DS90CF384A
- 20 to 65 MHz Shift Clock Support
- 50% Duty Cycle on Receiver Output Clock
- Best-in-Class Set & Hold Times on RxOUTPUTs
- Rx Power Consumption <142 mW (typ) @65MHz Grayscale
- Rx Power-down Mode <200μW (max)
- ESD Rating >7 kV (HBM), >700V (EIAJ)
- Supports VGA, SVGA, XGA and Dual Pixel SXGA.
- PLL Requires no External Components
- Compatible with TIA/EIA-644 LVDS Standard
- Low Profile 56-lead or 48-lead Packages
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The DS90CF384A receiver converts the four LVDS data streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec bandwidth) back into parallel 28 bits of CMOS/TTL data (24 bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL). Also available is the DS90CF364A that converts the three LVDS data streams (Up to 1.3 Gbps throughput or 170 Megabytes/sec bandwidth) back into parallel 21 bits of CMOS/TTL data (18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both Receivers' outputs are Falling edge strobe. A Rising edge or Falling edge strobe transmitter (DS90C383A/DS90C363A) will interoperate with a Falling edge strobe Receiver without any translation logic.
The DS90CF384A / DS90CF364A devices are enhanced over prior generation receivers and provided a wider data valid time on the receiver output.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | DS90CF384A/364A 3.3V LVDS Rcvr 24Bit FPD Link 65MHz/18Bit FPD Link - 65 MHz datasheet (Rev. I) | 2013. 4. 19 | ||
| 애플리케이션 노트 | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018. 6. 29 | |||
| 애플리케이션 노트 | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017. 8. 8 | |||
| 애플리케이션 노트 | Receiver Skew Margin for Channel Link I and FPD Link I Devices | PDF | HTML | 2016. 1. 13 | ||
| 애플리케이션 노트 | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004. 5. 15 | |||
| 애플리케이션 노트 | AN-1056 STN Application Using FPD-Link | 2004. 5. 14 | |||
| 애플리케이션 노트 | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004. 5. 14 |
설계 및 개발
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FLINK3V8BT-85 — 시리얼라이저 및 디시리얼라이저 LVDS 장치의 FPD-Link 제품군용 평가 키트
The FPD-Link evaluation kit includes a transmitter (Tx) board, a receiver (Rx) board and interfacing cables. This kit shows the chipsets interfacing from test equipment or a graphics controller using low-voltage differential signaling (LVDS) to a receiver board.
The transmitter board accepts (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TSSOP (DGG) | 56 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.