NEU

TX73L64

AKTIV

3-stufiger 1-A-Impulsgeber mit 64 Kanälen sowie integriertem Übertragungs-Strahlformer und rauscharm

Produktdetails

Device type Transmitter Number of input channels 64 Active supply current (typ) (mA) 20 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
Device type Transmitter Number of input channels 64 Active supply current (typ) (mA) 20 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
FCCSP (ACP) 196 144 mm² 12 x 12
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 2.8mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 22Ω
    • Turn on and Turn off time: 100ns
    • 2:1 Channel Muxing to LNA input
  • LNA
    • Supports a maximum input swing of 500mVpp
    • Gain of 24dB
    • HD2 of -55 dBc and HD3 of 40dBc at 5MHz
    • Programmable input impedance to match source impedance 100, 200. 400 and 800Ω with DTGC support
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 2.8mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 22Ω
    • Turn on and Turn off time: 100ns
    • 2:1 Channel Muxing to LNA input
  • LNA
    • Supports a maximum input swing of 500mVpp
    • Gain of 24dB
    • HD2 of -55 dBc and HD3 of 40dBc at 5MHz
    • Programmable input impedance to match source impedance 100, 200. 400 and 800Ω with DTGC support
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch

TX73L64 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches), 32 LNA circuits, and supports on-chip beamformer (TxBF). The T/R switches also perform a 2:1 multiplexing operation to multiplex inputs of 2 channels to 1 LNA. The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX73L64 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter device for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

TX73L64 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches), 32 LNA circuits, and supports on-chip beamformer (TxBF). The T/R switches also perform a 2:1 multiplexing operation to multiplex inputs of 2 channels to 1 LNA. The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX73L64 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter device for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

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Typ Titel Datum
* Data sheet TX73L64 3-Level, 64-Channel Transmitter with On-Chip Beamformer, T/R Switch, 32- Channel Multiplexed Receivers with LNA datasheet PDF | HTML 29 Apr 2025
Application note An Overview of TI's Transmitter Products for Ultrasound Applications PDF | HTML 08 Jul 2025
Certificate TX73L64EVM EU Declaration of Conformity (DoC) 28 Feb 2025

Design und Entwicklung

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Evaluierungsplatine

TX73L64EVM — TX73L64 – Evaluierungsmodul

TX73L64EVM wird zur Evaluierung des Bausteins TX73L64 mit verschiedenen Antriebsstärken, Spannungspegeln und Modi des Bausteins verwendet. Das Evaluierungsmodul umfasst alle erforderlichen Steuersignale und eine integrierte Stromerzeugung, was den Bedarf an externen Geräten reduziert. Das (...)
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Produkte
Ultraschall-AFEs
TX73L64 3-stufiger 1-A-Impulsgeber mit 64 Kanälen sowie integriertem Übertragungs-Strahlformer und rauscharm
Hardware-Entwicklung
Evaluierungsplatine
TX73L64EVM TX73L64 – Evaluierungsmodul
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