DS90CR217
- 20 to 85 MHz Shift Clock Support
- 50% Duty Cycle on Receiver Output Clock
- Best-in-Class Set & Hold Times on TxINPUTs
- Low Power Consumption
- ±1V Common-Mode Range (Around +1.2V)
- Narrow Bus Reduces Cable Size and Cost
- Up to 1.785 Gbps Throughput
- Up to 223 Mbytes/sec Bandwidth
- 345 mV (typ) Swing LVDS Devices for Low EMI
- PLL Requires No External Components
- Rising Edge Data Strobe
- Compatible with TIA/EIA-644 LVDS Standard
- Low Profile 48-Lead TSSOP Package
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The DS90CR217 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. At a transmit clock frequency of 85 MHz, 21 bits of TTL data are transmitted at a rate of 595 Mbps per LVDS data channel. Using a 85 MHz clock, the data throughput is 1.785 Gbit/s (223 Mbytes/sec).
The narrow bus and LVDS signalling of the DS90CR217 is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | DS90CR217 +3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link - 85 MHz datasheet (Rev. A) | 2013/02/19 | |
| Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018/11/09 | ||
| Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016/01/13 | ||
| Application note | Improving the Robustness of Channel Link Designs with Channel Link II Ser/Des (Rev. A) | 2013/04/26 | ||
| Design guide | Channel Link I Design Guide | 2007/03/29 | ||
| Application note | Multi-Drop Channel-Link Operation | 2004/10/04 | ||
| Application note | CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications | 1998/10/05 |
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TSSOP (DGG) | 48 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치