DP83816
- IEEE 802.3 Compliant, PCI V2.2 Media Access
Controller (MAC) and Bus Interface Unit (BIU)
Supports Traditional Data Rates of 10 Mb/s
Ethernet and 100 Mb/s Fast Ethernet (Through
Internal PHY) - Bus Master – Burst Sizes of up to 128 Dwords
(512 Bytes) - BIU Compliant With PC 97 and PC 98 Hardware
Design Guides, PC 99 Hardware Design Guide
Draft, ACPI v1.0, PCI Power Management
Specification v1.1, OnNow Device Class Power
Management Reference Specification – Network
Device Class v1.0a - Wake on LAN (WoL) Support Compliant With
PC98, PC99, SecureOn, and OnNow, Including
Directed Packets, Magic Packet™ VLAN Packets,
ARP Packets, Pattern Match Packets, and PHY
Status Change - Clkrun Function for PCI Mobile Design Guide
- Virtual LAN (VLAN) and Long Frame Support
- Support for IEEE 802.3× Full-Duplex Flow Control
- Extremely Flexible Rx Packet Filtration Including:
Single Address Perfect Filter With MSb Masking,
Broadcast, 512 Entry Multicast and Unicast Hash
Table, Deep Packet Pattern Matching for up to
Four Unique Patterns - Statistics Gathered for Support of RFC 1213
(MIB II), RFC 1398 (Ether-Like MIB), IEEE 802.3
LME, Reducing CPU Overhead for Management - Internal 2KB Transmit and 2KB Receive Data
FIFOs - Serial EEPROM Port With Auto-Load of
Configuration Data From EEPROM at Power On - Flash or PROM Interface for Remote Boot Support
- Fully Integrated IEEE 802.3 3.3-V CMOS Physical
Layer - IEEE 802.3 10BASE-T Transceiver With Integrated
Filters IEEE 802.3u 100BASE-TX Transceiver - Fully integrated ANSI X3.263 Compliant TP-PMD
Physical Sublayer With Adaptive Equalization and
Baseline Wander Compensation - IEEE 802.3u Auto-Negotiation – Advertised
Features Configurable Through EEPROM - Full-Duplex Support for 10- and 100-Mb/s Data
Rates - Single 25-MHz Reference Clock
- 144-pin LQFP Package
- Low-Power 3.3-V CMOS Design With Typical
Consumption of 383 mW Operating, 297 mW
During WoL, and 53 mW During Sleep Mode - IEEE 802.3u MII for Connecting Alternative
External Physical Layer Devices - 3.3-V Signaling With 5-V Tolerant I/O
The DP83816 device is a single-chip 10/100 Mb/s ethernet controller for the PCI bus. It is targeted at low-cost, high-volume PC motherboards, adapter cards, and embedded systems. The DP83816 device fully implements the V2.2 33-MHz PCI bus interface for host communications with power management support. Packet descriptors and data are transferred via bus-mastering, reducing the burden on the host CPU. The DP83816 device can support full-duplex 10/100 Mb/s transmission and reception with minimum interframe gap.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Integrated PCI Ethernet Media Access Contrlr & Phy Layer (MacPhyter-II) datasheet (Rev. E) | 2015/12/31 | |
User guide | DP83816-MAAP User Guide | 2012/02/23 | ||
Application note | AN-1351 MAC Address Programming for DP83816 MacPHYTER-II and DP83815 MacPHYTER | 2005/01/05 | ||
Application note | AN-1287 DP83815 MacPHYTER and DP83816 MacPHYTER-II High Data Rate Stress Testing | 2004/05/01 | ||
Application note | AN-1323 Updating DP83815 MacPHYTER Hardware Designs to DP83816 MacPHYTER-II | 2004/05/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ETHERNET-SW — 이더넷 PHY Linux 드라이버 및 툴
USB-2-MDIO 소프트웨어를 사용하면 디버그 및 프로토타이핑 중에 레지스터에 직접 액세스할 수 있습니다. 이 툴은 모든 TI 이더넷 PHY를 지원합니다.
드라이버 지원 활성화
"make menuconfig"로 커널 구성(또는 "make xconfig" 또는 "make nConfig" 사용)
Menuconfig 위치
// 부품 번호 기호와 (...)
SLLC425 — DP83816 'MacPHYTER II' Software Drivers & Utilities
USB-2-MDIO — USB-2-MDIO Tool v1.0
The USB-2-MDIO software tool lets Texas Instruments' Ethernet PHYs access the MDIO status and device control registers. The USB-2-MDIO tool includes a LaunchPad™ Development kit for TI's MSP430™ MCUs that is interfaced with a lightweight GUI. The (...)
지원되는 제품 및 하드웨어
제품
이더넷 PHY
하드웨어 개발
평가 보드
개발 키트
소프트웨어
드라이버 또는 라이브러리
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
패키지 | 핀 | 다운로드 |
---|---|---|
LQFP (PGE) | 144 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치