CDCV855은(는) 새 설계에 권장하지 않습니다.
이 제품은 기존 고객을 위해 계속 제공됩니다. 새로운 설계는 대체 제품을 고려해야 합니다.
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CDCVF855 활성 2.5V 위상 잠금 루프 DDR 클록 드라이버 Can achieve wider frequency ranges

제품 상세 정보

Core supply voltage (V) 2.5 Output skew (ps) 50 Operating temperature range (°C) -40 to 85 Rating Catalog
Core supply voltage (V) 2.5 Output skew (ps) 50 Operating temperature range (°C) -40 to 85 Rating Catalog
TSSOP (PW) 28 62.08 mm² 9.7 x 6.4
  • Phase-Lock Loop Clock Driver for Double Data-Rate Synchronous DRAM Applications
  • Spread Spectrum Clock Compatible
  • Operating Frequency: 60 MHz to 180 MHz
  • Low Jitter (cyc–cyc): ±50 ps
  • Distributes One Differential Clock Input to Four Differential Clock Outputs
  • Enters Low Power Mode and Three-State Outputs When Input CLK Signal Is Less Than 20 MHz or PWRDWN Is Low
  • Operates From Dual 2.5-V Supplies
  • 28-Pin TSSOP Package
  • Consumes < 200-µA Quiescent Current
  • External Feedback PIN (FBIN, FBIN\) Are Used to Synchronize the Outputs to the Input Clocks

  • Phase-Lock Loop Clock Driver for Double Data-Rate Synchronous DRAM Applications
  • Spread Spectrum Clock Compatible
  • Operating Frequency: 60 MHz to 180 MHz
  • Low Jitter (cyc–cyc): ±50 ps
  • Distributes One Differential Clock Input to Four Differential Clock Outputs
  • Enters Low Power Mode and Three-State Outputs When Input CLK Signal Is Less Than 20 MHz or PWRDWN Is Low
  • Operates From Dual 2.5-V Supplies
  • 28-Pin TSSOP Package
  • Consumes < 200-µA Quiescent Current
  • External Feedback PIN (FBIN, FBIN\) Are Used to Synchronize the Outputs to the Input Clocks

The CDCV855 is a high-performance, low-skew, low-jitter zero delay buffer that distributes a differential clock input pair (CLK, CLK\) to four differential pairs of clock outputs (Y[0:3], Y[0:3]\) and one differential pair of feedback clock outputs (FBOUT, FBOUT\). When PWRDWN\ is high, the outputs switch in phase and frequency with CLK. When PWRDWN\ is low, all outputs are disabled to a high-impedance state (3-state), and the PLL is shut down (low-power mode). The device also enters this low-power mode when the input frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input frequency detection circuit detects the low-frequency condition and after applying a >20-MHz input signal this detection circuit turns on the PLL again and enables the outputs.

When AVDD is tied to GND, the PLL is turned off and bypassed for test purposes. The CDCV855 is also able to track spread spectrum clocking for reduced EMI.

Since the CDCV855 is based on PLL circuitry, it requires a stabilization time to achieve phase-lock of the PLL. This stabilization time is required following power up. The CDCV855 is characterized for both commercial and industrial temperature ranges.

The CDCV855 is a high-performance, low-skew, low-jitter zero delay buffer that distributes a differential clock input pair (CLK, CLK\) to four differential pairs of clock outputs (Y[0:3], Y[0:3]\) and one differential pair of feedback clock outputs (FBOUT, FBOUT\). When PWRDWN\ is high, the outputs switch in phase and frequency with CLK. When PWRDWN\ is low, all outputs are disabled to a high-impedance state (3-state), and the PLL is shut down (low-power mode). The device also enters this low-power mode when the input frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input frequency detection circuit detects the low-frequency condition and after applying a >20-MHz input signal this detection circuit turns on the PLL again and enables the outputs.

When AVDD is tied to GND, the PLL is turned off and bypassed for test purposes. The CDCV855 is also able to track spread spectrum clocking for reduced EMI.

Since the CDCV855 is based on PLL circuitry, it requires a stabilization time to achieve phase-lock of the PLL. This stabilization time is required following power up. The CDCV855 is characterized for both commercial and industrial temperature ranges.

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기술 자료

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유형 직함 날짜
* Data sheet 2.5-V Phase-Lock Loop Clock Driver datasheet (Rev. A) 2002/12/12

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치