Produktdetails

Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 24 Supply current (max) (µA) 160 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -55 to 125
Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 24 Supply current (max) (µA) 160 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -55 to 125
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Buffered inputs
  • Typical propagation delay:
       3.6 ns @ VCC = 5 V, TA = 25°C, CL = 50pF
  • Exceeds 2-kV ESD Protection - MIL-STD-883, Method 3015
  • SCR-Latch-up-resistant CMOS process and circuit design
  • Speed of bipolar FAST*/AS/S with significantly reduced power consumption
  • Balanced propagation delays
  • AC types feature 1.5-V to 5.5-V operation and balanced noise immunity at 30% of the supply
  • ± 24-mA output drive current
      Fanout to 15 FAST* ICs
      Drives 50-ohm transmission lines
  • Characterized for operation from –40° to 85°C

*FAST is a Registered Trademark of Fairchild Semiconductor Corp.

  • Buffered inputs
  • Typical propagation delay:
       3.6 ns @ VCC = 5 V, TA = 25°C, CL = 50pF
  • Exceeds 2-kV ESD Protection - MIL-STD-883, Method 3015
  • SCR-Latch-up-resistant CMOS process and circuit design
  • Speed of bipolar FAST*/AS/S with significantly reduced power consumption
  • Balanced propagation delays
  • AC types feature 1.5-V to 5.5-V operation and balanced noise immunity at 30% of the supply
  • ± 24-mA output drive current
      Fanout to 15 FAST* ICs
      Drives 50-ohm transmission lines
  • Characterized for operation from –40° to 85°C

*FAST is a Registered Trademark of Fairchild Semiconductor Corp.

The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output enables (10E\, 2OE\). The CD54/74AC/ACT241 has one active-LOW (10E\) and one active-HIGH (20E) output enable.

The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M and M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and the CD74ACT241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline packages (M and M96 suffixes), and 20-lead shrink small-outline packages (SM96 suffix). These package types are operable over the following temperature ranges: Commercial (0 to 70°C); Industrial (–40 to +85°C); and Extended Industrial/Military (–55 to +125°C).

The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241, and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic packages (F3A suffix) and are operable over the –55 to +125°C temperature range.

The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output enables (10E\, 2OE\). The CD54/74AC/ACT241 has one active-LOW (10E\) and one active-HIGH (20E) output enable.

The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M and M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and the CD74ACT241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline packages (M and M96 suffixes), and 20-lead shrink small-outline packages (SM96 suffix). These package types are operable over the following temperature ranges: Commercial (0 to 70°C); Industrial (–40 to +85°C); and Extended Industrial/Military (–55 to +125°C).

The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241, and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic packages (F3A suffix) and are operable over the –55 to +125°C temperature range.

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Gleiche Funktionalität, gleiche Pinbelegung wie verglichener Baustein
SN74AHCT244 AKTIV Puffer mit 8 Kanälen, 4,5 bis 5,5 V und TTL-kompatiblen CMOS-Eingängen Larger voltage range (2V to 5.5V), higher average drive strength (8mA)

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 11
Typ Titel Datum
* Data sheet CD54/74AC240/241/244, CD54/74ACT240/241/244 datasheet (Rev. B) 19 Jan 2004
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

Das 14-24-LOGIC-EVM-Evaluierungsmodul (EVM) ist für die Unterstützung aller Logikgeräte konzipiert, die sich in einem 14-Pin- bis 24-Pin-D-, DW-, DB-, NS-, PW-, DYY- oder DGV-Gehäuse befinden.

Benutzerhandbuch: PDF | HTML
Simulationsmodell

CD74ACT244 Behavioral SPICE Model

SCHM057.ZIP (7 KB) - PSpice Model
Gehäuse Pins Herunterladen
PDIP (N) 20 Optionen anzeigen
SOIC (DW) 20 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos