Produktdetails

Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) to
Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) to
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 5 V, SE
    • 250 mW at VDD = 3.3 V, BTL
    • 75 mW at VDD = 3.3 V, SE
  • Shutdown Control
    • IDD = 7 µA at 3.3 V
    • IDD = 60 µA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface Mount Packaging
    • SOIC
    • PowerPADTM MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 5 V, SE
    • 250 mW at VDD = 3.3 V, BTL
    • 75 mW at VDD = 3.3 V, SE
  • Shutdown Control
    • IDD = 7 µA at 3.3 V
    • IDD = 60 µA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface Mount Packaging
    • SOIC
    • PowerPADTM MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Drop-In-Ersatz mit verbesserter Funktionalität im Gegensatz zum verglichenen Baustein
TPA301 AKTIV Class-AB-Audioverstärker, 350 mW, Mono Ultra-low quiescent current in shutdown mode (0.15 µA)

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 4
Typ Titel Datum
* Data sheet 350-mW Low-Voltage Audio Power Amplifier datasheet (Rev. C) 02 Mai 2003
Application note PowerPAD™ Thermally Enhanced Package (Rev. H) 06 Jul 2018
EVM User's guide TPA311EVM - User Guide (Rev. A) 17 Apr 2001
User guide TPA311MSOPEVM - User Guide (Rev. A) 17 Apr 2001

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Gehäuse Pins Herunterladen
HVSSOP (DGN) 8 Optionen anzeigen
SOIC (D) 8 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos