MSP430FR5734

ACTIVO

MCU de 24 MHz con 8 KB FRAM, 1 KB SRAM, ADC de 10 bits, comparador, UART/SPI/I2C, temporizador

Detalles del producto

CPU MSP430 Frequency (MHz) 24 Flash memory (kByte) 8 RAM (kByte) 1 ADC type 10-bit SAR Features DMA, Real-time clock UART 1 Number of ADC channels 8 SPI 2 USB No Hardware accelerators 0 Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Nonvolatile memory (kByte) 8 Number of GPIOs 21 Number of I2Cs 1 Security Secure debug, Secure storage
CPU MSP430 Frequency (MHz) 24 Flash memory (kByte) 8 RAM (kByte) 1 ADC type 10-bit SAR Features DMA, Real-time clock UART 1 Number of ADC channels 8 SPI 2 USB No Hardware accelerators 0 Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Nonvolatile memory (kByte) 8 Number of GPIOs 21 Number of I2Cs 1 Security Secure debug, Secure storage
TSSOP (PW) 28 62.08 mm² 9.7 x 6.4
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 24-MHz Clock
    • Wide Supply Voltage Range (2 V to 3.6 V)
    • –40°C to 85°C Operation
  • Optimized Ultra-Low-Power Modes
    • Active Mode: 81.4 µA/MHz (Typical)
    • Standby (LPM3 With VLO): 6.3 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5 With Crystal): 1.5 µA (Typical)
    • Shutdown (LPM4.5): 0.32 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 16KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (16KB in 1 ms)
    • Built-In Error Correction Coding (ECC) and Memory Protection Unit (MPU)
    • Universal Memory = Program + Data + Storage
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal DMA
    • Real-Time Clock (RTC) With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to Three Capture/Compare Registers
    • 16-Bit Cyclic Redundancy Checker (CRC)
  • High-Performance Analog
    • 16-Channel Analog Comparator With Voltage Reference and Programmable Hysteresis
    • 12-Channel 10-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold
      • 200 ksps at 100-µA Consumption
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI
    • eUSCI_B0 Supports:
      • I2C With Multiple-Slave Addressing
      • SPI
    • Hardware UART Bootloader (BSL)
  • Power Management System
    • Fully Integrated LDO
    • Supply Voltage Supervisor for Core and Supply Voltages With Reset Capability
    • Always-On Zero-Power Brownout Detection
    • Serial Onboard Programming With No External Voltage Needed
  • Flexible Clock System
    • Fixed-Frequency DCO With Six Selectable Factory-Trimmed Frequencies (Device Dependent)
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
  • Family Members
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 24-MHz Clock
    • Wide Supply Voltage Range (2 V to 3.6 V)
    • –40°C to 85°C Operation
  • Optimized Ultra-Low-Power Modes
    • Active Mode: 81.4 µA/MHz (Typical)
    • Standby (LPM3 With VLO): 6.3 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5 With Crystal): 1.5 µA (Typical)
    • Shutdown (LPM4.5): 0.32 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 16KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (16KB in 1 ms)
    • Built-In Error Correction Coding (ECC) and Memory Protection Unit (MPU)
    • Universal Memory = Program + Data + Storage
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal DMA
    • Real-Time Clock (RTC) With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to Three Capture/Compare Registers
    • 16-Bit Cyclic Redundancy Checker (CRC)
  • High-Performance Analog
    • 16-Channel Analog Comparator With Voltage Reference and Programmable Hysteresis
    • 12-Channel 10-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold
      • 200 ksps at 100-µA Consumption
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI
    • eUSCI_B0 Supports:
      • I2C With Multiple-Slave Addressing
      • SPI
    • Hardware UART Bootloader (BSL)
  • Power Management System
    • Fully Integrated LDO
    • Supply Voltage Supervisor for Core and Supply Voltages With Reset Capability
    • Always-On Zero-Power Brownout Detection
    • Serial Onboard Programming With No External Voltage Needed
  • Flexible Clock System
    • Fixed-Frequency DCO With Six Selectable Factory-Trimmed Frequencies (Device Dependent)
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
  • Family Members

The TI MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

The TI MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet MSP430FR573x Mixed-Signal Microcontrollers datasheet (Rev. L) PDF | HTML 05 dic 2017
* Errata MSP430FR5734 Microcontroller Errata (Rev. AG) PDF | HTML 21 oct 2021
* User guide MSP430FR57xx Family User's Guide (Rev. D) 14 mar 2018
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. B) PDF | HTML 02 jun 2025
White paper Low-Power FRAM Microcontrollers and Their Applications (Rev. A) PDF | HTML 18 sep 2023
Application note Design Considerations When Using the MSP430 Graphics Library (Rev. A) PDF | HTML 09 ago 2023
Application note ESD Diode Current Specification (Rev. B) PDF | HTML 23 ago 2021
Application note MSP430 FRAM Technology – How To and Best Practices (Rev. B) 12 ago 2021
Application note Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B) PDF | HTML 02 ago 2021
Application note MSP430 System-Level ESD Considerations (Rev. B) PDF | HTML 14 jul 2021
User guide MSP430 MCUs Development Guide Book (Rev. A) PDF | HTML 13 may 2021
Application note MSP430 System ESD Troubleshooting Guide PDF | HTML 13 dic 2019
Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) PDF | HTML 01 abr 2016
Functional safety information Safety Manual for MSP430G2xx, F5xx, and FR57xx in IEC 60730 Safety Applications (Rev. A) 12 ene 2016
Application note MSP Code Protection Features PDF | HTML 07 dic 2015
White paper Crypto-Bootloader - Secure In-Field Firmware Updates for Ultra-Low Power MCUs 19 ago 2015
Application note Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A) 02 mar 2015
Application note Maximizing Write Speed on the MSP430™ FRAM (Rev. B) 04 feb 2015
White paper Industrial Communications Solutions Featuring MSP Microcontrollers 26 ene 2015
White paper Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers 15 sep 2014
White paper System advantages of mixed signal integration 17 jun 2014
Application note MSP430 FRAM Quality and Reliability (Rev. A) 01 may 2014
White paper FRAM FAQs 23 abr 2014
White paper RF430FRL152H Novel Ferroelectric RAM Memory NFC Embedded Tag Based Sensors 30 nov 2012
White paper Benchmarking MCU power consumption for ultra-low-power applications 26 oct 2012
Application note Design Considerations When Using the MSP430 Graphics Library 05 oct 2012
Application note Migrating from the USCI Module to the eUSCI Module (Rev. A) 13 sep 2012
White paper Microcontrollers in Optical Networking 21 ago 2012
White paper Power Management Solutions for Ultra-Low-Power 16-Bit MSP430 MCUs (Rev. D) 28 mar 2012
Application note Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A) 16 feb 2012
White paper Low-Power FRAM Microcontrollers and Their Applications 14 jul 2011
White paper Ultra-low power consumption MSP430FR57xx with FRAM memory 12 abr 2011

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Ejemplo de código o demostración

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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (PW) 28 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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