized performance over wide range of output power
  • Adaptive communication limit for robust communication
  • Supports 20-V maximum input
  • Low-power dissipative rectifier overvoltage clamp (VOVP = 15 V)
  • Thermal shutdown
  • Multifunction NTC and control pin for temperature monitoring, charge complete, and fault host control
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Integrated wireless power supply receiver solution
    • 93% overall peak AC-DC efficiency
    • Full synchronous rectifier
    • WPC v1.2 compliant communication control
    • Output voltage conditioning
    • Only IC required between Rx coil and output
  • Wireless power consortium (WPC) v1.2 compliant (FOD enabled) highly accurate current sense
  • Dynamic rectifier control for improved load transient response
  • Dynamic efficiency scaling for optimized performance over wide range of output power
  • Adaptive communication limit for robust communication
  • Supports 20-V maximum input
  • Low-power dissipative rectifier overvoltage clamp (VOVP = 15 V)
  • Thermal shutdown
  • Multifunction NTC and control pin for temperature monitoring, charge complete, and fault host control

The BQ51013B-Q1 device is a single-chip, advanced, flexible, secondary-side device for wireless power transfer in portable applications capable of providing up to 5 W. The BQ51013B-Q1 devices provide the receiver (RX) AC-to-DC power conversion and regulation while integrating the digital control required to comply with the Wireless Power Consortium (WPC) Qi v1.2 communication protocol. Together with the BQ50012A primary-side controller (or other Qi transmitter), the BQ51013B-Q1 enables a complete contactless power transfer system for a wireless power supply solution. Global feedback is established from the secondary to the primary to control the power transfer process using the Qi v1.2 protocol.

The BQ51013B-Q1 integrates a low-resistance synchronous rectifier, low-dropout regulator (LDO), digital control, and accurate voltage and current loops to ensure high efficiency and low power dissipation.

The BQ51013B-Q1 also includes a digital controller that calculates the amount of power received by the mobile device within the limits set by the WPC v1.2 standard. The controller then communicates this information to the transmitter (TX) to allow the TX to determine if a foreign object is present within the magnetic interface and introduces a higher level of safety within magnetic field. This Foreign Object Detection (FOD) method is part of the requirements under the WPC v1.2 specification.

The BQ51013B-Q1 device is a single-chip, advanced, flexible, secondary-side device for wireless power transfer in portable applications capable of providing up to 5 W. The BQ51013B-Q1 devices provide the receiver (RX) AC-to-DC power conversion and regulation while integrating the digital control required to comply with the Wireless Power Consortium (WPC) Qi v1.2 communication protocol. Together with the BQ50012A primary-side controller (or other Qi transmitter), the BQ51013B-Q1 enables a complete contactless power transfer system for a wireless power supply solution. Global feedback is established from the secondary to the primary to control the power transfer process using the Qi v1.2 protocol.

The BQ51013B-Q1 integrates a low-resistance synchronous rectifier, low-dropout regulator (LDO), digital control, and accurate voltage and current loops to ensure high efficiency and low power dissipation.

The BQ51013B-Q1 also includes a digital controller that calculates the amount of power received by the mobile device within the limits set by the WPC v1.2 standard. The controller then communicates this information to the transmitter (TX) to allow the TX to determine if a foreign object is present within the magnetic interface and introduces a higher level of safety within magnetic field. This Foreign Object Detection (FOD) method is part of the requirements under the WPC v1.2 specification.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 2
Typ Titel Datum
* Data sheet BQ51013B-Q1: Automotive Highly Integrated Wireless Receiver Qi (WPC v1.2) Compliant Power Supply datasheet PDF | HTML 20 Jul 2021
Application note Wireless Power Solutions for Battery Chargers PDF | HTML 20 Apr 2023

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RHL) 20 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos