Startseite Sensoren Temperatursensoren Digitale Temperatursensoren
Startseite
Sensoren
Temperatursensoren
Digitale Temperatursensoren

TMP144

AKTIV

Energieeffizienter digitaler Temperatursensor mit SMAART Wire™-/UART-Schnittstelle

Jetzt bestellen
Datenblatt

TMP144

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.4 Interface type UART Supply voltage (max) (V) 3.6 Features Daisy chain Supply current (max) (µA) 3 Temp resolution (max) (Bits) 12 Remote channels (#) 0 Addresses 16 Rating Catalog TI functional safety category Functional Safety-Capable
Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.4 Interface type UART Supply voltage (max) (V) 3.6 Features Daisy chain Supply current (max) (µA) 3 Temp resolution (max) (Bits) 12 Remote channels (#) 0 Addresses 16 Rating Catalog TI functional safety category Functional Safety-Capable
DSBGA (YBK) 4 0.8 mm² 1 x 0.8 DSBGA (YFF) 4 1 mm² 1 x 1 PICOSTAR (YMT) 4 0.5776 mm² 0.76 x 0.76
  • Multiple Device Access (MDA):
    • Global read/write operations
  • SMAART Wire™ / UART interface
  • Resolution: 12-bit or 0.0625°C
  • ±1°C maximum (–10°C to +100°C)
  • ±2°C maximum (–40°C to +125°C)
  • Low quiescent current:
    • 3-µA active I Q at 0.25 Hz
    • 0.6-µA shutdown
  • Supply range: 1.4 V to 3.6 V
  • Push-pull digital output
  • Package:
    • 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
    • 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
    • 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)
  • Multiple Device Access (MDA):
    • Global read/write operations
  • SMAART Wire™ / UART interface
  • Resolution: 12-bit or 0.0625°C
  • ±1°C maximum (–10°C to +100°C)
  • ±2°C maximum (–40°C to +125°C)
  • Low quiescent current:
    • 3-µA active I Q at 0.25 Hz
    • 0.6-µA shutdown
  • Supply range: 1.4 V to 3.6 V
  • Push-pull digital output
  • Package:
    • 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
    • 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
    • 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)

The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.

The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.

The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.

The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.

The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.

The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.
open-in-new Andere Digitale Temperatursensoren suchen
Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 5
Typ Titel Datum
* Data sheet TMP144 Low-Power, Digital Temperature Sensor With SMAART Wire™ / UART Interface datasheet (Rev. C) PDF | HTML 15 Mär 2023
Application note How to Read and Interpret Digital Temperature Sensor Output Data PDF | HTML 12 Apr 2024
Application note Under-Component Monitoring With Ultra-Small Temperature Sensors (Rev. A) PDF | HTML 21 Apr 2023
Application brief Efficient Cold Chain Management With Scalable High-Accuracy Temperature Sensors (Rev. A) PDF | HTML 11 Dez 2020
Application note How to Boost Your CPU, GPU, and SoC Performance Through Thermal Accuracy PDF | HTML 22 Sep 2020

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TMP144EVM — TMP144 energieeffizienter digitaler Temperatursensor mit SMAART Wire™-Schnittstelle – Evaluierungsmo

The TMP144 digital output temperature sensor is capable of reporting temperature with 0.0625°C resolution. The SMAART Wire™ Interface supports up to 16 devices connected serially in conjunction with a UART host. The TMP144EVM leverages the MSP430F5528 to create a USB-to-SMAART Wire(TM) (...)
Benutzerhandbuch: PDF
Optionen anzeigen
Gehäuse Pins Herunterladen
DSBGA (YBK) 4 Optionen anzeigen
DSBGA (YFF) 4 Optionen anzeigen
PICOSTAR (YMT) 4 Optionen anzeigen
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos