홈 무선 커넥티비티 Wi-Fi 제품
홈
무선 커넥티비티
Wi-Fi 제품

CC2564

활성

EDR(Enhanced Data Rate), LE(Low Energy) 및 ANT를 지원하는 Bluetooth ® 4.0

지금 주문
데이터시트

CC2564

활성
데이터시트 지금 주문

제품 상세 정보

Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -40 to 85 Rating Catalog
Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -40 to 85 Rating Catalog
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.
open-in-new 기타 Wi-Fi 제품 찾기
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기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기32
유형 직함 날짜
* Data sheet CC256x Dual-Mode Bluetooth Controller datasheet (Rev. E) PDF | HTML 2014/03/12
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 2022/10/20
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022/05/13
Application note DN035 -- Antenna Quick Guide (Rev. B) 2022/02/09
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020/05/18
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020/05/18
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019/01/07
Application note CC2564 HFP/HID/SPP Integration Demonstration 2018/11/20
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 2017/10/16
White paper Which TI Bluetooth® solution should I choose? 2017/05/05
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 2017/05/04
Technical article Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 2016/12/13
Application note CC256XQFN PCB Guidelines (Rev. B) 2016/10/28
User guide CC256x Hardware Design Checklist (Rev. A) 2016/10/28
Technical article Driving industrial markets with TI’s dual-mode Bluetooth® module PDF | HTML 2016/05/05
Technical article The dual-mode Bluetooth® module you’ve been waiting for is here PDF | HTML 2016/02/17
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 2016/02/03
Technical article A training solution for serious athletes? WHOOP, there it is! PDF | HTML 2016/01/04
User guide Dual-Mode Bluetooth CC2564 Evaluation Board User Guide 2015/12/28
Technical article TI DLP® NIRscan™ Nano Evaluation Module has answers to your handheld near-infrared PDF | HTML 2015/10/02
User guide Dual-Mode Bluetooth CC2564 Evaluation Board Quick Start Guide 2015/10/01
Technical article IML is taking Bluetooth to new heights without leaving the ground PDF | HTML 2015/09/24
Technical article Three reasons why our dual-mode Bluetooth stack is your new go-to software solutio PDF | HTML 2015/08/17
Technical article Understanding wireless connectivity in industrial IoT applications PDF | HTML 2015/08/04
E-book Understanding Wireless Connectivity in the Industrial IoT 2015/07/22
User guide Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board 2015/07/07
User guide CC2564MODA Evaluation Board Quick Start Guide 2015/07/01
User guides CC256x QFN EM User Guide Wiki 2015/06/16
White paper Three Flavors of Bluetooth: Which One to Choose? 2014/03/25
More literature TI: The IoT technology leader 2013/11/01
More literature The Evolution of the Internet of Things 2013/09/09
Application note AN058 -- Antenna Selection Guide (Rev. B) 2010/10/06

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

BOOST-CC2564MODA — TMP107 온도 센서 데이지 체인 BoosterPack™ 플러그인 모듈

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

사용 설명서: PDF
TI.com에서 구매할 수 없습니다
평가 보드

CC2564MODAEM — 통합 안테나 평가 보드를 갖춘 듀얼 모드 Bluetooth® CC2564 모듈

The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.


For a complete evaluation solution, (...)

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없습니다
평가 보드

CC2564MODNEM — 듀얼 모드 Bluetooth® CC2564 모듈 평가 보드

The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.

For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)

사용 설명서: PDF
TI.com에서 구매할 수 없습니다
평가 보드

CC256XQFNEM — 듀얼 모드 Bluetooth® CC2564 평가 보드

CC256XQFNEM 평가 보드는 CC2564B 장치를 포함하고 있으며 CC256x 장치의 평가 및 설계 목적으로 설계되었습니다.

완벽한 평가 솔루션을 위해 CC256XQFNEM 보드는 TI 하드웨어 개발 키트에 직접 연결됩니다. MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X 및 기타 MCU. 또한 MSP430(CC256XMSPBTBLESW), TM4C12x MCU(CC256XM4BTBLESW) 및 기타 MCU(CC256XSTBTBLESW)에 대해 인증되고 로열티가 없는 TI Bluetooth (...)

사용 설명서: PDF
TI.com에서 구매할 수 없습니다
평가 보드

EK-TM4C129EXL — IoT 애플리케이션을 위한 ARM® Cortex®-M4F 기반 MCU TM4C129E 암호화 커넥티드 LaunchPad™

Powered by hardware encryption accelerator-enabled MCUs, the  Crypto Connected LaunchPad enables you to develop high performance, data protected, connected IoT applications from secure cloud connection, building/factory automation and smart grid to industrial controls.

The TM4C129E Crypto Connected (...)

사용 설명서: PDF
TI.com에서 구매할 수 없습니다
인터페이스 어댑터

CC256XSTBTBLESW — STM32F4 MCU의 TI 듀얼 모드 Bluetooth® 스택

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)

사용 설명서: PDF | HTML
옵션 보기
소프트웨어 개발 키트(SDK)

TIBLUETOOTHSTACK-SDK — TI 듀얼 모드 Bluetooth® 스택

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

사용 설명서: PDF | HTML
옵션 보기
드라이버 또는 라이브러리

CC256XM4BTBLESW — TM4C MCU에 대한 TI 듀얼 모드 Bluetooth® 스택

TI’s Dual-mode Bluetooth stack on TM4C MCUs software for Bluetooth + Bluetooth Low Energy enables the TM4C12x MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides (...)
사용 설명서: PDF
다운로드
드라이버 또는 라이브러리

CC256XMS432BTBLESW — MSP432 MCU의 TI 듀얼 모드 Bluetooth 스택

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
사용 설명서: PDF
다운로드
드라이버 또는 라이브러리

CC256XMSPBTBLESW — MSP430™ MCU에 있는 TI 듀얼 모드 Bluetooth® 스택

TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), (...)
사용 설명서: PDF
다운로드
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.
시작 다운로드 옵션
계산 툴

SWRC256 — CC256x Bluetooth 하드웨어 평가 툴

The CC256x Bluetooth Hardware Evaluation Tool is a Texas Instruments (TI) tool which can be downloaded as a complete package from the TI web site. It is a very intuitive, user-friendly tool to evaluate TI's Bluetooth chips. More specifically, it is used to configure the BT chip's properties (...)
옵션 보기
인증

CC256X-CERTIFICATION — 듀얼 모드 Bluetooth에 대한 무선 인증

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
옵션 보기
인증

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Wi-Fi 제품
CC2564 — EDR(Enhanced Data Rate), LE(Low Energy) 및 ANT를 지원하는 Bluetooth ® 4.0 CC2564C — BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy)를 지원하는 Bluetooth® 5.1 CC2564MODA — 안테나가 통합된 BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy) 모듈이 포함된 Bluetooth ® 4.1 CC2564MODN — BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy) 모듈이 포함된 Bluetooth ® 4.1
하드웨어 개발
BOOST-CC2564MODA — TMP107 온도 센서 데이지 체인 BoosterPack™ 플러그인 모듈 CC2564MODAEM — 통합 안테나 평가 보드를 갖춘 듀얼 모드 Bluetooth® CC2564 모듈 CC2564MODNEM — 듀얼 모드 Bluetooth® CC2564 모듈 평가 보드 CC256XCQFN-EM — CC2564C 듀얼 모드 Bluetooth® 컨트롤러 평가 모듈 CC256XQFNEM — 듀얼 모드 Bluetooth® CC2564 평가 보드
다운로드 옵션
설계 툴

3P-WIRELESS-MODULES — 타사 무선 모듈 검색 툴

타사 무선 모듈 검색 툴은 개발자가 완제품 사양을 충족하는 제품을 식별하고 생산 준비가 완료된 무선 모듈을 조달하는 데 유용합니다. 검색 툴에 포함되어 있는 타사 모듈 공급업체는 TI 무선 연결 제품을 사용하여 무선 모듈을 설계 및 제조하는 전문성을 갖춘 독립 회사입니다.
다운로드
설계 툴

DUALMODE-BT-DESIGN-REVIEWS — CC256x 장치에 대한 하드웨어 설계 검토

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
사용 설명서: PDF
요청
회로도

CC256x Bluetooth Reference Design Design Files

TIDC065.ZIP (2429 KB)
다운로드
레퍼런스 디자인

BT-MSPAUDSINK-RD — Bluetooth 및 MSP430 오디오 싱크 레퍼런스 디자인

TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio (...)
사용 설명서: PDF
회로도: PDF
레퍼런스 디자인

CC256XEM-RD — CC256x Bluetooth® 레퍼런스 디자인

This CC256x Bluetooth® evaluation module reference design is an RF reference design with antenna which can be easily connected to many Microcontroller Units (MCUs), such as TI's MSP430 or Tiva C series MCUs. The reference design can be copied into your board, allowing for a cost-effective design (...)
사용 설명서: PDF
회로도: PDF
레퍼런스 디자인

TIDA-00598 — CC256X Bluetooth 컨트롤러를 위한 낮은 잡음과 작은 폼 팩터의 전원 관리 레퍼런스 설계

The TIDA-00598 features a low noise and size optimized power management solution which regulates 5V to 3.3V and 1.8V required to operate the CC256X Bluetooth controller.  These regulated voltage rails can also be used to power other components in the system as microcontroller, level shifters (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

BT-MSPAUDSOURCE-RD — Bluetooth 및 MSP MCU 오디오 소스 레퍼런스 디자인

The Bluetooth and low-power MSP microcontroller Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference (...)
사용 설명서: PDF
회로도: PDF
패키지 핀 다운로드
VQFNP-MR (RVM) 76 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
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