Inicio Microcontroladores (MCU) y procesadores Microprocesadores y DSP Sistemas automotrices SoC de asistencia al conductor
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Microcontroladores (MCU) y procesadores
Microprocesadores y DSP
Sistemas automotrices SoC de asistencia al conductor

TDA3MA

ACTIVO

SoC con procesamiento completo de baja potencia, con aceleración de visión para aplicaciones ADAS

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TDA3MA

ACTIVO
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Detalles del producto

Coprocessors 2 Arm Cortex-M4 Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE) Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
Coprocessors 2 Arm Cortex-M4 Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE) Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCBGA (ABF) 367 225 mm² (15 mm × 15 mm)
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. H) PDF | HTML 4/02/2020
* Guía del usuario TDA3x Technical Reference Manual (Rev. D) 29/07/2019
* Errata TDA3x SoC for Advanced Driver Assistance Systems (ADAS) (SR 1.0, 1.0A) (Rev. F) 1/10/2019
Guía del usuario Single LP8733-Q1 User's Guide to Power DRA78x and TDA3 (Rev. A) PDF | HTML 31/03/2021
Informe Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 24/07/2020
Nota sobre la aplicación AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 6/01/2020
Nota sobre la aplicación TDA2x/TDA2E Performance (Rev. A) PDF | HTML 10/06/2019
Nota sobre la aplicación TDA3xx Tester On Chip (TESOC) (Rev. A) 19/10/2018
Nota sobre la aplicación ECC/EDC on TDAxx (Rev. B) 13/06/2018
Nota sobre la aplicación TMS320C66x XMC Memory Protection 31/01/2018
Nota sobre la aplicación DSS Bit Exact Output (Rev. A) 12/01/2018
Nota sobre la aplicación Flashing Utility - mflash 9/01/2018
Informe Embedded low-power deep learning with TIDL 8/12/2017
Nota sobre la aplicación Dynamic Backup Lines PDF | HTML 14/11/2017
Nota sobre la aplicación Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 7/11/2017
Nota sobre la aplicación A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 3/11/2017
Nota sobre la aplicación DSS BT656 Workaround for TDA2x (Rev. A) 3/11/2017
Información sobre seguridad funcional Safety Features on VisionSDK 26/10/2017
Nota sobre la aplicación IISS Image Pipe for Alternate CFA Formats 16/08/2017
Información sobre seguridad funcional Safety Manual for TDA3x Automotive Vision Safety Critical Applications Processor 18/07/2017
Nota sobre la aplicación Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 15/12/2016
Nota sobre la aplicación Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 23/08/2016
Nota sobre la aplicación ADC as Voltage Monitoring in TDA3x 20/06/2016
Nota sobre la aplicación TDA3xx ISS Tuning and Debug Infrastructure 2/06/2016
Nota sobre la aplicación ADAS Power Management 7/03/2016
Informe Multicore SoCs stay a step ahead of SoC FPGAs 23/02/2016
Nota sobre la aplicación TDA3x Error Signaling Module (ESM) 26/01/2016
Informe Surround view camera systems for ADAS (Rev. A) 20/10/2015
Nota sobre la aplicación Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 13/08/2014
Informe TI Vision SDK, Optimized Vision Libraries for ADAS Systems 14/04/2014
Informe TI Gives Sight to Vision-Enabled Automotive Technologies 16/10/2013
Informe Empowering Automotive Vision with TI’s Vision AccelerationPac 13/10/2013

Diseño y desarrollo

Soluciones de alimentación

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Placa de evaluación

D3-3P-RVP-TDA3X — Kit del desarrollador RVP-TDA3x de D3 Embedded para procesadores TDA3

La RVP-TDA3x es una plataforma multicámara para sistemas avanzados de asistencia al conductor (ADAS) de bajo costo. Incluye el Pac de aceleración de visión (EVE) y cuenta con un ISP (procesador de señal de imagen) integrado. No incluye un núcleo ARM ni un CÓDEC. El kit de desarrollo admite cuatro (...)

Desde: D3 Embedded
Productos y hardware compatibles
Kit de desarrollo

D3-3P-TDA3X-SK — Kit de inicio de automoción DesignCore® D3 Embedded TDA3x para procesadores TDA3

Este kit de inicio de sobremesa le permite evaluar la tecnología integrada de los sistemas avanzados de asistencia al conductor (ADAS) en una plataforma electrónica que se diseñó teniendo en cuenta la producción. Basado en el procesador de visión avanzada TDA3x de Texas Instruments, este kit (...)

Desde: D3 Embedded
Productos y hardware compatibles
Sonda de depuración

LB-3P-TRACE32-DSP — Sistema de depuración y seguimiento Lauterbach TRACE32 para procesadores de señales digitales (DSP)

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)

Desde: Lauterbach GmbH
Productos y hardware compatibles
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

El procesador SDK-Vision (kit de desarrollo de software [SDK] Vision) y el procesador SDK-Radar (SDK Radar) son kits de desarrollo de software multiprocesador para procesadores TDAX. El marco de software permite a los usuarios crear diferentes flujos de datos de aplicaciones de sistemas avanzados (...)

Productos y hardware compatibles
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

El procesador SDK-Vision (kit de desarrollo de software [SDK] Vision) y el procesador SDK-Radar (SDK Radar) son kits de desarrollo de software multiprocesador para procesadores TDAX. El marco de software permite a los usuarios crear diferentes flujos de datos de aplicaciones de sistemas avanzados (...)

Productos y hardware compatibles
IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

Productos y hardware compatibles
IDE, configuración, compilador o depurador

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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Sistema operativo (SO)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

The QNX Neutrino® Realtime Operating System (RTOS) is a full-featured and robust RTOS designed to enable the next-generation of products for automotive, medical, transportation, military and industrial embedded systems. Microkernel design and modular architecture enable customers to create (...)
Desde: QNX
Productos y hardware compatibles
Soporte de software

VCTR-3P-MICROSAR — Software de vector MICROSAR AUTOSAR para microcontroladores y computadoras de alto rendimiento (H

Las familias de productos MICROSAR y DaVinci simplifican el desarrollo de unidades de control electrónico (ECU) con software sofisticados integrados y herramientas de desarrollo poderosas para microcontroladores y HPC. Con el software de infraestructura avanzado, puede crear una base óptima para (...)

Desde: Vector Informatik GmbH
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Modelo de simulación

TDA3x BSDL Model

SPRM714.ZIP (9 KB) - Modelo BSDL
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Modelo de simulación

TDA3x IBIS Model

SPRM702.ZIP (10940 KB) - Modelo IBIS
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Modelo de simulación

TDA3x Thermal Model

SPRM701.ZIP (1 KB) - Modelo térmico
Productos y hardware compatibles
Herramienta de cálculo

CLOCKTREETOOL — Herramienta de árbol de reloj para Sitara, automoción, análisis de visión y procesadores de señal di

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:

  • Visualize the device clock tree
  • Interact with clock tree (...)
Productos y hardware compatibles
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCBGA (ABF) 367 Ultra Librarian
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