Gehäuseinformationen
| Gehäuse | Pins HTSSOP (PWP) | 16 |
| Betriebstemperaturbereich (°C) -40 to 125 |
| Gehäusemenge | Träger 3.000 | LARGE T&R |
Merkmale von TPS1HB08-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Withstands 40-V load dump
- Functional safety
capable
- Documentation available to aid functional safety system design
- Single-channel smart high-side switch with 8-mΩ RON (TJ = 25°C)
- Improve system level reliability through adjustable current limiting
- Current limit set-point from 6.4 A to 70 A
- Version F: 94 A fixed ILIM
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short to ground and battery
- Protection against reverse battery events including automatic switch on of FET with reverse voltage
- Automatic shut off on loss of battery and ground
- Integrated output clamp to demagnetize inductive loads
- Configurable fault handling
- Analog sense output can be configured to
accurately measure:
- Load current
- Device temperature
- Provides fault indication through SNS pin
or FLT pin
- Detection of open load and short-to-battery
Beschreibung von TPS1HB08-Q1
The TPS1HB08-Q1 device is a smart high-side switch intended for use in 12-V automotive systems. The device integrates robust protection and diagnostic features to ensure output port protection even during harmful events like short circuits in automotive systems. The device protects against faults through a reliable current limit, which, depending on device variant, is adjustable from 6.4 A to 70 A or set at 94 A. The high current limit range allows for usage in loads that require large transient currents, while the low current limit range provides improved protection for loads that do not require high peak current. The device is capable of reliably driving a wide range of load profiles.
The TPS1HB08-Q1 also provides a high accuracy analog current sense that allows for improved load diagnostics. By reporting load current and device temperature to a system MCU, the device enables predictive maintenance and load diagnostics that improves the system lifetime.
The TPS1HB08-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.